• 한국세라믹학회지
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• 제56권6호
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• pp.549-557
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• 2019

More than two decades of world-wide research efforts have resulted in several classes of potentially important materials. Among them are incipient piezoelectrics, which are especially useful for actuator applications. However, relatively large electric fields are required for activating the large incipient electromechanical strains. So far, many attempts have been made to reduce the required electric field by intentionally inhomogenizing the electric field distribution in the microstructure through core-shell and composite approaches. Here, we show that electric field concentration can be realized simply by adjusting electrode patterns. We have investigated the effect of electrode patterning on the incipient electromechanical strain properties of an exemplarily chosen lead-free relaxor system, revealing that electrode patterning does have a significant role on the strain properties of the given lead-free relaxor system. We believe that this approach would make a new strategy for ones to consider bringing the functional properties of electroceramics beyond their conventional limit.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.184-184
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• 2009

Lead-free Piezoelectric $[Li_{0.04}(Na_{0.44}K_{0.56})](Nb_{0.88}Ta_{0.1}Sb_{0.02})$ (abbreviated as NKNLTS) has been synthsized by conventional mixed oxide method traditional ceramics process without cold-isostatic pressing. Effect of $Bi_2O_3$ addition on NKNLTS ceramics was investigated. Piezoelectric properties of the ceramic were varied with the amount of $Bi_2O_3$ addition and showed the maximum Kp value at 0.4wt% $Bi_2O_3$ addition. The results show that the optimum poling condition for NKNLTS ceramics of 3.5kV/mm, poling temperature of $120^{\circ}C$ and poling time of 30min. At the sintering temperature of $1100^{\circ}C$ and the calcination temperature $800^{\circ}C$, the optimal values of density=$4.7g/cm^2$, Kp=0.44, $\varepsilon_r$=1309 were obtained. Consequently, lead free piezoelectric ceramics with the excellent piezoelectric could be fabricated using a conventional mixed oxide process and the optimal manuacturing condition of those was obtained.

• 한국전기전자재료학회논문지
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• 제20권1호
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• pp.25-30
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• 2007

In this paper, lead-free [$Li_{0.04}(Na_{y}K_{1-y})_{0.96}](Nb_{0.86}Ta_{0.1}Sb_{0.04})O_{3}$ (y=0.4 - 0.58) ceramics were manufactured using conventional miked oxide method for acoustic emission(AE) sensor application and their dielectric and piezoelectric properties were investigated with the variations of Na/K ratio. The samples in the composition Na/K=54/46 exhibited excellent electrical properties of $d_{33}=300$ PC/N and kp=0.49. Taking into consideration above piezoelectric properties, it can be concluded that the [$Li_{0.04}(Na_{y}K_{1-y})_{0.96}](Nb_{0.86}Ta_{0.1}Sb_{0.04})O_{3}$ system ceramics are the promising lead-free materials capable of substituting PZT system ceramics.

• Journal of Welding and Joining
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• 제24권6호
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• pp.21-27
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• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• Journal of Welding and Joining
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• 제33권3호
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• 한국방사선학회논문지
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• 제11권4호
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• pp.189-195
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• 2017

방사선 특히, 엑스선 또는 감마선으로부터 인체를 보호하기 위해 납(Pb)으로 된 보호 장구를 광범위하게 사용해왔다. 최근 납 중독 및 환경오염의 문제로 납을 대신하는 무연 방사선 차폐재의 개발이 활발히 이루어지고 있다. 차폐재의 성능 확보를 위해서는 제작 및 평가의 순환 사이클을 반복하게 된다. 본 연구는 실제 무연 방사선 차폐소재의 제작에 앞서 차폐재의 성능을 몬테카를로 전산모사를 통해 확인함으로써 가능한 차폐소재의 조합을 연구하였다. 방사선 차폐소재의 평가에 사용되는 조건으로 엑스선관을 Geant4를 이용하여 전산모사하고 획득된 광자 스펙트럼을 이용하여 텅스텐과 비스무스의 조합에 따른 차폐소재의 성능을 평가하였다. 차폐소재의 공극에 따른 성능 저하도 평가하였다. 방사선 차폐 소재 개발 시 공극률을 줄이는 것이 중요한 인자라는 것을 알 수 있었다.

