• Tribology and Lubricants
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• 제26권5호
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• pp.297-302
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• 2010

This study is focused on the resin layer formation of UV imprinting process by changing imprinting pressure and period. The mold shape is made for the process of window open over the pattern transfer area and the imprinting period is assigned as the time just before the UV light curing. The residual layer is measured by changing the imprinting period and pressure magnitude, and the measured data of residual layer provides useful information for the design of the process conditions of imprinting processes.

• 한국공작기계학회논문집
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• 제11권4호
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• pp.68-74
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• 2002

The FD process is analogous to the direct piston extrusion process where the cold feed filament acts as a piston extruding the molten filament from the heated liquefier through a nozzle. The extruded filament is deposited on top of futureless platform, where the liquefier and the nozzle move in X and Y direction control by computer based on the part geometry. After the first layer, the Z platform indexes down and the next layer get deposited on top of the first layer. the layer by layer building process introduces surface problem. This paper describes effect of slice interval of the parts built by fused deposition modelling rapid prototyping system.

• 융복합기술연구소 논문집
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• 제2권2호
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• pp.25-29
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• 2012

Micro machining technologies have been required to satisfy various conditions in a high-technology industry. Micro electrochemical process is one of the most precision machining methods. Micro electrochemical process has been divided into electrochemical etching through protective layer and electrochemical machining using ultrashort voltage pulses. Micro shaft can be fabricated by electrochemical etching. The various protective layers such as photo-resist, oxide layer and oxidized recast layer have been used to protect metal surface during electrochemical etching. Micro patterning on metal surface can be machined by electrochemical etching through protective layer. Micro hole, groove and structures can be easily machined by electrochemical machining using ultrashort voltage pulses. Recently, the groove with subnanometer was machined using AFM.

• 한국세라믹학회지
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• 제39권12호
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• pp.1177-1182
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• 2002

인산염 용액과의 반응으로 패각의 표면에 고 비표면적의 다공성 수산화아파타이트 층이 생성되는 거동을 정성적으로 관찰하였다. 수산화아파타이트의 생성기구는 패각 표면을 핵으로하는 용해-석출 반응으로 보이며 층의 생성은 다음의 과정에 의하였다. 1. 고상 표면 상의 고밀도 핵생성 및 성장 2. 결정의 접촉과 엉킴에 의한 미세 다공성 층의 형성 3. 층을 통한 용액의 확산과 내측으로의 층 두께의 성장

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.227-230
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• 2004

Phosphor layers on rear plate of PDP were formed via osmosis coating process in an attempt to improve thickness uniformity of phosphor layer and eventually to enhance luminance and its efficiency of plasma display panel. The phosphor layers were formed uniformly not only on the sidewalls of barrier ribs but also on the dielectric layer of rear plate by the process. The processing parameters affecting the thickness uniformity of the phosphor layer formed by the osmotic coating process were investigated.

• Journal of Welding and Joining
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• 제12권4호
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• pp.85-101
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• 1994

