• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.921-926
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• 1997

SOI(Silicon On lnsulator) technology is many advantages in the gabrication of MOS(Metal-Oxide Semiconductor) and CMOS(Complementary MOS) structures. These include high speed, lower dynamic power consumption,greater packing density, increased radiation tolearence et al. In smiple form of bonded SOL wafer manufacturing, creation of a bonded SOI structure involves oxidizing at least one of the mirror polished silicon surfaces, cleaning the oxidized surface and the surface of the layer to which it will be bonded,bringing the two cleanded surfaces together in close physical proximity, allowing the subsequent room temperature bonding to proceed to completion, and than following this room temperature joining with some form of heat treatment step,and device wafer is thinned to the target thickness. This paper has been performed to investigate the possibility of the bonded SOI wafer manufacturing Especially, we focused on the bonding quality and thinning method. Finally,we achieved the bonded SOI wafer that Si layer thickness is below 3 .mu. m and average roughness is below 5.angs.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.10
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• pp.774-781
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• 1991

A communication network protocol among programable devices built-i manufacturing field, MAP (Manufacturing Automation Protocol), has to provide the job transfer service carrying out a lot of jobs distributively, and the MMS( manufacturing message specification) defines the above application layer protocol. In this paper user software required in job transfer was implemented. So as to provide each service with compatibility and extension, each module was designed according to the functions. A method is selected in double-assigning their domain and program applicable even in complex process, which loads and proceeds several programs sequentially. In order to confirm the logical validity of the designed protocol, local applying test is accomplished for the application layer of response station. Modelling the job flow process, each serice module is verified with the I/O primitives.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.104-110
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• 2016

The process of three-dimensional (3D) printing (also known as "rapid prototyping" and "additive manufacturing") uses computer-created digital models to produce 3D objects with a desired shape by stacking materials through a layer-by-layer process. The industrial potential and feasibility of 3D printing technology were recently highlighted in President Obama's State of the Union address in 2013. Since his speech, worldwide investment in and attention toward 3D printing technology have increased explosively. In addition, a number of 3D printing technology-based start-up companies have been established and evaluated as emerging enterprises making successful business models. In this paper, successful start-up companies (domestic and overseas) based on 3D printing technology will be reviewed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.284-291
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• 2011

Numerical experiments on biological interfacial layer, DEJ by finite element software ABAQUS have been conducted to study its fracture behavior including crack bridging / arresting characteristics in the model. Crack growth simulation has been carried out by numerical tool, XFEM, devoted to study cracks and discontinuities. The fracture toughness of DEJ has been estimated before and after crack bridging. The implications of bridging in numerical study of fracture behavior of DEJ-like biological interface have been discussed. It has been observed that the results provided by the numerical studies without proper accommodation of bridging phenomenon can mislead. This study can be helpful for understanding the DEJ-like biological interface in terms of its fracture toughness, an important material characteristics. This property of the material is an important measure that has to be taken care during design and manufacturing processes.

• Smart Structures and Systems
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• v.29 no.6
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• pp.767-775
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• 2022

Metal additive manufacturing (AM), also known as metal three-dimensional (3D) printing, produces 3D metal products by repeatedly adding and solidifying metal materials layer by layer. During the metal AM process, products experience repeated local melting and cooling using a laser or electron beam, resulting in product defects, such as warpage, cracks, and internal pores. Such defects adversely affect the final product. This paper proposes the in situ monitoring-based warpage prediction of metal AM products with experimental feature extraction. The temperature profile of the metal AM substrate during the process was experimentally collected. Time-domain features were extracted from the temperature profile, and their relationships to the warpage mechanism were investigated. The standard deviation showed a significant linear correlation with warpage. The findings from this study are expected to contribute to optimizing process parameters for metal AM warpage reduction.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.126-129
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• 2001