• 한국재료학회지
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• 제25권6호
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• pp.288-292
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• 2015

New lead-free piezoelectric ceramics $0.96[\{Bi_{0.5}(Na_{0.84}K_{0.16})_{0.5}\}_{1-x}La_x(Ti_{1-y}Nb_y)O_3]-0.04SrTiO_3$ (BNKT-ST-LN, where $x=y=0.00{\leq}(x=y){\leq}0.015)$ were synthesized using the conventional solid-state reaction method. Their crystal structure, microstructure, and electrical properties were investigated as a function of the La and Nb (LN) content. The X-ray diffraction patterns revealed the formation of a single-phase perovskite structure for all the LN-modified BNKT-ST ceramics in this study. The temperature dependence of the dielectric curves showed that the maximum dielectric constant temperature ($T_m$) shifted towards lower temperatures and the curves became more diffuse with an increasing LN content. At the optimum composition (LN 0.005), a maximum value of remnant polarization ($33C/cm^2$) with a relatively low coercive field (22 kV/cm) and high piezoelectric constant (215 pC/N) was observed. These results indicate that the LN co-modified BNKT-ST ceramic system is a promising candidate for lead-free piezoelectric materials.

• 한국재료학회지
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• 제25권10호
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• pp.566-570
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• 2015

$Bi_{0.5}Na_{0.5}TiO_3$ (BNT) based ceramics are considered potential lead-free alternatives for $Pb(Zr,Ti)O_3$(PZT) based ceramics in various applications such as sensors, actuators and transducers. However, BNT-based ceramics have lower electromechanical performance as compared with PZT based ceramics. Therefore, in this work, lead-free bulk $0.99[(Bi_{0.5}Na_{0.5})_{0.935}Ba_{0.065}]_{(1-x)}La_xTiO_3-0.01SrZO_3$ (BNBTLax-SZ, with x = 0, 0.01, 0.02) ceramics were synthesized by a conventional solid state reaction The crystal structure, dielectric response, degree of diffuseness and electric-field-induced strain properties were investigated as a function of different La concentrations. All samples were crystallized into a single phase perovskite structure. The temperature dependent dielectric response of La-modified BNBT-SZ ceramics showed lower dielectric response and improved field-induced strain response. The field induced strain increased from 0.17%_for pure BNBT-SZ to 0.38 % for 1 mol.% La-modified BNBT-SZ ceramics at an applied electric field of 6 kV/mm. These results show that La-modified BNBT-SZ ceramic system is expected to be a new candidate material for lead-free electronic devices.

• 한국재료학회지
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• 제21권11호
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• pp.628-633
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• 2011

Studies on lead-free piezoelectrics have been attractive as means of meeting environmental requirements. We synthesized lead-free piezoelectric $(Bi_{1/2}Na_{1/2})TiO_3-Ba(Cu_{1/3}Nb_{2/3})O_3$ (BNT-BCN) ceramics, and their dielectric, piezoelectric, and strain behavior were characterized. As BCN with a tetragonal phase was incorporated into the rhombohedral BNT lattice, the lattice constant increased. A small amount of BCN increased the density and dielectric constant forming the complete solid solution with BNT. However, BCN above 10 mol% was precipitated into a separate phase, and which was detected with XRD. In addition, EDX measurement revealed that Cu in BCN was not distributed homogeneously but was accumulated in a certain area. A lower density with a large amount of BCN was attributed to the nonsinterable property of BCN with large tetragonaliy. The dielectric constant vs the temperature change and the strain vs the electric field indicated that the ferroelectric property of BNT was diminished and paraelectric behavior was enhanced with the BCN addition. BNT-7.5BCN showed a 0.11% unimorph strain with a 9.0 kV/mm electric field with little hysteresis.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.79-92
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• 2004

RoHS compliant products are now being mass-produced. Eco-product(Pb-free+RoHS compliant+Halogen-free) will be possible from 2005. Pb-free flip chip will be qualified by 2004. 4Q. Lead Finish: SnBi-Under mass production Pd PPF-Under small production Matte Sn-will be internally qualified by 2004. 4Q Development of Pb-free Solder Ball: Stable Supply, Cost Down.