• Title/Summary/Keyword: material factor

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Die Sinking Electrical Discharge Machining of SiC/AI Metal Matix Composite (탄화규소/알루미늄 금속계 복합재료의 형상방전가공)

  • 왕덕현
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.1
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    • pp.34-40
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    • 1998
  • Conductive metal matrix composite(MMC) material of 30% silicon carbide particulated based on aluminum matrix was machined by die sinking electrical discharge machining(EDM) process according to different current and duty factor for reverse polarity of electrode. Material removal rate(MRR) was examined by process under various operation conditions. The surface morphology was evaluated by surface roughness parameter and scanning electron microscopy(SEM) research. The MRR was suddenly increased over 11 ampere of current, and it was slightly changed over 0.3 of duty factor. The maximum surface roughness of EDMed surface was affected by the duty factor. The SEM photograghs of EDMed surface showed wide recast distribution region of melting materials as increased of current and duty factor.

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A Study on the Evaluation of the Loss factor and Young's Modulus of Damping Materials on Temperature Condition (온도 조건에 따른 제진재의 손실계수 및 탄성계수 측정)

  • Lee, Chang-Myung;Ju, Ho-Min;Lee, Jun
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2001.05a
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    • pp.1192-1196
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    • 2001
  • Damping materials show variant characteristics depend on frequency or temperature condition. Therefore, we need to measure damping material characteristics called a loss factor or a young's modulus varying frequency or temperature condition. In this article, measuring procedure and method has been introduced for damping material using a sticking damping material with a thin steel beam. And it shows a temperature effect to damping materials.

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A Study for Solenoid-Type RF Chip Inductors (솔레노이드 형태의 RF 칩 인덕터에 대한 연구)

  • 김재욱;윤의중;정여창;홍철호
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.10
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    • pp.840-846
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    • 2000
  • In this work, small-size, high-performance solenoid-type RF chip inductors utilizing a low-loss Al$_2$O$_3$core material were investigated. The size of the chip inductors fabricated in this work were 15$\times$10$\times$0.7㎣, 2.1$\times$1.5$\times$10㎣, and 2.4$\times$2.0$\times$1.4㎣ and copper (Cu) wire with 40 ㎛ diameter was used as the coils. High frequency characteristics of the inductance, quality factor, and impedance of developed inductors were measured suing an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). It was observed that the developed inductors with the number of turns of 7 have the inductance of 33 to 100nH and exhibit the self-resonant frequency (SRF) of .26 to 1.1 GHz. The SRF of inductors decreases with increasing the inductance and the inductors have the quality factor of 60 to 80 in the frequency range of 300 MHz to 1.1 GHz. In this study, small-size solenoid-type RF chip inductors with high inductance and high quality factor were fabricated successfully. It is suggested that the thin film-type inductor is necessary to fabricate the smaller size inductors at the expence of inductance and quality factor values.

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Effect of Cavity Material on the Q-Factor Measurement of Microwave Dielectric Materials (캐비티 재질이 마이크로파 유전체 공진기의 Q값 측정에 미치는 영향)

  • Park, Jae-Hwan;Park, Jae-Gwan
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.3
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    • pp.39-43
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    • 2011
  • Effects of cavity material on the Q-factor measurement of microwave dielectric materials were studied by HFSS simulation and the measurements using metal cavity. $TE_{01\delta}$ mode resonant frequency was determined from the electric and magnetic field patterns and the loaded Q-factor was calculated from 3dB bandwidth of $S_{21}$ spectrum. When the cavity metal materials were Cu, SUS and Au cavity, the level of Q-factor was similar. However, Q-factor was significantly decreased when the cavity metal material was CuO. The Q-factor measurements of dielectric resonator by network analyzer using various metal cavity exhibits consistent behavior.

Stress Intensity Factor for Multi-Layered Material Under Polynomial Anti-Symmetric Loading (멱급수 반대칭하중을 받는 다층재 중앙균열의 응력세기계수)

  • 이강용;김성호;박문복
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.12
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    • pp.3219-3226
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    • 1994
  • A model is constructed to evaluate the stress intensity factors for a center crack subjected to polynomial anti-symmetric loading in a layered material. A Fredholm integral equation is derived by Fourier integral transform method. The integral equation is numerically analyzed to evaluate the effects of the ratios of shear modulus, Poisson's ratio and crack length to layer thickness as well as the number of layers on the stress intensity factor. The stress intensity factors are approached to constant values as the number of layers increase and decrease as the polynomial power of the loading increase. In case of the E-glass/Epoxy composite, dimensionless stress intensity factor is affected by cracked-resin layer thickness.

