• Title/Summary/Keyword: low cost MEMS

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Design of a Low-Cost Attitude Determination GPS/INS Integrated Navigation System for a UAV (Unmanned Aerial Vehicle) (무인 비행체용 저가의 ADGPS/INS 통합 항법 시스템)

  • Oh Sang Heon;Lee Sang Jeong;Park Chansik;Hwang Dong-Hwan
    • Journal of Institute of Control, Robotics and Systems
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    • v.11 no.7
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    • pp.633-643
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    • 2005
  • An unmanned aerial vehicle (UAV) is an aircraft controlled by .emote commands from ground station and/o. pre-programmed onboard autopilot system. A navigation system in the UAV provides a navigation data for a flight control computer(FCC). The FCC requires accurate and reliable position, velocity and attitude information for guidance and control. This paper proposes an ADGPS/INS integrated navigation system for a UAV. The proposed navigation system comprises an attitude determination GPS (ADGPS) receive., a navigation computer unit, and a low-cost commercial MEMS inertial measurement unit(IMU). The navigation algorithm contains a fault detection and isolation (FDI) function fur integrity. In order to evaluate the performance of the proposed navigation system, two flight tests were preformed using a small aircraft. The first flight test was carried out to confirm fundamental operation of the proposed navigation system and to check the effectiveness of the FDI algorithm. In the second flight test, the navigation performance and the benefit of the GPS attitude information were checked in a high dynamic environment. The flight test results show that the proposed ADGPS/INS integrated navigation system gives a reliable performance even when anomalous GPS data is provided and better navigation performance than a conventional GPS/INS integration unit.

Design of a Camera Calibration System in a Smart Thermo-Sensor Based Network (스마트 열센서 네트워크의 카메라 미세조정을 위한 시스템 구축)

  • Moon Sang-Gook
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2006.05a
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    • pp.924-926
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    • 2006
  • Sensor networks are an emerging area of mobile computing. Networked sensors represent a new design paradigm enabled by advances in micro electro-mechanical systems (MEMS) and low power technology. Created with integrated circuit (IC) technology and combined with computational logic, these 'smart' sensors have the benefit of small size, low cost and power consumption, and, the capability to perform on-board computation. Though this recent technological innovation has shown a significant promise in many application domains, it has also exposed several technical limitations that must be improved. In this paper, we discuss the system deploy issues for infrared thermo sensor camera calibration.

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Development a simple MEMS-based astronomical adaptive optics system at laboratory

  • Yu, Hyung-Jun;Park, Yong-Sun;Chae, Jong-Chul;Yang, Hee-Su
    • The Bulletin of The Korean Astronomical Society
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    • v.36 no.2
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    • pp.132.2-132.2
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    • 2011
  • We are developing Adaptive Optics (AO) system for astronomical use. The He-Ne laser works as an artificial light source. The tip-tilt correction servo is added to our AO system. The tip-tilt term, among the Zernike terms, is the biggest contributor of wavefront deformation caused by atmospheric turbulence at small telescopes. The tip-tilt correction servo consists of a Piezo tip-tilt platform with a mirror, a quadrant photodiode as a tip-tilt sensor, and controllers. The Shack-Hartmann wavefront sensor measures the residual wavefront errors and they are corrected by the MEMS (Micro Electro Mechanical System) deformable mirror. The MEMS deformable mirror allows the compact size at low cost compare to adaptive secondary mirror and other deformable mirrors. As the frame rates of the MEMS deformable mirror is about tens of kHz, the frame rates of the detector in wavefront sensor is the bottleneck of the wavefront correction speed. For faster performance, we replaced a CCD which provides frame rates only 70 Hz with a CMOS with frame rates up to 450 Hz.

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Laboratory test of MEMS based astronomical adaptive optics

  • Yu, Hyung-Jun;Park, Yong-Sun;Chae, Jong-Chul;Yang, Hee-Su
    • The Bulletin of The Korean Astronomical Society
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    • v.36 no.1
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    • pp.65.1-65.1
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    • 2011
  • We built a simple Adaptive Optics (AO) system at laboratory. This AO system is a step toward developing AO system for astronomical use. In this step, the AO system consists of He-Ne laser as a artificial light source, wavefront sensor, MEMS (Micro electro mechanical system) type deformable mirror and several lenses. MEMS deformable mirror allows the compact system at low cost and the only several mm sized collimated beam. We made Shack-Hartmann wavefront sensor using a lenslet array and a fast frame CCD. Its performance is verified using an artificial phase disturber and noting the movement of spot images by the lenslet array. The frame rate of the driving software is about 70 fps, depending on the control parameters. The characteristics of MEMS deformable mirror was measured which includes the voltage-to-deflection relation, influence function, and cross-talk. The total system is operated under closed-loop control for the artificial phase disturber and the wavefront is found to be compensated successfully.

