Browse > Article

Relation of AE and Polishing Parameters for Polishing Process Monitoring  

Kim, Hwa-Young (부산대학교 산학협력단)
Kim, Jeong-Uk ((재)부산테크노파크 기계부품소재 기술지원센터)
Yoon, Hang-Mook (동의대학교 도시공학과)
Ahn, Jung-Hwan (부산대학교 기계공학부)
Kim, Sung-Ryul (부산대학교 지능기계공학과)
Publication Information
Journal of the Korean Society for Precision Engineering / v.22, no.10, 2005 , pp. 90-98 More about this Journal
Abstract
A monitoring system is necessary to make the polishing process more reliable in order to ensure the high quality and performance of the final products. Generally, AE (Acoustic Emission) is known to be closely related to the material removal rate (MRR). As the surface becomes rougher, the MRR and AE increase. Therefore, the surface roughness can be indirectly estimated using the AE signal measured during the polishing. In this study, an AE sensor-based monitoring system was fabricated to detect the very small AE signal resulting from the friction between a tool and a workpiece during polishing. The performance of this monitoring system was estimated according to polishing conditions, the relation between the level of the AE RMS and the surface roughness during the polishing was investigated.
Keywords
Polishing; Acoustic emission (AE); Monitoring; Surface roughness; Effective removal rate;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Elijah, K. A., Dornfeld, D. A., 'Quantitative Relationships for Acoustic Emission from Orthogonal Metal Cutting,' Trans. ASME, Ser. B. 103. 3. 330., 1981   DOI
2 Fortunko, C. M., Hamstad, M. A. and Fitting, D. W., 'High-fidelity acoustic emission sensor/preamplifier subsystems: modeling and experiments,' IEEE, Ultrasonics symposium, pp. 327-332, 1992   DOI
3 Onoe, M., Jumonji, H., 'Useful Formulas for Piezoelectric Ceramic Resonators and their Application to measurement of Parameters,' Journal of Acoust. Soc. America, Vol. 41, No.4, pp. 974-980, 1967   DOI
4 Kim, S. R., Kim, J. D., Kim, H. Y. and Ahn, J. H., ' Development of AE sensor based Monitoring System for Fine Machining,' Proceeding of ISC, pp. 255-256, 2001
5 Hardy, H. R. Jr., 'Geotechnical Application of Acoustic Emission Techniques; Present States and Future Goals,' Proceedings of the 7th International AE Symposium, pp. 632-641,1984
6 Osada, T., Ohuchi, H. and Kasai, T., 'Monitoring of lapping Process with Piezoelectric Ceramic Sensor(2nd Report) - Acoustic Detection Using a Conical-Horn Type of Lapping Jig -,' Journal of the JSPE, Vol.63, No.12, pp. 1710-1714,1997   DOI   ScienceOn
7 Sasaki, T., Miyoshi, T., Saito, K. and Kaiohoi, O., 'Knowledge Acquisition and Automation of Operation for Injection Mold(1st Report) - Hand Polishing Properties of Skilled Machinist -,' Journal of the JSPE, Vol.57, No.3, pp. 497-503, 1991
8 Sasaki, T., Miyoshi, T., Saito, K. and Kaiohoi, O., 'Knowledge Acquisition and Automation of Operation for Injection Mold(2st Report) - Export System for Mold and Die Polishing Operation -,' Journal of the JSPE, Vol.57, No. 12, pp. 2151-2156, 1991
9 Osada, T., Ohuchi, H. and Kasai, T., 'Monitoring of lapping Process with Piezoelectric Ceramic Sensor(1nd Report) - Relation between lapping Conditions and Detected Acoustic Signals -,' Journal of the JSPE, Vol.62, No.6, pp. 881-885,1996
10 Ahn, J. H., Lee, M. C., Jeong, H. D., Kim, S. R. and Cho, K. K., 'Intelligently automated polishing for high quality surface formation of sculptured die,' Journal of the MPT, Vol. 130-131, pp. 339-344, 2002   DOI   ScienceOn
11 Luo, J., Donfeld, D. A., 'Material removal mechanism in chemical mechanical polishing: theory and modeling,' IEEE Trans. Semicond. Manuf. Vol 14, No 2, pp. 112-133,2001   DOI   ScienceOn