A study on the piezoelectric characteristics of PMB-PZT ceramics for piezoelectric transformer material development (압전트랜스용 재료 개발을 위한 PMB-PZT계 세라믹의 압전특성에 관한 연구)

  • Kim, Hyun-Chul;Kim, Seung-Cheol;Bae, Seon-Gi;Kim, Jean-Shop;Yoon, Hyun-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.578-580
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    • 2002
  • In this thesis, specimens was manufactured in general method annexing PMB-PZT system ceramic, and the following conclusion has been deduced. In XRD, the crystal structure of ceramic has the tetragonal structure which is close to rombohedral structure, and consequently the specimen characterized by MPB was manufactured. According to dopping with xPMB, electromechanical factor(kp) little is changed. kp was maximum value 23.37[%] at xPMB 0.03[mol%]. mechanical quality factor(Qm) was maximum value 237,04 at xPMB 0.03[mol%].

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Calculation of Field Enhancement Factor in CNT-Cathodes Dependence on Dielectric Constant of Bonding Materials

  • Kim, Tae-Sik;Shin, Heo-Young;Cho, Young-Rae
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1092-1095
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    • 2005
  • The effect of the dielectric constant (${\varepsilon}$) of bonding materials in screen-printed carbon nanotube cathode on field enhancement factor was investigated using the ANSYS software for high-efficient CNT-cathodes. The field enhancement factor increased with decreasing the dielectric constant and reaching a maximum value when the dielectric constant is 1, the value for a vacuum. This indicates that the best bonding materials for screen-printing CNT cathodes should have a low dielectric constant and this can be used as criteria for selecting bonding materials for use in CNT pastes for high-efficient CNT-cathodes

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Mode III Stress Intensity Factors for Orthotropic Layered Material with Internal Center Crack Under Uniform Anti-Plane Shear Loading (균일한 면외 전단하중을 받는 직교 이방성 적층재 내부 중앙균열의 모드 III 응력세기계수)

  • Lee, Kang-Yong;Joo, Sung-Chul;Kim, Sung-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.23 no.6 s.165
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    • pp.961-967
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    • 1999
  • A model is constructed to evaluate the mode III stress intensity factor(SIF) for orthotropic three-layered material with a center crack subjected to uniform anti-plane shear loading. A mixed boundary value problem is formulated by Fourier integral transform method and a Fredholm integral equation of the second kind is derived. The integral equation is numerically analyzed to evaluate the effects of the ratio of shear modulus, strength of each layer and crack length to layer thickness on the stress intensity factor.

A Study on the Characterisitcs of Electircal Discharge Machining (Sic/A1 복합재료의 방전가공 특성에 관한 연구)

  • 우정윤;왕덕현;김원일;이규창
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.3-7
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    • 1996
  • Metal Matrix Composite(MMC) material of 30% SiC particulate based on A1 matrix was machined by drilling and Electrical Discharge Machining (EDM) processes. When drilling process was executed, surface fracture due to brittle property near the bottom was found. It was also found the possiblity of difficult shape of EDM process for MMC material, but few the research about basic EDM characteristics. Material Removal Rate(MRR) was examined for different conditions and the surface morphology was evaluated by roughness values and Scanning Electron Microscopy(SEM) research. The higher the current is, the more MRR was obtained but the higher MRR was showed around 0.45 duty factor. The average roughness of EDMed surface was slightly changed with increased pulse current and increases with duty factor. The SEM photographs of EDMed surface showed recast region after melting.

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A Study on the Evaluation of the Loss Factor and Young′s Modulus of Damping Materials on Temperature Condition (2층형 제진 강판을 이용한 오도 조건에 따른 제진재의 손실계수 및 탄성계수 측정)

  • Lee, Chang-Myung;Lee, Jun
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.11 no.9
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    • pp.391-397
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    • 2001
  • The characteristic values of damping materials are variant on frequency and temperature. We measure the characteristic values(loss factor, young\\\\`s modulus) of damping materials in vibration test. We can not measure characteristic values of damping materials by themselves. So, we proposed a method, sticking damping material to thin steel beam and measuring of characteristic values of damping material on frequency and temperature. We didn\\\\`t use constraining layer but we measured characteristic values on conditioning temperature.

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