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Hardware in Loop Simulation on Autopilot Controller with MEMS AHRS for High Speed Unmanned Underwater Vehicle (MEMS형 자세측정장치를 이용한 고속 기동 무인 잠수정 자율 조종 제어기에 대한 HILS)

  • Hwang, Arom;Yoon, Seon-Il;Song, Jee-Hun
    • Journal of Ocean Engineering and Technology
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    • v.26 no.5
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    • pp.81-86
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    • 2012
  • Unmanned underwater vehicles have many applications in scientific, military, and commercial areas because of their autonomy. In many cases, an underwater vehicle adopts a control algorithm based on a tactical inertial sensor for precise control. However, a control algorithm that uses a tactical inertial sensor is unsuitable for some underwater vehicle missions such as torpedo decoys. This paper proposes a control algorithm for an unmanned underwater vehicle that does not require precise control. The control algorithm proposed for an unmanned underwater vehicle adopts a low cost MEMS inertial sensor, and simulations using the specifications of the MEMS inertial sensor under development are performed to verify the control algorithm under a real environment. The results of these simulations are presented.

Multi-functional (Temperature, Pressure, Humidity) Sensor by MEMS technology (MEMS 기술을 이용한 온도, 압력, 습도 복합 센서)

  • Kwon Sang-wook;Won Jong-Hwa
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.11
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    • pp.1-8
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    • 2005
  • In this paper, we present design and prototyping of a low-cost, integrated multi-functional micro health sensor chip that can be used or embedded in widely consumer devices, such as cell phone and PDA, for monitoring environmental condition including air pressure, temperature and humidity. This research's scope includes basic individual sensor study, architecture for integrating sensors on a chip, fabrication process compatibility and test/evaluation of prototype sensors. The results show that the integrated TPH sensor has good characteristics of ${\pm}\;1\%FS$ of linearity and hysteresis for pressure sensor and temperature sensor and of ${\pm}\;5\%FS$ of linearity and hysteresis But if we use 3rd order approximation for humidity sensor, full scale error becomes much smaller and this will be one of our future study.

Fabrication of MEMS Test Socket for BGA IC Packages (MEMS 공정을 이용한 BGA IC 패키지용 테스트 소켓의 제작)

  • Kim, Sang-Won;Cho, Chan-Seob;Nam, Jae-Woo;Kim, Bong-Hwan;Lee, Jong-Hyun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.11
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    • pp.1-5
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    • 2010
  • We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.

Accelerometer Mixed Algorithm Using Fuzzy Technique

  • Jin, Yong;Cho, Sung-Yun;Park, Chan-Gook
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.141.6-141
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    • 2001
  • This paper presents the attitude algorithm using Fuzzy technique to mix gyro information with accelerometer. The attitude angle calculated by the low-cost gyros only increases its error with time rapidly because of the integration process of the algorithm and large sensor error. It is known that the accelerometer output includes the attitude information of a vehicle and its information is more effective during low dynamic maneuver. Therefore it is needed to combine two information appropriately for obtaining the attitude information from low-cost MEMS inertial sensors. Because Fuzzy logic is very effective to make a decision of maneuvering state, it is applied to the mixed algorithm. It is shown by experiment ...

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Thermocompression bonding for wafer level hermetic packaging of RF-MEMS devices (RF-MEMS 소자의 웨이퍼 레벨 밀봉 패키징을 위한 열압축 본딩)

  • Park, Gil-Soo;Seo, Sang-Won;Choi, Woo-Beom;Kim, Jin-Sang;Nahm, Sahn;Lee, Jong-Heun;Ju, Byeong-Kwon
    • Journal of Sensor Science and Technology
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    • v.15 no.1
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    • pp.58-64
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    • 2006
  • In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

Calibration of Inertial Measurement Units Using Pendulum Motion

  • Choi, Kee-Young;Jang, Se-Ah;Kim, Yong-Ho
    • International Journal of Aeronautical and Space Sciences
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    • v.11 no.3
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    • pp.234-239
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    • 2010
  • The utilization of micro-electro-mechanical system (MEMS) gyros and accelerometers in low-level inertial measurement unit (IMU) influences cost effectiveness in a positive way under the condition that device error characteristics are fully calibrated. The conventional calibration process utilizes a rate table; however, this paper proposes a new method for achieving reference calibration data from the natural motion of pendulum to which the IMU undergoing calibration is attached. This concept was validated with experimental data. The pendulum angle measurements correlate extremely well with the solutions acquired from the pendulum equation of motion. The calibration data were computed using the regression method. The whole process was validated by comparing the measurement from the 6 sensor components with the measurements reconstructed using the identified calibration data.