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http://dx.doi.org/10.9725/kts.2022.38.6.247

Research Trends on Chemical Mechanical Polishing Using Ultraviolet Light  

Lee, Hyunseop (Dept. of Mechanical Engineering, Dong-A University)
Publication Information
Tribology and Lubricants / v.38, no.6, 2022 , pp. 247-254 More about this Journal
Abstract
Chemical mechanical polishing (CMP) is a hybrid surface-polishing process that utilizes both mechanical and chemical energy. However, the recently emerging semiconductor substrate and thin film materials are challenging to process using the existing CMP. Therefore, previous researchers have conducted studies to increase the material removal rate (MRR) of CMP. Most materials studied to improve MRR have high hardness and chemical stability. Methods for enhancing the material removal efficiency of CMP include additional provision of electric, thermal, light, mechanical, and chemical energies. This study aims to introduce research trends on CMP using ultraviolet (UV) light to these methods to improve the material removal efficiency of CMP. This method, photocatalysis-assisted chemical mechanical polishing (PCMP), utilizes photocatalytic oxidation using UV light. In this study, the target materials of the PCMP application include SiC, GaN, GaAs, and Ru. This study explains the photocatalytic reaction, which is the basic principle of PCMP, and reviews studies on PCMP according to materials. Additionally, the researchers classified the PCMP system used in existing studies and presented the course for further investigation of PCMP. This study aims to aid in understanding PCMP and set the direction of future research. Lastly, since there have not been many studies on the tribology characteristics in PCMP, research on this is expected to be required.
Keywords
Chemical mechanical polishing; Ultraviolet(UV) light; Photocatalyst; Research trend;
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Times Cited By KSCI : 3  (Citation Analysis)
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