• The Journal of Asian Finance, Economics and Business
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• v.8 no.9
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• pp.113-119
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• 2021

With the increasing pressure of international competition, urban agglomeration cooperation and innovation had become an important means of regional economic development. This study analyzed the spatial characteristics of the Urban Cooperative Innovation Network in Guangdong-Hong Kong-Macao Greater Bay Area, found out the dynamic evolution law of innovation, provided suggestions for policy management departments, and effectively planned the industrial layout. According to the data of the State Intellectual Property Office of China, this study researched invention patents from 2005 to 2019. This paper constructed the urban cooperative innovation network, and took 11 cities in the bay area as the research objects, and used social network analysis to study the spatial structure and dynamic evolution of the urban innovation network. Every indicator reflected the urban cooperative innovation, but they all showed a certain decline in 2008-2010. And it is inferred that the innovation network space of each city will be "obvious fist advantages, significant spillover effect and weakening role of Hong Kong and Macao". This paper divided urban cooperative innovation of Guangdong-Hong Kong-Macao Greater Bay Area into three stages. Summing up the characteristics of each stage is helpful to recognize the changes of urban cooperative innovation and to do a good job in industrial layout planning.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.13-16
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• 2001

InP/InGaAs Heterojunction phototransistors(HPT's) with an optically transparent ITO emitter electrode were fabricated and characterized. At the same time, heterojuntion transistors(HBT's) having the same device layout were fabricated. By comparison with InP/InGaAs HBT's, the do characteristics of InP/InGaAs HPT's showed the similar electrical charateristics of HBT's. the model parameters of the device were extracted and compared.

• Korean journal of food and cookery science
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• v.19 no.4
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• pp.477-492
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• 2003

The purposes of the study were to establish HACCP-based standards and guidelines for conducting a plan review to build, or renovate, hospital food service establishments, and ensure the safety of foodservice and reduce the risk of food borne illness. The scope of the study included suggestion for the planning of hospital foodservice facilities: layout, design, equipment and modeling. The results of this study can be summarized as follows: 1) The development of a foodservice facility plan based on the results of a survey, literature reviews and the results of interviews with foodservice managers from 9 general hospitals. This was composed of operational policies in foodservices, layout characteristics, space allocation, selection, design, specification standards for equipment and the construction principles of foodservice facilities. 2) Two foodservice facility models were developed, one for general hospitals with 900 beds (2,000 patients and 2,500 employee meals per day) and the other for general hospitals with 300 beds (600 patients and 650 employees meals per day). 3) The suggested kitchen space requirements for the foodservice facility models were 341.2 ㎡ (W 17,100mm x L 23,700mm) and 998.8㎡ (W 35,600mm x L 32,800mm) for the 300 and 900 beds hospitals, respectively, with both designs being rectangular. The space requirements for the equipment, in relation to the total operational area, in terms of ratios were 1:3.5 and 1:3.8 for the 300 and 900 beds hospitals, respectively. The recommended space allowances per bed for the developed foodservice facility models were 1.15 ㎡ and 1.11 ㎡ for the 300 and 900 beds hospitals, respectively, which were increased by more than 30% compared to those suggested in the precedent study, and considered appropriate for the implementation of the HACCP system. 4) The hospital foodservice facilities plans and models were developed based on the general sanitation standards, guidelines and the HACCP system, and included foodservice facility layout, product flow, physical separation between contaminated and sanitary areas, foodservice facility specifications with a 1/300 scale for a 300 bed, and a 1/400 scale for a 900 beds blueprint. 5) The main features of the developed foodservice facility plans and models were; physical separation between contaminated and sanitary areas to prevent cross contamination, product flow in one direction from the arrival of the raw material to the finished product, and separation of different work areas and the process of receiving & preparation of products, refrigeration & storage, cooking, assembly, cleaning & disinfection, employee areas and janitorial facilities. The proposed models from this study were presented as examples for those wanting to build, or renovate, their facility for the production of foods.

• Korean Institute of Interior Design Journal
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• v.22 no.2
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• pp.220-229
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• 2013

Recently, the volume of knowledge information in the form of electronic media is quickly increasing in the library field along with the advancement of electronic communication technology. Libraries have both printed data and electronic data and are faced with the issue of corresponding with the access and use of knowledge information in terms of the space. This study is for building the layout of a sustainable knowledge information space based on the view that the library is the official infrastructure of the knowledge information based society. It is intended to analyze the meaning of knowledge information in the modern society, characteristics in the spatial organization and the transmission of knowledge information. The goal of this study is to understand and forecast the spatial structure where users access knowledge information and exchange with one another and developing the direction and guidelines for the spatial plan that today's libraries prefer through this analysis. For this, this study firstly prepared the base for the research on library space which can be considered as the physical realization of such concepts, through the theoretical review about the knowledge information and social concepts as well as characteristics of modern society. Also, it seized the characteristics in the transmission of knowledge information by conducting a structural analysis of the information service such as knowledge information and space, space and information media, space and space through the cases of 10 public libraries. The analysis resulted in basic data including the system of organizing knowledge information, system of knowledge information transferring elements and structure, and layout pattern of each library. These results are deemed meaningful for the promotion of communication with the user through the exchange, creation, and experience of knowledge information, the social role of today's public library.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.2
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• pp.639-643
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• 2018

