Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Effect of Pressure and Initial Polymer Resist Thickness on Low Temperature Nanoimprint Lithography

저온 나노임프린트 공정에서 압력과 폴리머 레지스트 초기 두께의 영향

  • 김남웅 (서울대학교 기계항공공학부 대학원) ;
  • 김국원 (순천향대학교 기계공학과) ;
  • 신효철 (서울대학교 기계항공공학부)
  • Published : 2009.02.15
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Abstract

A major disadvantage of thermal nanoimprint lithography(NIL) is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to make the processing temperature lower Accordingly, it is necessary to determine the effects on the processing parameters for thermal NIL at reduced temperatures and to optimize the parameters. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing and filling of thin polymer films into nanocavities during the low temperature thermal NIL have been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality; Pressure and initial polymer resist thickness dependency of cavity filling behaviors has been investigated.

Keywords

References

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