• Title/Summary/Keyword: low-temperature sintering Microstructure

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Fabrication of Injection Molded Fe-50%Ni Sintered Bodies (사출성형된 Fe-50%Ni 소결체의 제조)

  • Kim Ki-Hyun;Yoon Hyeong-Chul;Choi Chul-Jin;Lee Byong-Taek
    • Journal of Powder Materials
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    • v.11 no.6 s.47
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    • pp.472-476
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    • 2004
  • The Fe-Ni compact bodies were fabricated using Fe-Ni mixed powders with 50 nm in diameter by injection molding process. The relationship between microstructure and material properties was characterized with respect to the volume ratio of powder/binder and sintering temperature with SEM and TEM. In the compact body having the volume percent ratio of 45(Fe-Ni) : 55(binder), which was sintered at $900^{\circ}C$ the values of relative density and hardness were low about 97.7% and 277.1 Hv, respectively. Using the composition of 50(Fe Ni) : 50(binder) and sintered at $900^{\circ}C$, the values of relative density and hardness were 98.5%, 294.4 Hv, respec-tively. The grain size of sintered bodies strongly depended on the sintering temperature. In both samples sintered at $600^{\circ}C$ and $900^{\circ}C$, the average grain sizes were about 150 nm and 500 nm in diameter, respectively.

A Study on the Thermal and Electrical Properties of Fabricated Mo-Cu Alloy by Spark Plasma Sintering Method (방전 플라즈마 소결법으로 제작한 Mo-Cu 합금의 열적, 전기적 특성)

  • Lee, Han-Chan;Lee, Boong-Joo
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.66 no.11
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    • pp.1600-1604
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    • 2017
  • Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.

Phase Distribution, Microstructure, and Electrical Characteristics of NASICON Compounds

  • N.H. Cho;Kang, Hee-Bok;Kim, Y.H.
    • The Korean Journal of Ceramics
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    • v.1 no.4
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    • pp.179-184
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    • 1995
  • Sodium superionic conductor (NASICON) compounds were prepared. The effects of sintering temperature and cooling rate on the formation and the distribution of crystalline NASICON and $ZrO_3$ second phase were investigated. In the von Alpen-type composition, the $ZrO_2$ second phase is in thermal equilibrium with the crystalline NASICON above $1320^{\circ}C$, but when cooled through 1260-$1320^{\circ}C$ crystalline NASICON was formed by reaction between $ZrO_2$ and liquid phase. Very slow cooling ($1^{\circ}C$/hr) to $1260^{\circ}C$ from sintering temperature decreased the amount of sodium which prevents the formation of the crystalline NASICON resulted high number of $ZrO_2$ grains near the surface of some sintered bodies. Maximum electrical conductivity of 0.200 ohm-1cm-1 was obtained at $300^{\circ}C$ for well-sintered samples with little $ZrO_3$. On the other hand, low conductivities were obtained for rapid-cooled samples which have less dense microstructure.

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Microstructure and Dielectric Properties of (Sr·Ca)TiO3-based Ceramics Exhibiting Nonlinear Characteristics (비선형 특성을 갖는 (Sr·Ca)TiO3계 세라믹의 미세구조 및 유전 특성)

  • 최운식;강재훈;박철하;김진사;조춘남;송민종
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.1
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    • pp.24-29
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    • 2002
  • In this paper, the microstructure and the dielectric properties of Sr$\_$1-x/CaxTiO$_3$(0$\leq$x$\leq$0.2)-based grain boundary layer ceramics were investigated. The sintering temperature and time were 1420∼152 0$\^{C}$ and 4 hours in N$_2$ gas, respectively. The average grain size and the lattice constant were decreased with increasing content of Ca, but the average grain size was increased with increase of sintering temperature. The second phase foamed by the thermal diffusion of CuO from the surface leads to verb high apparent dielectric constant, $\xi$$\_$r/>50000 and low dielectric loss, tan$\delta$<0.05. X-ray diffraction patterns of Sr$\_$1-x/CaxTiO$_3$ exhibited cubic structure, and the peaks shifted upward and the peak intensity were decreased with x. This is due to the lattice contraction as Sr is replaced by Ca with a smaller ionic radius. The specimens treated thermal diffusion for 2hrs in 1150$\^{C}$ exhibited nonlinear current-voltage characteristic, and its nonlinear coefficient(a) was overt 7.

