• 제목/요약/키워드: magnetic thin film

검색결과 612건 처리시간 0.03초

Improvement of Magnetic Properties and Texture of FePt Thin Films on MgO Substrates by Sn Addition

  • Chun, Dong-Won;Kim, Sung-Man;Kim, Gyeung-Ho;Jeung, Won-Young
    • Journal of Magnetics
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    • 제14권1호
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    • pp.7-10
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    • 2009
  • In this work, we studied the effects of Sn addition on the ordering temperature of FePt thin film. The coercivity of FePtSn film was about 1000 Oe greater than the coercivity of FePt film for an annealing temperature of $600^{\circ}C$. Therefore, Sn addition was effective in promoting the $L1_0$ ordering and in reducing the ordering temperature of the FePt film. From our X-ray diffraction results, we found that in the as-deposited film, the addition of Sn induced a lattice expansion in disordered FePt thin films. After the annealing process, the excess Sn diffuses out from the ordered FePt thin film because of the difference in the solid solubility of Sn between the disordered and ordered phases. The existence of precipitates of Sn from the FePt lattice was deduced by Curie temperature measurements of the FePt and FePtSn films. Therefore, the key role played by the addition of Sn to the FePt film can be explained by a reduction in the activation energy for the $L1_0$ order-disorder transformation of FePt which originates from the high internal stress in the disordered phase induced by the supersaturated Sn atoms.

산소분압에 따른 Fe-Sm-O계 박막의 연자기적 성질 (The Influence of $O_2$ Partial Pressure on Soft Magnetic Properties of As-deposited Fe-Sm-O Thin Films)

  • 윤대식;조완식;고은수;이영;박종봉;김종오
    • 한국재료학회지
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    • 제10권11호
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    • pp.755-759
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    • 2000
  • RF magnetron sputtering법으로 초미세결정 Fe-Sm-O계의 박막을 상온에서 제작하여 산소분압에 따른 포화자화, 보자력, 고주파에서의 투자율(100MHz)을 조사하였다. 최적조건인 5%의 산소분압에서 제조한 초미세결정 Fe(sub)83.4Sm(sub)3.4O(sub)13.2박막은 포화자속밀도 18kG, 보자력 0.82 Oe, 실효투자율 (0.5~100MHz) 2,600 이상의 우수한 연자성을 나타내었다. 산소분압이 증가함에 따라 $\alpha$-Fe 결정립의 크기가 감소하여 10%이상의 산소분압에서는 FeO가 생성되어 연자기적 성질이 열화되었다. Fe-Sm-O계 박막의 전기비저항은 산소분압이 증가함에 따라 증가하는 경향을 나타내었으며 우수한 연자기적 성질을 가지는 Fe(sub)83.4Sm(sub)3.4O(sub)13.2박막의 경우, 전기비저항은 130 $\mu$$\Omega$cm이었다. 따라서 미세하게 형성된 $\alpha$-Fe 결정립과 높은 전기비저항 때문에 초미세결정 Fe(sub)83.4Sm(sub)3.4O(sub)13.2박막이 고주파에서 우수한 연자기적 성질을 가지는 것으로 판단된다.

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Increment of the Exchange Coupling in Fe-Ni Alloy Thin Films Deposited with a Bias Magnetic Field

  • Han, Kyung-Hunn;Kim, Jung-Gi;Cho, Jae-Hun;Lee, Suk-Mock
    • Journal of Magnetics
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    • 제11권2호
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    • pp.77-82
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    • 2006
  • The structure and magnetic properties of Fe-Ni films, deposited by DC magnetron sputtering on Si(111) wafer, have been studied. The spin wave stiffness constant is determined by Brillouin light scattering (BLS) and compared with the value obtained from magnetization measurements. The range of exchange interaction was determined as 0.4 atomic distances in the film deposited in a bias magnetic field, which is 1/2 that in the film grown in no bias magnetic field. The results show that the dimensions of exchange coupling increased by the sputtering in the magnetic field.

버퍼층 Ta에 의존하는 코네틱 박막의 연자성 자기저항 특성 (Soft Magnetoresistive Properties of Conetic Thin Film Depending on Ta Buffer Layer)

  • 최종구;황도근;이상석;최진협;이기암;이장로
    • 한국자기학회지
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    • 제19권6호
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    • pp.197-202
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    • 2009
  • 코닝유리(Corning glass) 기판 위에 이온빔 증착법으로 제작한 버퍼(Ta)/코네틱(Conetic; NiFeCuMo) 박막에 대해 버퍼층에 의존하는 결정성장과 열처리 효과를 조사하였다. 또한 코네틱층을 증착할 때에 인가한 자기장 방향으로 용이축과 곤란축의 자기저항 곡선으로부터 얻은 보자력과 포화자기장값을 버퍼층 유무에 따라 서로 비교하였다. Ta 박막의 두께가 5 nm이고 코네틱 박막의 두께가 50 nm일 때에 보자력은 0.12 Oe으로 작았으며, MH 히스테리시스 곡선에서 얻은 자화율($\chi$)은 1.2 ${\times}\;10^4$으로 우수한 연자성의 특성을 가졌다. 저자기장에 민감한 거대자기저항 스핀밸브(GMR-SV; giant magneoresistance-spin valve)나 자기터널링접합(MTJ; megnetic tunnel junction) 박막구조에서 자유층으로 연자성의 특성이 우수한 코네틱 박막을 사용할 수 있는 가능성을 확인하였다.

스퍼터링 방법으로 증착된 하층 NiFe 코어를 갖는 박막인덕터의 CMOS 집적화 공정 (Fully CMOS-compatible Process Integration of Thin film Inductor with a Sputtered Bottom NiFe Core)

  • 박일용;김상기;구진근;노태문;이대우;김종대
    • 한국전기전자재료학회논문지
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    • 제16권2호
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    • pp.138-143
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    • 2003
  • A double spiral thin-film inductor with a NiFe magnetic core is integrated with DC-DC converter IC. The NiFe core is deposited on a polyimide film as the thinckness of NiFe is 2.5~3.5 ${\mu}$m. Then, copper conductor line is deposited on the NiFe core with double spiral structure. Process integration is performed by sequential processes of etching the polyimide film deposited both top and bottom of the NiFe core and electroplation copper conductor line from exposed metal pad of the DC-DC converter IC. Process integration is simplified by elimination planarization process for top core because the proposed thin-film inductor has a bottom NiFe core only. Inductor of the fabricated monolithic DC-DC converter IC is 0.53 ${\mu}$H when the area of converter IC and thin-film inductor are 5X5$\textrm{mm}^2$ and 3.5X2.5$\textrm{mm}^2$, respectively. The efficiency is 72% when input voltage and output voltage are 3.5 V and 6 V, respectively at the operation frequency of 8 MHz.