LIPCA (LIghtweight Piezo-composite Curved Actuator) is an actuator device which is lighter than other conventional piezoelectric ceramic type actuator. LIPCA is composed of a piezoelectric ceramic layer and fiber reinforced light composite layers, typically a PZT ceramic layer is sandwiched by a top fiber layer with low CTE (coefficient of thermal expansion) and base layers with high CTE. LIPCA has curved shape like a typical THUNDER (thin-layer composite unimorph feroelectric driver and sensor), but it is lighter an than THUNDER. Since the curved shape of LIPCA is from the thermal deformation during the manufacturing process of unsymmetrically laminated lay-up structure, an analysis for the thermal deformation and residual stresses induced during the manufacturing process is very important for an optimal design to increase the performance of LIPCA. To investigate the thermal deformation behavior and the induced residual stresses of LIPCA at room temperature, the curvatures of LIPCA were measured and compared with those predicted from the analysis using the classical lamination theory. A methodology is being studied to find an optimal stacking sequence and geometry of LIPCA to have larger specific actuating displacement and higher force. The residual stresses induced during the cooling process of the piezo-composite actuators have been calculated. A lay-up geometry for the PZT ceramic layer to have compression stress in the geometrical principal direction has been designed.

• Journal of the Korea Safety Management & Science
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• v.25 no.1
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• pp.23-29
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• 2023

Among the Additive Manufacturing (AM) technologies, the Binder-Jetting printing technology is a method of spraying an adhesive on the surface of powder and laminate layer by layer. Recently, this technique has become a major issue in the production of large casting products such as ship-building, custom vehicles and so on. In this study, we performed research to make actual mold castings and increase mechanical property by using special sand and water-based binders. For use as a mold, it has a strength of more than 3MPa and permeability. Various experiments were carried out to obtain suitable them. The major process parameters were binder jetting volume, binder types, layer thickness and heat treatment condition. As a result of this study, the binder drop quantity was measured to be about 60 pico-liter, layer thickness was 100㎛ and the heat treatment condition was measured about 1,000℃ and compressive strength were measured to be more than 5MPa. The optimum condition of this experiment was established through actual casting of aluminum. The equipment used in this study was a Freeforms T400 model (SFS Co., Ltd.), and the printing area of 420 * 300 * 250mm and resolution of 600dpi can be realized.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.2
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• pp.52-55
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• 2006

The OLEDs(Organic Light-Emitting Diodes) structure organizes the bottom layer using glass, ITO(indium thin oxide), hole injection layer, hole transport layer, emitting material layer, electron transport layer, electron injection layer and cathode using metal. OLED has various advantages. OLEDs research has been divided into structural side and emitting material side. The amount of emitting light and luminescence efficiency has been improved by continuing effort for emitting material layer. The emitting light mechanism of OLEDs consists of electrons and holes injected from cathode and anode recombination in emitting material layer. The mobilities of injected electrons and holes are different. The mobility of holes is faster than that of electrons. In order to get high luminescence efficiency by recombine electrons and holes, the balance of their mobility must be set. The more complex thin film structure of OLED becomes, the more understanding about physical phenomenon in each interface is needed. This paper observed what the thickness change of hole transport layer has an affection through the below experiments. Moreover, this paper uses numerical analysis about carrier transport layer thickness change on the basis of these experimental results that agree with simulation results.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1040-1043
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• 2004

As time goes by, the market demand increases and each LCD panel manufacturing company makes every effort to produce more panels in a limited time. It is necessary to reduce the cost and time of production for the improvement of productivity in manufacturing companies. The increased speed of thin films growth used in the TFT process brings improvement of productivity but it is also accompanied by a drop in display quality due to a characteristic change of the thin film. So in our dissertation, we deal with the increased speed of a-Si layer growth and the proportioned a drop in characteristic quality. We discuss a drop in display quality by a characteristic change of a-Si layer and we propose a counter-plan through panel design improvement. We have already applied our plan to the 15" XGA panel and confirmed the improved result.

• Journal of Korean Institute of Industrial Engineers
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• v.24 no.1
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• pp.23-35
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• 1998

This article presents a network flow analysis to form flexible machine cells with minimum intercellular part moves and a neural network model to form part families. The operational sequences and production quantity of the part, and the number of cells and the cell size are taken into considerations for a 0-1 quadratic programming formulation and a network flow based solution procedure is developed. After designing the machine cells, a neural network approach for the integration of part families and the automatic assignment of new parts to the existing cells is proposed. A multi-layer backpropagation network with one hidden layer is used. Experimental results with varying number of neurons in hidden layer to evaluate the role of hidden neurons in the network learning performance are also presented. The comprehensive methodology developed in this article is appropriate for solving large-scale industrial applications without building the knowledge-based expert rule for the cellular manufacturing environment.