As electronic systems become smaller and more portable, the need for power conversion continues to increase. In addition, system stability must be ensured from switching noise due to power conversion efficiency and power conversion system miniaturization. Therefore, countermeasures to reduce switching noise during power conversion are essential. In this paper, a DC/DC buck converter circuit is constructed, and the characteristics of switching noise generated when changing the parts layout in a four-layer printed circuit board (PCB) structure with a reference plane are compared and analyzed. In addition, switching noise characteristics were compared and analyzed through simulations when the parts layout was different in a two-layer PCB structure from which the reference planes were removed. As a result, it was confirmed that the radiated emissions characteristic is reduced by 12dB and the conducted emissions characteristic decreased by 7dB to 8dB, according to the current return path in the four-layer PCB structure. Thus, it was confirmed that the noise characteristics can be improved according to the configuration of the current return path when the power conversion circuit is designed.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.48 no.10
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• pp.1317-1326
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• 1999

As the integration ratio and operation speed increase, it has become an important problem to estimate the dissipated power during the design procedure as a method to reduce the TTM(time to market). This paper proposed a prediction model to estimate the maximum dissipated power of a CMOS logic gate. This model uses a calculational method. It was formed by including the characteristics of MOSFETs of which a CMOS gate consists, the operational characteristics of the gate, and the characteristics of the input signals. As the modeling process, a maximum power estimation model for CMOS inverter was formed first, and then a conversion model to convert a multiple input CMOS gate into a corresponding CMOS inverter was proposed. Finally, the power model for inverter was applied to the converted result so that the model could be applied to a general CMOS gate. For experiment, several CMOS gates were designed in layout level by $0.6{\mu}m$ layout design rule. The result by comparing the calculated results with those from HSPICE simulations for the gates showed that the gate conversion model has within 5% of the relative error rate to the SPICE and the maximum power estimation model has within 10% of the relative error rate. Thus, the proposed models have sufficient accuracies. Also in calculation time, the proposed models was more than 30 times faster than SPICE simulation. Consequently, it can be said that the proposed model could be used efficiently to estimate the maximum dissipated power of a CMOS logic gate during the design procedure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.5
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• pp.296-300
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• 2021

The performance of devices has been improved with fine processes from planar to three-dimensional transistors (e.g., FinFET, NWFET, and MBCFET). There are some problems such as a short channel effect or a self-heating effect occur due to the reduction of the gate-channel length by miniaturization. To solve these problems, we compare and analyze the electrical and thermal characteristics of FinFET and GAAFET devices that are currently used and expected to be further developed in the future. In addition, the optimal structure according to the Fin shape was investigated. GAAFET is a suitable device for use in a smaller scale process than the currently used, because it shows superior electrical and thermal resistance characteristics compared to FinFET. Since there are pros and cons in process difficulty and device characteristics depending on the channel formation structure of GAAFET, we expect a mass-production of fine processes over 5 nm through structural optimization is feasible.

• Archives of design research
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• v.12 no.4
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• pp.294-303
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• 1999

With the breakthrough development of computing environment, the design phases have been changed a lot nowadays. In the case of prior phases of transportation design such as cars and forklift-trucks design, designers have depended on surveys and 2D line drawings for fixing a product layout and extracting ergonomic data. In this method, designers don't meet only the problem of reliability of measuring data but also, the problems of unknown situation of operators' fatigue and comfort in work situation. In these methods, it has much less creditability to have a 2D human model to check the real world motion due to the limitation of the 3 Dimension. Even though with a 2D human model, perfect layout is determined, it is still difficult to measure about comfort and fatigue for a user because it measuring an analysing method is static. The development of computer hardware and software have not only changed the flow in the social-wide range but also immerged design into Virtual Environment. In conventional design method, visualization and data transferring have been the main issues but, in virtual environment, determining of design layout and analysing ergonomic data with sophisticated feeling about comfort and fatigue are possible by using 3D virtual human. In this study, the general characteristics of virtual environment was discussed and the possibility of digital process of design was treated. For these studies, layout design for forklift-trucks was tested. Eventually, the merits of each design phase applied virtual environment are discussed.

• ETRI Journal
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• v.21 no.4
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• pp.83-93
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• 1999

This paper examines the correlations between user characteristics and their perferences for two selected features of Web-based OPAC systems. User characteristics identified in this study were age, gender, educational status, computer skills and OPAC experience. Usability features included interaction styles, character and image on screen, browsing and navigating style, screen layout, and ease of learning, whereas availability features attended to availability of information, quality of information and up-to-date information. Individual variables and features are described, and the correlation between the variables and the features are explored using Pearson's correlation coefficient(r). Although based on a small-scale sample survey, a considerably large number of statistically significant correlations were found between the users' characteristics and the selected evaluation features of interactive Web-based OPACs. From these observations, it seems to be suitable to recommend that system designers should make a more considered appraisal of the users' demographic characteristics in the design of the new generation of OPAC such as in user-tailored interactive Web-based OPAC systems.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.