• Applied Biological Chemistry
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• v.44 no.3
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• pp.185-190
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• 2001

Alginate, a well-known biopolymer, is universally applied for immobilization of microbial cells. Biosorption characteristics of lead by waste biomass of immobilized A. niger beads, used in fermentation industries to produce citric acid, were studied. The immobilized A. niger beads, prepared via capillary extrusion method using calcium chloride, were applied in the removal of lead. Pb uptake was the highest in A. niger beads cells grown for 3 days with medium producing citric acid (12% sucrose, 0.5% $NH_4NO_3$, 0.1% $KH_2PO_4$, and 0.025% $MgSO_4$). Lead uptake by the immobilized A. niger beads and free A. niger mycellia beads increased sharply with time. However, while uptake by the immobilized A. niger beads continued to increase slowly, that by free A. niger mycellia beads stopped after 30 min. The optimum pH and temperature of lead uptake were found to be 6 and $35^{\circ}C$, respectively. The maximum uptake of lead was achieved with $50{\sim}100$ beads and 50 ml lead solution in a 250-ml Erlenmeyer flask, while, at over 100 beads, uptake of the lead decreased. The order of biosorption capacity for heavy metals was Pb>Cu>Cd. Pb uptake capacity of the immobilized A. niger beads treated with 0.1 M $CaCI_2$, 0.1 M NaOH, and 0.1 M KOH decreased compared to the untreated beads. On testing the desorption of Pb from the immobilized A. niger beads, re-uptake of Pb was found possible after desorption of the binding metal with 0.1 M HCI.

• Nuclear Engineering and Technology
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• v.51 no.3
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• pp.860-866
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• 2019

The lead element or its salts are good radiation shielding materials. However, their toxic effects are high. Due to less toxicity of bismuth salts, the radiation shielding properties of the bismuth salts have been investigated and compared to that of lead salts to establish them as a better alternative to radiation shielding material to the lead element or its salts. The transmission geometry was utilized to measure the mass attenuation coefficient (${\mu}/{\rho}$) of different salts containing lead and bismuth using a high-resolution HPGe detector and different energies (between 81 and 1333 keV) emitted from point sources of $^{133}Ba$, $^{57}Co$, $^{22}Na$, $^{54}Mn$, $^{137}Cs$, and $^{60}Co$. The experimental ${\mu}/{\rho}$ results are compared with the theoretical values obtained through WinXCOM program. The theoretical calculations are in good agreement with their experimental ones. The radiation protection efficiencies, mean free paths, effective atomic numbers and electron densities for the present compounds were determined. The bismuth fluoride ($BiF_3$) is found to have maximum radiation protection efficiency among the selected salts. The results showed that present salts are more effective for reducing the intensity of gamma photons at low energy region.

• Korean Journal of Materials Research
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• v.15 no.10
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• pp.639-643
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• 2005

Lead-free $[Bi_{0.5}(Na_{1-x}K_x)_{0.5}TiO_3](x=0\~1.0)$ ceramics were prepared using a solid state reaction method and their structural and electrical characteristics were investigated. X-ray investigations indicated that the rhombohedral-tetragonal morphotropic phase boundary(MPB) of the $[Bi_{0.5}(Na_{1-x}K_x)TiO_3$ ceramics exists in the range of $x=0.16\~0.20$. The optimum values of piezoelectric constant$(d_{33})$, dielectric constant, and electromechanical coupling factor $(k_p)$ were obtained at $x=0.16\~0.20$ of the MPB region.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.617-621
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• 2010

($K_{0.5}Na_{0.5}$)($Nb_{0.96}Sb_{0.04}$)$O_3$+1.2 mol% $K_4CuNb_8O_{23}$ ceramics doped with iron oxide ($Fe_2O_3$) were prepared by a conventional mixed oxide method. And then, their piezoelectric and dielectric properties were investigated as a function of $Fe_2O_3$ addition. X-ray diffraction studies reveal that $Fe^{3+}$ diffuses into the NKN lattices to form a solid solution with a pure perovskite structure at room temperature. At the sintering temperature of $1,060^{\circ}C$, when 0.2 mol% $Fe_2O_3$ was doped, the piezoelectric constant ($d_{33}$), electromechanical coupling factor (Kp), and mechanical quality factor ($Q_m$) showed the excellent values of 131.67 pC/N, 0.436, and 696.36, respectively. Results show that $Fe_2O_3$ deped ($K_{0.5}Na_{0.5}$)($Nb_{0.96}Sb_{0.04}$)$O_3$+1.2 mol% $K_4CuNb_8O_{23}$ lead-free piezoelectric ceramics are a promising lead free material for piezoelectric transformer applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.1
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• pp.37-44
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• 2020