A Study on Properties of Low Temperature Sintering in the NiZn Ferrite System (NiZn 페라이트의 저온 소결 특성에 관한 연구)

  • 고상기;김병호;김경용
    • Journal of the Korean Ceramic Society
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    • v.34 no.10
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    • pp.1074-1082
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    • 1997
  • Microstructure and permeability as a function of sintering temperature and composition were studied on the Ni$\delta$Cu0.4-$\delta$Zn0.6Fe2O4 ($\delta$=0, 0.1, 0.2, 0.3, 0.4) which was prepared by Cu2+ substitution for Ni2+ in Ni.0.4Zn0.6Fe2O4, then followed by 8 wt% CuO and 1wt% Bi2O3 as sintering aids. It was found that NiCuZn ferrite in which Cu2+ is substituted for Ni2+ is more effective in reduction of sintering temperature than Ni.0.4Zn0.6Fe2O4, containing CuO as a sintering aid. The specimen $\delta$=0.2 sintered at 90$0^{\circ}C$ for 2hr exhibited the highest initial permeability value ($\mu$o=280 at 1Mhz), but the real permeability decreased at the frequency under 10 MHz. EPMA analysis showed that Ni$\delta$Cu0.4-$\delta$Zn0.6Fe2O4 ($\delta$=0.4), sintered at 95$0^{\circ}C$ for 2hrs consisted of three phase regions of Ni.0.3Cu0.1Zn0.6Fe2O4 region, Cu and Bi liquid existed at the 3-point boundary, although the stabilization energy of Ni2+ is higher than that of Cu2+ in B site.

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Effect of Sintering Aid and Glass-Frit on the Densification and Resistivity of Silver Paste (실버 페이스트의 치밀화 및 비저항에 미치는 소결조제와 프릿의 영향)

  • Lee, Jong-Kook;Park, Sung-Hyun;Yang, Gwon-Seung
    • Korean Journal of Materials Research
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    • v.18 no.5
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    • pp.283-288
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    • 2008
  • The effect of sintering aids and glass-frit on the densification and resistivity of silver paste was investigated in an effort to enhance the sintered density and electrical conductivity of the silver electrode. To prepare Pb-free silver paste for use at low sintering temperatures, two commercial silver powders ($0.8\;{\mu}m$ and $1.6\;{\mu}m$ in size) and 5wt.% lab-synthesized nanoparticles (30-50 nm in size) as a sintering aids were mixed with 3 wt.% or 6 wt.% of glass frit ($Bi_2O_3$-based) using a solvent and three roll mills. Thick films from the silver paste were prepared by means of screen printing on an alumina substrate followed by sintering at $450^{\circ}C$ to $550^{\circ}C$ for 15 min. Silver thick films from the paste with bimodal particles showed a high packing density, high densification during sintering and low resistivity compared to films created using monomodal particles. Silver nanoparticles as a sintering aid enhanced the densification of commercial silver powder at a low sintering temperature and induced low resistivity in the silver thick film. The glass frit also enhanced the densification of the films through liquid phase sintering; however, the optimum content of glass frit is necessary to ensure that a dense microstructure and low resistivity are obtained, as excessive glass-frit can provoke low conductivity due to the interconnection of the glass phase with the high resistivity between the silver particles.

Low Temperature Sintering of PNN-PZT Ceramics and Its Electrical Properties (PNN-PZT 세라믹스의 저온 소결 및 전기적 특성 평가)

