• Title/Summary/Keyword: layer-removal method

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Measurement of Residual Stress Distribution in Injection-Molded Short Fiber Composites (단섬유 복합재료 사출성형물의 잔류응력 측정)

  • 김상균;이석원;윤재륜
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2001.10a
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    • pp.61-63
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    • 2001
  • Residual stress distribution in injection-molded short fiber composites was determined using layer-removal method. Polysterene with 3 vol% carbon fibers was injection-molded into the tensile specimen. With milling machine layer-removal process was conducted and the curvature data were acquired. Treuting and Read analysis which is assuming isotropic material, and White analysis considering anisotropy due to the fiber orientation were used to calculate residual stress of the flow direction through the thickness direction and compared with each other.

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Comparison of Filtration Resistances according to Membrane Cleaning Methods (막표면의 케이크층 세정 방법에 따른 여과 저항값 비교)

  • Han, Song-Hee;Chang, In-Soung
    • Journal of Environmental Science International
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    • v.25 no.6
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    • pp.817-827
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    • 2016
  • The resistance in series model has been frequently used for determination of various filtration resistance to correctly understand the membrane fouling behaviour in MBR (membrane bio-reactor) for wastewater treatment. The cake layer resistance ($R_c$) which is commonly determined by calculation of flux dataset that are obtained empirically before and after removing the cake layer on membrane surface. However, the calculated Rc values are very dependent on the cleaning methods adapted for removal of cake layer. This study investigated how the various cleaning options affect $R_c$. Seven different cleaning methods were employed: i) ultrasonication (100 W, 10 min), ii) ultrasonication (200 W, 60 min), iii) ultrasonication (400 W, 120 min), iv) water rinsing in a shaker (100 rpm, 10 min), v) water rinsing in a shaker (300 rpm, 60 min), vi) water rinsing, vii) sponge scrubbing. For the hydrophilic PES membrane, the cake layer removal efficiencies ranged from 64% to 10%, indicating that the removal of cake layer was highly dependent on the cleaning options. For the hydrophobic PVDF membrane, the cake layer removal efficiencies ranged from 79% to 97%. Consequently, a standardized method for cake layer removal to determine cake resistance ($R_c$) is needed for correct interpretation of the fouling phenomena.

Characterization of the Bacterial Community in a Biocover for the Removal of Methane, Benzene and Toluene (메탄, 벤젠 및 톨루엔 제거용 바이오커버의 세균 군집 특성)

  • Ryu, Hee-Wook;Cho, Kyung-Suk
    • Microbiology and Biotechnology Letters
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    • v.40 no.1
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    • pp.76-81
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    • 2012
  • Removal of methane, benzene and toluene was evaluated in a lab-scale biocover packed with a soil mixture of forest soil and earthworm cast (75:25 weight ratio). The bacterial community in the biocover was characterized using quantitative real-time PCR and terminal restriction fragment length polymorphism. Methane was removed at the upper layer of the biocover (-0.1 ~ -0.4 m), where the oxygen concentration was remarkably lower. The average removal efficiencies for methane and benzene/toluene were 90% and 99%, respectively. The pmoA gene copy numbers, responsible for methane oxidation, in the upper layer were higher than those in the lower layer. While type I methanotrohs dominated the lower layer, type II methanotrophs, such as Methylocystis and Methylosinus, were noted to be predominant in the upper layer. Benzene and toluene were removed from the lower layer (-0.6 ~ -0.9 m) as well as the upper layer. Moreover, the tmoA gene copy number, responsible for benzene/toluene oxidation, seen in the upper layer was not significantly different from those seen in the lower layer. These results suggest that a biocover packed with a soil and earthworm cast mixture is a promising method which could be utilized for the control of methane and volatile organic compounds such as benzene and toluene.

A Study on the Realization of the High Efficiency LCD Photoresist Removal Technology (고효율 LCD 감광막 제거기술 구현 연구)

  • Son, Young-Su;Ham, Sang-Yong;Kim, Byoung-Inn;Lee, Sung-Hwee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.11
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    • pp.977-982
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    • 2007
  • The realization of the photoresist(PR) removal method with vaporized water and ozone gas mixture has been studied for the LCD TFT array manufacturing. The developed PR stripper uses the water boundary layer control method based on the high concentration ozone production technology. We develop the prototype of PR stripper and experiment to find the optimal process parameter condition like as the ozone gas flow/concentration, process reaction time and thin boundary layer formation. As a results, we realize the LCD PR strip rate over the 0.4 ${\mu}m/min$ and this PR removal rate is more than 5 times higher than the conventional immersion type ozonized water process.