This study investigated the microstructure and piezoelectric properties of lead-free 0.74(Bi_1/2Na_1/2)TiO₃-0.26SrTiO₃ (BNST26) piezoelectric ceramics sintered using a microwave furnace. For comparison, specimens were also prepared using a conventional furnace sintering (CFS). Average grain sizes of 2.4 ㎛ and 3.2 ㎛ were obtained in the sample sintered at 1,100℃ for 5 min using microwave sintering (MWS) and at 1,175℃ for 2 h using CFS, respectively. To quantify the changes in the microstructures and electrical properties according to the sintering conditions, the polarization hysteresis, bipolar and unipolar strain curves, and temperature dependence of permittivity were evaluated. As a result, it was determined that the P_max (maximum polarization), P_r (remanent polarization) and S_max (maximum strain) values tend to increase with the average grain size. Based on these results, it is concluded that the MWS method can produce lead-free ceramics with superior performance in a relatively short time compared to the conventional CFS method.

• Journal of the Korean Ceramic Society
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• v.52 no.4
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• pp.237-242
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• 2015

$Bi_{0.5}(Na_{0.78}K_{0.22})_{0.5}TiO_3$ (BNKT) lead-free piezoelectric ceramics modified by $LaMnO_3$ (LM) were fabricated by conventional solid-state method. The crystal structure and the morphology of the lead free ceramics were analyzed by XRD (X-ray diffraction) and FE-SEM (Field Emission Scanning Electron Microscopy). The LM modified BNKT ceramics have a phase transition from ferroelectric tetragonal to non-polar pseudo-cubic. Despite decreases in the remnant polarization ($P_r$) and coercive field ($E_c$) in the P-E hysteresis loops, the electric-field induced strain properties were significantly enhanced by the LM modification. The highest value of $S_{max}/E_{max}=412pm/V$ at an applied electric field of 5 kV/mm was found in BNKT-0.01LM ceramic.

• Journal of the Korean Ceramic Society
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• v.50 no.2
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• pp.157-162
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• 2013

The need for lead-free piezoceramics has caused a renewal of interest in $BaTiO_3$-based systems. Recently, it was found that ceramics in the $(Ba,Ca)(Zr,Ti)O_3$ system have properties comparable to those of $Pb(Zr,Ti)O_3$. However, these ceramics require rather high sintering temperatures of $1450-1550^{\circ}C$. In this work, the effect of $TiO_2$ and CuO addition on the sintering behavior, microstructure, dielectric and piezoelectric properties of $(Ba_{0.85}Ca_{0.15})(Zr_{0.1}Ti_{0.9})O_3$ (BCTZ) ceramics will be discussed. BCTZ ceramics were prepared by the mixed oxide route and 1 mol % of $TiO_2$ or CuO was added. Undoped and doped ceramics were sintered at $1350^{\circ}C$ for 1-5 h. CuO was found to be a very effective sintering aid, with samples sintered for 1 h at $1350^{\circ}C$ having a bulk density of 95% theoretical density; however the piezoelectric properties were greatly reduced, probably due to the small grain size.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.10
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• pp.771-775
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• 2010

In this study, piezoelectric and dielectric properties of the $(Na_{0.5}K_{0.5})NbO_3-(1-x)(Bi_{0.5}Na_{0.5})TiO_3-xBaTiO_3$ [NKN-(1-x)BNT-xBT] ceramics were investigated. The lead-free NKN-(1-x)BNT-xBT ceramics were fabricated by a conventional mixed oxide method. The results indicate that the addition of $BaTiO_3$ significantly influences the sintering, microstructure, phase transition and electrical properties of NKN-BNT ceramics. A gradual change in the piezoelectric and dielectric properties was observed with the increase of BT contents. The dielectric constant, piezoelectric constant ($d_{33}$) and electromechanical coupling factor ($k_p$) increased at the morphotropic phase boundary (MPB). The $d_{33}$=184 pC/N, $k_p$=0.38, dielectric constant=1455 with dielectric loss value of less than 1% were obtained for the NKN-0.95BNT-0.05BT ceramics sintered at $1150^{\circ}C$ for 2h. These results demonstrate that the NKN-(1-x)BNT-xBT ceramics is an attractive candidate for lead-free piezoelectric materials.