  • Lee, Myung-Woo;Kim, Sung-Jin;Yoon, Man-Soon;Ryu, Sung-Lim;Kweon, Soon-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.12
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    • pp.1077-1082
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    • 2008
  • To fabricate a multi-layered piezoelectrics/electrodes structure, the piezoelectrics should be sintered at the temperature lower than $950^{\circ}C$ to use the silver electrode, which is cheaper than the electrodes containing noble metals such as Pd and Pt. Therefore, in this study, we modified the composition of $Pb(Zr,Ti)O_3$-based material as $(Pb_{0.98}Cd_{0.02})(Ni_{1/3}Nb_{2/3})_{0.25}Zr_{0.35}Ti_{0.4}O_3$ to lower the sintering temperature and to improve the piezoelectric properties. Small amount of $MnCO_3$, $SiO_2$, and $Pb_3O_4$ were also added to lower the sintering temperature of the ceramic. The prepared raw powders were mixed by using a ball mill for 24 hours. And then the mixed powders were calcinated for 2 hours at $800^{\circ}C$. The calcinated powders were again crushed with the ball mill for 72 hours. The final powders were pressed for making the shape of ${\emptyset}15\;mm$ disk. The disk-type samples were sintered at temperature range of $850{\sim}950^{\circ}C$. The crystal phases of the sintered specimens were perovskite structure without secondary phases. All of the measured electrical properties such as electromechanical coupling coefficients ($k_p$), mechanical quality factors ($Q_m$), and piezoelectric charge constants ($d_{33}$) were decreased with decreasing the sintering temperatures. The electrical properties measured at the sample sintered at $950^{\circ}C$ were 54% of $k_p$, 503 of $Q_m$, and 390 pC/N of $d_{33}$, respectively. These properties were considered to be fairly good for the application of multi-layered piezoelectric generators or actuators.

Synthesis of Intermetallics and Nanocomposites by High-Energy Milling

  • Bernd F. Kieback;H. Kubsch;Alexander Bohm;M. Zumdick;Thomas Weissgaerber
    • Journal of Powder Materials
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    • v.9 no.6
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    • pp.416-421
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    • 2002
  • Elemental powders are used in high energy milling processes for the synthesis of new compounds. The low temperature solid state reactions during milling in inert gas atmosphere may result in intermetallic phases, carbides, nitrides or silicides with a nanocrystalline structure. To obtain dense materials from the powders a pressure assisted densification is necessary. On the other side the defect-rich microstructure can be used for activated sintering of elemental powder mixtures to obtain dense bodies by pressureless sintering. Results are discussed for nanocrystalline cermet systems and for the sintering of aluminides and silicides.

Low-Temperature Sintering Behavior of Aluminum Nitride Ceramics with Added Copper Oxide or Copper

  • Hwang, Jin-Geun;Oh, Kyung-Sik;Chung, Tai-Joo;Kim, Tae-Heui;Paek, Yeong-Kyeun
    • Journal of the Korean Ceramic Society
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    • v.56 no.1
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    • pp.104-110
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    • 2019
  • The low-temperature sintering behavior of AlN was investigated through a conventional method. $CaF_2$, CuO and Cu were selected as additives based on their low melting points. When sintered at $1600^{\circ}C$ for 8 h in $N_2$ atmosphere, a sample density > 98% was obtained. The X-ray data indicated that eutectic reactions below $1200^{\circ}C$ were found. Therefore, the current systems have lower liquid formation temperatures than other systems. The liquid phase showed high dihedral angles at triple grain junctions, indicating that the liquid had poor wettability on the grain surfaces. Eventually, the liquid was likely to vaporize due to the unfavorable wetting condition. As a result, a microstructure with clean grain boundaries was obtained, resulting in higher contiguity between grains. From EDS analysis, oxygen impurity seems to be well removed in AlN lattice. Therefore, it is believed that the current systems are beneficial for reducing sintering temperature and improving oxygen removal.

Influence of Heating Rate on the Properties of Low-Temperature-Sinterable PMN-PT-BT Ceramics (저온 소결용 PMN-PT-BT 세라믹스의 물성에 미치는 승온 속도의 영향)

  • Han, Kyoung-Ran;Kim, Chang-Sam
    • Journal of the Korean Ceramic Society
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    • v.42 no.1
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    • pp.33-36
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    • 2005
  • Effect of heating rate was studied on consolidation of the low-temperature-sinterable PMN-PT-BT powder by varying the heating rate from 5, 10, to $20^{circ}C/min$. Slow rate of $5^{circ}C/min$ showed more homogeneous microstructure than high rate of 10 or $20^{circ}C/min$ due to low PbO (m.p. $886^{circ}C$) evaporation at 850^{circ}C$. It showed sintered density of $7.93 g/cm^{3}$, room temperature dielectric constant of 15300, and dissipation factor of $0.92\%$.