Effect of Cr, Cu and Ni metal powders addition on the alloyed layer of aluminum alloy (AC2B) has been investigated with the plasma transferred arc (PTA) overlaying process. The overlaying conditions were 125-200A in plasma arc current, 150mm/min in process speed and 5-20g/min in powder feeding rate. Main results obtained are summarized as follows: 1) It was made clear that formation of thick surface alloyed layer on aluminum alloy is possible by PTA overlaying process. 2) The range of optimum alloying conditions were much wider in case of Cu and Ni powder additions than the case of Cr powder addition judging from the surface appearance and the bead macrostructure. 3) Alloyed layer with Cu showed almost the homogeneous microstructure through the whole layer by eutectic reaction. alloyed layers with Cr and Ni showed needle-like and agglomerated microstructures, the structure of which has compound layer in upper zone of bead by peritectic and eutectic-peritectic reactions, respectively. 4) Microconstituents of the alloyed layer were analyzed as A1+CrA $l_{7}$ eutectics, C $r_{2}$al sub 11/, CrA $l_{4}$, C $r_{4}$A $l_{9}$ and C $r_{5}$A $l_{*}$ 8/ for Cr addition, Al+CuA $l_{2}$(.theta.) eutectics and .theta. for Cu addition, and Al+NiA $l_{3}$ eutectics. NiA $l_{3}$, N $i_{2}$A $l_{3}$ and NiAl for Ni addition. 5) Concerning defect of the alloyed layer, many blow holes were seen in Cr and Ni additions although there was lesser in Cu addition. Residual gas contents in blow hole for Cu and Ni alloyed layer were confirmed as mainly $H_{2}$ and a littie of $N_{2}$ Cracking was observed in compound zone of the alloyed layer in case of Cr and Ni addition but not in Cu alloyed layer.r.r.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.379-382
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• 2006

In this study, an attempt was made to form magnesium oxide layer via aqueous solution route of salt precipitation process. A layer with flake morphology was formed from the process and various dopants were added during the forming process. The films formed were characterized using SEM, XRD, and cathodoluminescence measurement. In addition, the discharge characteristics were evaluated using panel tests. The results indicate that MgO film can be formed via the aqueous solution process successfully, of which characteristics are comparable to those of MgO film formed by e-beam evaporation process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.268-271
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• 2005

Etch resistance of mask layer on silicon substrate modified by AFM-based Tribo-Nanolithography (TNL) in Aqueous Solution in an aqueous solution was demonstrated. n consists or sequential processes, nano-scratching and wet chemical etching. The simple scratching can form a mask layer on the silicon substrate, which acting as an etching mask. For TNL, a specially designed cantilever with diamond tip, allowing the formation of mask layer on silicon substrate easily by a simple scratching process, has been applied instead of conventional silicon cantilever fur scanning. This study demonstrates how the TNL parameters can affect the etch resistance of mask layer, hence introducing a new process of AFM-based maskless nanolithography in aqueous solution.

• 반도체디스플레이기술학회지
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• 제12권2호
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• pp.79-84
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• 2013

Nanoimprint lithography (NIL) is the next generation photolithography process in which the photoresist is dispensed onto the substrate in its liquid form and then imprinted and cured into a desired pattern instead of using traditional optical system. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper, with the rolling type imprinting process, a mold, placed upon the $2^{nd}$ generation TFT-LCD glass sized substrate($370{\times}470mm^2$), is rolled by a rubber roller to achieve a uniform residual layer. The prediction of residual layer thickness of the photoresist by rolling of the rubber roller is crucial to design the rolling type imprinting process, determine the rubber roller operation conditions-mpressing force & feeding speed, operate smoothly the following etching process, and so forth. First, using the elasticity theory of contact problem and the empirical equation of rubber hardness, the contact length between rubber roller and mold is calculated with consideration of the shape and hardness of rubber roller and the pressing force to rubber roller. Next, using the squeeze flow theory to photoresist flow, the residual layer thickness of the photoresist is calculated with information of the viscosity and initial layer thickness of photoresist, the shape of mold pattern, feeding speed of rubber roller, and the contact length between rubber roller and mold previously calculated. Last, the effects of rubber roller operation conditions, impressing force & feeding speed, on the residual layer thickness are analyzed with consideration of the shape and hardness of rubber roller.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.53-56
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• 2002

We have developed a Monte Carlo (MC) simulator for electron beam lithography in multi-layer resists and multi-layer substrates in order to fabricate and develop high-speed PHEMT devices for millimeter- wave applications. For the deposited energy calculation to multi-layer resists by electron beam in MC simulation, we modeled newly for multi-layer resists and heterogeneous multi-layer substrates. Using this model, we simulated T-gate or r-gate fabrication process in PHEMT device and showed our results with SEM observations.