Determination of Residual-Stress Distribution in Engineering Plastics (공업용 플라스틱 성형품에 대한 잔류응력의 측정)

  • Kim, Chae-Hwan;Youn, Jae-Ryoun
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.132-135
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    • 2006
  • Injection molding is a flexible production technique for the manufacturing of polymer products, but introduces residual stresses. Residual stresses in a structural material or component are those stresses which exist in the object without other external loads. The layer removal and hole drilling method are used for the measurement of residual stress in injection molded polystyrene part. The hole drilling method is potentially more flexible for determining residual stress in complex geometries and can be used as an adoptable technique for the measurement of residual stress in polymeric materials. Results obtained by experiments agree with each other.

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Basic Study on the Improvement of Material Removal Efficiency of Sapphire CMP Using Electrolytic Ionization and Ultraviolet Light (전해 이온화와 자외선광을 이용한 사파이어 화학기계적 연마의 재료제거 효율 향상에 관한 기초 연구)

  • Park, Seonghyun;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.37 no.6
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    • pp.208-212
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    • 2021
  • Chemical mechanical polishing (CMP) is a key technology used for the global planarization of thin films in semiconductor production and smoothing the surface of substrate materials. CMP is a type of hybrid process using a material removal mechanism that forms a chemically reacted layer on the surface of a material owing to chemical elements included in a slurry and mechanically removes the chemically reacted layer using abrasive particles. Sapphire is known as a material that requires considerable time to remove materials through CMP owing to its high hardness and chemical stability. This study introduces a technology using electrolytic ionization and ultraviolet (UV) light in sapphire CMP and compares it with the existing CMP method from the perspective of the material removal rate (MRR). The technology proposed in the study experimentally confirms that the MRR of sapphire CMP can be increased by approximately 29.9, which is judged as a result of the generation of hydroxyl radicals (·OH) in the slurry. In the future, studies from various perspectives, such as the material removal mechanism and surface chemical reaction analysis of CMP technology using electrolytic ionization and UV, are required, and a tribological approach is also required to understand the mechanical removal of chemically reacted layers.

Smear layer removal by different chemical solutions used with or without ultrasonic activation after post preparation

  • Poletto, Daniel;Poletto, Ana Claudia;Cavalaro, Andressa;Machado, Ricardo;Cosme-Silva, Leopoldo;Garbelini, Cassia Cilene Dezan;Hoeppner, Marcio Grama
    • Restorative Dentistry and Endodontics
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    • v.42 no.4
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    • pp.324-331
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    • 2017
  • Objectives: This study evaluated smear layer removal by different chemical solutions used with or without ultrasonic activation after post preparation. Materials and Methods: Forty-five extracted uniradicular human mandibular premolars with single canals were treated endodontically. The cervical and middle thirds of the fillings were then removed, and the specimens were divided into 9 groups: G1, saline solution (NaCl); G2, 2.5% sodium hypochlorite (NaOCl); G3, 2% chlorhexidine (CHX); G4, 11.5% polyacrylic acid (PAA); G5, 17% ethylenediaminetetraacetic acid (EDTA). For the groups 6, 7, 8, and 9, the same solutions used in the groups 2, 3, 4, and 5 were used, respectively, but activated with ultrasonic activation. Afterwards, the roots were analyzed by a score considering the images obtained from a scanning electron microscope. Results: EDTA achieved the best performance compared with the other solutions evaluated regardless of the irrigation method (p < 0.05). Conclusions: Ultrasonic activation did not significantly influence smear layer removal.

