• 한국공작기계학회논문집
• /
• 제10권1호
• /
• pp.71-77
• /
• 2001

Experimental study if die-sinking electrical discharge machining(EDM) was conducted with rotating electrode system including inside hole for increasing the material removal rate(MRR). With the help of dielectric fluid flow through the inside according to the different internal diameter of the hole, the molten workpiece debris could be removed and flushed out during the EDM, Cold die alloy(SKD-1) was executed for different peak current and duty factor. From this study, the MRR was found to be increased with the peak current. The more MRR was obtained for the case of electrode inside diam-eter of 10 mm, but the MRR was decreased as the diameter near at the 4mm and 6mm. The values of surface roughness and roundness were analyzed under various conditions, and these were affected by the inside diameter change of electrode.

• 한국정밀공학회지
• /
• 제22권10호
• /
• pp.90-98
• /
• 2005

A monitoring system is necessary to make the polishing process more reliable in order to ensure the high quality and performance of the final products. Generally, AE (Acoustic Emission) is known to be closely related to the material removal rate (MRR). As the surface becomes rougher, the MRR and AE increase. Therefore, the surface roughness can be indirectly estimated using the AE signal measured during the polishing. In this study, an AE sensor-based monitoring system was fabricated to detect the very small AE signal resulting from the friction between a tool and a workpiece during polishing. The performance of this monitoring system was estimated according to polishing conditions, the relation between the level of the AE RMS and the surface roughness during the polishing was investigated.

• Tribology and Lubricants
• /
• 제32권2호
• /
• pp.44-49
• /
• 2016

Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.

• 한국정밀공학회지
• /
• 제21권4호
• /
• pp.39-47
• /
• 2004

In mold machining, there are many concave machining regions where chatter and tool deflection occur since MRR(material removal rate) increases as curvature increases even though cutting speed and depth of cut are constant. Boolean operation between stock and tool model is widely used to compute MRR in NC milling simulation. In finish cutting, the side step is reduced to about 0.3mm and tool path length is sometimes over loom, so Boolean operation takes long computation time and includes much error if the resolution of stock and tool model is larger than the side step. In this paper, curvature of CL (cutter location) surface and side step of tool path is used to compute the feedrate for constant MRR machining. The data structure of CL surface is Z-map generated from NC tool path. The algorithm to get local curvature from discrete data was developed and applied to compute local curvature of CL surface. The side step of tool path was computed by point density map which includes cutter location point density at each grid element. The feedrate computed from curvature and side step is inserted to new tool path to regulate MRR. The resultants were applied to feedrate optimization system which generates new tool path with feedrate from NC codes for finish cutting. The system was applied to the machining of speaker and cellular phone mold. The finishing time was reduced to 12.6%, tool wear was reduced from 2mm to 1.1mm and chatter marks and over cut on corner were reduced, compared to the machining by constant feedrate. The machining time was shorter to 17% and surface quality and tool was also better than the conventional federate regulation using curvature of the tool path.

• Tribology and Lubricants
• /
• 제38권6호
• /
• pp.247-254
• /
• 2022

Chemical mechanical polishing (CMP) is a hybrid surface-polishing process that utilizes both mechanical and chemical energy. However, the recently emerging semiconductor substrate and thin film materials are challenging to process using the existing CMP. Therefore, previous researchers have conducted studies to increase the material removal rate (MRR) of CMP. Most materials studied to improve MRR have high hardness and chemical stability. Methods for enhancing the material removal efficiency of CMP include additional provision of electric, thermal, light, mechanical, and chemical energies. This study aims to introduce research trends on CMP using ultraviolet (UV) light to these methods to improve the material removal efficiency of CMP. This method, photocatalysis-assisted chemical mechanical polishing (PCMP), utilizes photocatalytic oxidation using UV light. In this study, the target materials of the PCMP application include SiC, GaN, GaAs, and Ru. This study explains the photocatalytic reaction, which is the basic principle of PCMP, and reviews studies on PCMP according to materials. Additionally, the researchers classified the PCMP system used in existing studies and presented the course for further investigation of PCMP. This study aims to aid in understanding PCMP and set the direction of future research. Lastly, since there have not been many studies on the tribology characteristics in PCMP, research on this is expected to be required.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2004년도 추계학술대회 논문집
• /
• pp.379-382
• /
• 2004

Abrasive jet machining (AJM) has a large number of parameters such as powder flow rate, air pressure, diameter of abrasive, stand off distance, material hardness and fracture toughness, etc. It is not easy matter to control those parameter. To achieve high accurate machining, in this study, Taguchi method was used to select process parameters. The objective of the optimization was to get higher material removal rate (MRR). From the experiments and analysis, some process parameters were found to make efficient machining.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2003년도 ICCAS
• /
• pp.700-705
• /
• 2003

In this paper, an extended process model is proposed for the application of flexible belt grinding equipment as utilized in robotic grinding. The analytical and experimental results corresponding to grinding force, material removal rate (MRR) and contact area in the robotic grinding shows the difference between the conventional grinding and the flexible robotic grinding. The process model representing the relationship between the material removal and the normal force acting at the contact area has been applied to robotic programming and control. The application of the developed model in blade grinding demonstrates the effectiveness of proposed process model.

• Tribology and Lubricants
• /
• 제25권6호
• /
• pp.404-408
• /
• 2009

본 연구에서는 마이크로/나노입자를 이용한 연마가공 공정에서의 입자-표면간 접촉상황에서 접촉계면의 기계적 성질과 재료제거율간의 관계를 실험적으로 고찰하였다. 연마가공 공정에서의 입자-평면간 접촉을 모사하기 위하여 팁 대신 실리카 입자를 부착한 콜로이드 프로브를 이용한 원자현미경 실험을 통하여 마찰력과 강성을 실험적으로 측정하였다. 실험결과와 이론적 접촉해석으로부터, 마찰계수는 횡방향 접촉강성에 따라 대체적으로 증가하고 재료제거율은 실리카 입자와 Cu, PolySi, Ni과 같은 다양한 재료표면간 접촉에서의 마찰계수들과 지수함수적인 비례관계를 가지고 있음을 규명하였다.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1996년도 추계학술대회 논문
• /
• pp.52-57
• /
• 1996

Conductive Ceramic Matrix Composite(CMC) of TIC/Al2O3 and Metal Matrix Composite (MMC) of SiC/Al were experienced by the die sinking Electrical Discharge Machining(EDM) for different current and duty factor according to negative polarity. Inthis experimental study Material Removal Rate(MRR) maximum surface roughness four point bending stress distribution and Scanning Electron Microscopy(SEM) Photographs were analysed. the higher MRR was obtained for CMC than MMC but slowly decreased around duty factor of 0.67 for MMC and better surface morphology was found CMC than MMC. The SEM photographs of discharge traces for CMC showe uniform shape about 100 to 200${\mu}{\textrm}{m}$ in diameter but MMC showed irregular shape.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
• /
• pp.473-477
• /
• 2000

The experimental study of die-sinking electrical discharge machining(EDM) was conducted for Cold Die Alloy Steel of SKD-11 with rotary electrode according to the peak current of 11A, 15A and 19A, and the duty factor of 0.24, 0.45. dielectric fluid flow through the electrode inside according to the change of electrode internal diameter during the EDM working. Material removal rate(MRR) was increased with flushing & rotation of electrode at the condition for the peak current of 15A, 19a but the MRR is decreased at the flushing only. The more surface roughness was obtained for the case of the flushing & rotation under the peak current of 19A.