• Korean Journal of Materials Research
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• v.26 no.4
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• Journal of Power System Engineering
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• v.13 no.6
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• pp.76-81
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• 2009

Thermal desorption systems are designed to remove organic compounds from solid matrices such as soils, sludges and filter cakes without thermally destroying them. It is a separation technology, not a destruction technology. Since it is a thermal process, there is a common belief that temperature is the only significant parameter to be monitored. While it is true that better removal efficiencies are usually achieved at higher temperatures, other factors must be considered. Since the process is governed by mass transfer, heating time and the amount of mixing are also key parameters in optimizing removal efficiency. Thermal desorption have been successfully used for just about every organic contaminant found to date. It has also been used to remove mercury. In the present study, the numerical simulation has been performed to investigate the characteristics of heat transfer of LTTD(low temperature thermal desorption). The commercial software, AMESIM was applied for analyzing the heat transfer process in the LTTD.

• Journal of the Korean Society of Combustion
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• v.10 no.4
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• pp.24-32
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• 2005

Various types of plasma source applied in $CH_4$ decomposition process are compared. DBD by pulse and AC power, spark by pulse and AC power, rotating arc and hollow cathode plasma are chosen to be compared. The results show that $CH_4$ conversion per given unit power is relatively high in hollow cathode plasma and rotating arc that induces rather high temperature condition and that is why both thermal dehydration and plasma induced decomposition contribute for the overall process. In case of DBD wherein high temperature electron and low temperature gas molecule coexist, the process shows low conversion rate, for in rather low temperature condition the contribution of thermal dehydration is lowered. Selectivity of $C_2H_6$ and $C_2H_2$ is shown to be a good parameter of the relative contribution of plasma chemistry in the overall process. From the results we concluded that required condition of plasma source for a cost effective and high yield $CH_4$ decomposition is to have characteristics of both thermal plasma and non thermal plasma in which temperature is high above a certain threshold state for thermal dehydration and electron induced collision is maximized in the same breath.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04a
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• pp.620-625
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• 1995

Finite element analysis tool was developed to analyze the casting process. Generally, casting processes consists of mold filling and solifification. In order to investigate the effects of process variables and to predict the defects, both filling and solidiffication process were simulated simultaneously. At filling process, especiallywe consider thermal coupling to investigate thermal history of material during the filling stage. And thermal condition at the final stage of filling is used as the initial conditions in a solidification process for the exact simulation of the actual casting processes. At mold filling process, Lagrangian-type finite element method with automatic remashing scheme was used to find the material flow. To avoid numerical instability in low viscous fluid, a perturbation method with artificial viscosity is adopted. At solififfication process, enthalpy-based finite element method was used to solve the heat transfer problem with phase change. And elastic stress analysis has been performed to predict the thermal residual stress. Through the FE analysis, solidiffication time, position of solidus line, liquidus line and thermal residual stress are studied. Finite element tools developed in this study will be used process design of casting process and maybe basic structure for total CAE system of castigs which will be constructed afterward.

• Applied Chemistry for Engineering
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• v.26 no.1
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• pp.59-66
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• 2015

A new concept of an inorganic foaming process at low temperature was demonstrated for the production of inorganic thermal insulating materials with the properties of flexible light-weight, the advantages of organic-based thermal insulation material. The foaming process was proceeded by establishing a skeleton of the foam body by using inorganic fibrous sepiolite and aluminum silicate. A cavity was formed by the expansion of fibrous skeleton body, by the gas which was generated from foaming agent at low temperature. Then the multi-vesicular expanded perlite with low thermal conductivity was filled into the cavity in a skeleton of the foam body. Finally through these overall process, a new inorganic foamed body could be obtained at low temperature without the hot melting of inorganic materials. In order to achieve this object, various preparations such as fibrous sepiolite fibrillation process, heat treatment process of the fibrous slurry were needed, and the optimal compositional condition of slurry was required. The foam body produced showed the properties of flexible light-weight thermal insulation materials such as bulk density, yield strength, flexural strength, and high heat resistance.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.68-75
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• 2009

A major disadvantage of thermal nanoimprint lithography(NIL) is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to make the processing temperature lower Accordingly, it is necessary to determine the effects on the processing parameters for thermal NIL at reduced temperatures and to optimize the parameters. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing and filling of thin polymer films into nanocavities during the low temperature thermal NIL have been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality; Pressure and initial polymer resist thickness dependency of cavity filling behaviors has been investigated.

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.83-87
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• 1999

The fabrication process and thermal properties of 50~71vol% SiCp/Al metal matrix composites (MMCs) were investigated. The 50~71vol% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 118~170W/mK and coefficient of thermal expansion (CTE) were 9.5~$6.5{\times}10^{-6}/K$. Specially, the thermal conductivity and CTE of 71vol%SiCp/Al MMCs were 115~156W/mK and 6~$7{\times}10^{-6}/K$. respectively, which showed a improved themal properties than the conventional electronic packaging materials such as ceramics and metals.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.190-194
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• 2000

The fabrication process and thermal properties of 50∼76vo1% SiCp/Al metal matrix composites (MMCs) were investigated. The 50∼76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85∼170W/mK and coefficient of thermal expansion (CTE) were ranged 10∼6ppm/K. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged l15∼156W/mK and 6∼7ppm/K, respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.1
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• pp.9-15
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• 2014

This paper focuses on the heat gain of a lighting system, one of the most-used appliances in buildings, and its thermal effect within a low energy building. In this study, a dynamic thermal model of a lighting system is first established based on the first principle of thermodynamics. Then, thermal parameters of this model are estimated by experiments and an optimization process. Afterward, the obtained model of the system is validated by comparing simulation results to experimental one. Finally it is integrated into a low energy building model in order to quantify its thermal influence within a low energy building. As a result, heat flux of the lighting system, indoor temperature and heating energy demands of the building are obtained and compared with the results obtained by the conventional model of a lighting system. This paper helps to understand thermal dynamics of a lighting system and to further apply lighting systems for energy management of low energy buildings.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.4
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• pp.34-38
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• 2005

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.