Polishing Characteristics of passivation layer by abrasive particles and slurry chemical in the Metal CMP process (금속 CMP 공정에서 연마제와 슬러리 케미컬에 의한 passivation layer의 연마특성)

  • Park, Chang-Jun;Seo, Yong-Jin;Lee, Kyoung-Jin;Jeong, So-Young;Kim, Sang-Yong;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.45-48
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    • 2003
  • The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on tungsten passivation layer in order to obtain higher removal rate (RR) and very low non-uniformity (NU%) during W-CMP process. In this paper, we investigated the effects of oxidizer on W-CMP process with three different kinds of oxidizers, such as $H_2O_2$, $Fe(NO_3)_3$, and $KIO_3$. In order to compare the removal rate and non-uniformity of three oxidizers, we used alumina-based slurry of pH 4. According to the CMP tests, three oxidizers showed different removal mechanism on tungsten surface. Also, the microstructures of surface layer by AFM image were greatly influenced by the slurry chemical, composition of oxidizers. The difference in removal rate and roughness of tungsten surface are believed to caused by modification in the mechanical behavior of $Al_2O_3$ abrasive particles in CMP slurry. Our stabilized slurries can be used a guideline and promising method for improved W-CMP process.

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THE STUDY ON THE REMOVAL TORQUE OF THE DIAMOND LIKE CARBON COATED TITANIUM ABUTMENT SCREWS (DLC 표면 처리에 따른 임플랜트 지대주 나사의 풀림 현상에 관한 연구)

  • Koak Jai-Young;Heo Seong-Joo;Chang Ik-Tae;Yim Soon-Ho;Lee Jong-Yeop;Lee Kwang-Ryeol
    • The Journal of Korean Academy of Prosthodontics
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    • v.41 no.2
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    • pp.128-135
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    • 2003
  • Statement of problem : Implant screw loosening remains a problem in implant prosthodontics. Some abutment screws with treated surfaces were introduced to prevent screw loosening and to increase preload. DLC(Diamond Like Carbon) film has similar properties on hardness, wear resistance, chemical stability, biocompatibility as real diamond materials. Purpose : The purpose of this study was to investigate the effect of lubricant layer on abutment screw and to discriminate more effective method between soft lubricant and hard lubricant to prevent screw loosening. Material and method : In this study, $1{\mu}m$ thickness DLC was used as protective, lubricating layer of titanium screws and 3 times removal torque was measured on the abutment screws to investigate the difference in 10 coated and 10 non-coated abutment screws. Results : The results indicated that the implants with DLC coating group were not more resistant to the applied force in screw loosening. At 32Ncm, the 3 times removal torque in DLC group were $27.75{\pm}2.89,\;25.85{\pm}2.35$ and $26.2{\pm}2.57$. The removal torque in no-coated abutment screws were $27.85{\pm}4.23,\;27.35{\pm}2.81$ and $27.9{\pm}2.31$, respectively. Conclusion : The lubricant layer used in this study was Diamond Like Carbon(DLC) and it have a properties of hard and stable layer. The DLC coating layer was hard enough to prevent distortion of screws in the repeated unscrewing procedure in clinical situation. The reduced friction coefficient in hard DLC layer was not effective to prevent screw loosening.

Measurement of residual stresses in injection molded short fiber composites considering anisotropy and modulus variation

  • Kim, Sang-Kyun;Lee, Seok-Won;Youn, Jae-Ryoun
    • Korea-Australia Rheology Journal
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    • v.14 no.3
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    • pp.107-114
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    • 2002
  • Residual stress distribution in injection molded short fiber composites is determined by using the layer-removal method. Polystyrene is mixed with carbon fibers of 3% volume fraction (4.5% weight fraction) in an extruder and the tensile specimen is injection-molded. The layer-removal process, in which removing successive thin uniform layers of the material from the surface of the specimen by a milling machine, is employed and the resulting curvature is acquired by means of an image processing. The isotropic elastic analysis proposed by Treuting and Read which assumes a constant Yaung’s modulus in the thickness direction is one of the most frequently used methods to determine residual stresses. However, injection molded short fiber composites experience complex fiber orientation during molding and variation of Yaung’s modulus distribution occurs in the specimen. In this study, variation of Yaung’s modulus with respect to the thickness direction is considered for calculation of the residual stresses as proposed by White and the result is compared with that by assuming constant modulus. Residual stress distribution obtained from this study shows a typical stress profile of injection-molded products as reported in many literatures. Young’s modulus distribution is predicted by using numerical methods instead of experimental results. For the numerical analysis of injection molding process, a hybrid FEM/FDM method is used in order to predict velocity, temperature field, fiber orientation, and resulting mechanical properties of the specimen at the end of molding.