1 |
Bruno Langlais David A., 'Ozone in Water Treatment; Application and Engineering', American Water Works Association Research Foundation, 1991
|
2 |
J. K. Tong, 'Cleaning Technology in Semiconductor Device Manufacturing', J. Ruzyllo and R. E. Novak, Editors, PV 92-12, p. 18, The Electrochemical Society Proceedings series, Pennington, NJ, 1992
|
3 |
S. Nelson, 'Ozonated Water for Wafer Cleaning and Photoresist Removal', Solid State Technology, p. 107, 1999
|
4 |
J. Cheng and D. Nemeth, 'The Study of Temperature Effect in Photoresist Stripping with DIO3 Process', Technical Report, Akrion, Allentown, PA, 1999
|
5 |
M. B. Chang, 'Experimental study on ozone synthesis via dielectric barrier discharge', Ozone Science and Engineering, Vol. 19, p. 241. 1997
DOI
ScienceOn
|
6 |
S. De Gendt, J. Wauters, and M. Heyns, 'A Novel Resist and Post-etch Residue Removal process using Ozonated Chemistry', Solid State Technology, p. 57, 1998
|
7 |
T. Abe and S. Ojima, 'Photoresist stripping using alkaline accelerator containing wetvapor', Solid State Phenomena, Vols. 76-77, p. 231, 2001
DOI
|
8 |
H. Abe and H. Iwamoto, 'Novel photoresist stripping technology using ozone/vapor water mixture', IEEE Trans. on semiconductor Manufacturing, Vol. 16, No. 3, p. 401, 2003
DOI
ScienceOn
|
9 |
손영수, 함상용, '오존/증기 혼합물을 이용한 고효율 반도체 감광막 제거기술', 한국전기전자재료학회 2006추계학술대회논문집, 19권, p. 22, 2006
|
10 |
손영수, '오존공정을 이용한 고효율 PR 제거 기술 연구', 대한전자공학회논문지, 44권, SD편, 1호, p. 22, 2007
과학기술학회마을
|