• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.58-62
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• 1995

Thermally stimulated currents have been measured to investigate the trap characteristics of the MONOS structures with the tunneling oxide layer of 27${\AA}$ thick nitride layer of 73${\AA}$ thick and blocking oxide layer of 40${\AA}$ thick. By changing the write-in voltage and the write-in temperature, peaks of the I-T characteristic curve due to the nitride bulk traps and the blocking oxide-nitride interface traps ware separated from each other experimentally. The results indicate that the nitride bulk traps are distributed spatially at a single energy level and the blocking oxide-nitride interface traps are distributed energetically at interface.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.815-818
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• 2001

The buckling of an orthotropic layer bonded to an isotropic half-space with an interface crack subjected to compressive load under plane strain is considered. Basic stability equations derived from the mathematical theory of elasticity are applied to describe the buckling behavior. A system of homogeneous Cauchy-type singular integral equations of the second kind is solved numerically by utilizing Gauss-Chebyshev integral formulae. Numerical results for the buckling load are presented for various delamination geometries and material properties of both the layer and half-space.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2000년도 가을 학술발표회 논문집
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• pp.665-672
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• 2000

The problems of discontinuous layer interface are very important in the algorithm and programming for the analysis of multi-layered consolidation using a numerical analysis, finite difference method(F.D,M.). Better results can be obtained by the process for discontinuous layer interface, since it can help consolidation analysis to model the actual ground Explicit method is simple for analysis algorithm and convenient for use except for applying the operator Crank-Nicolson method represents implicit method, which have different analysis method according to weighting factor. This method uses different algorithm according to dimension. And, this paper uses alternative direction implicit method. The purpose of this paper provides an efficient computer algorithm based on numerical analysis using finite difference method which account for multi-layered soils with confined aquifer to determine the degree of consolidation and excess pore pressures relative to time and positions more realistically.

• 한국전기전자재료학회논문지
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• 제14권7호
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• pp.578-583
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• 2001

The bushing for high voltage and large and power should endure weight of itself and force of pushing from contact with circuit breaker. Like this, epoxy mold bushing has to be strong without fault. However, the external circumstances and internal factors was caused by partial discharge, flashover and dielectric breakdown. Therefore, to remove external factor of defect and to prevent the internal cracks and cavity generated from the contraction on interface of Cu-Epoxy, we should form semi-conductive layer on Cu bar by carbon. Then, the PD properties and the insulation qualities of epoxy mold type bushing was able to improved by roles of cushions for the direction of diameter and by effects fo natural sliding like as separated from conductor for the direction of length. So, in this work, we could prove the method of semi-conductive layer in making the long conductor.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 추계학술발표대회 개요집
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• 공업화학
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• 제5권4호
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• pp.630-636
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• 1994

열화처리 후 고무와 황동이 피복된 강선코드의 접박계면 변화를 오제 광전자 분광기와 주사 전자현미경으로 조사하였다. 열열화 후에는 접착층의 부분 산화와 추가 성장이, 습윤열화 후에는 접착층과 황동의 부분 소실이, 동적열화 후에는 접착층의 파괴와 철심의 부식이 관찰되었다. 이러한 접착계면의 변화를 인장시험에서 측정된 접착 성질과 관련지어 고찰하였다.

• Journal of Welding and Joining
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• 제14권4호
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• pp.62-70
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• 1996

Al or Al-alloy have been known to be able to be claded on various materials by using explosive welding process, however, the intermetallic layer frequently formed along the interface have made this process very complicated. In this study, it was focussed to select the process variables, which can get rid of interfacial layer in the Al-claded steel plate. As a result, it was demonstrated that there was a certain range of explosive thickness which did not form the intermetallic phase as well as the non-bonded area. On the other hand, ultasonic tests performed for identifying the presence of interfacial layer nondestructively showed that it could be applied for the intended purpose but its result was weakly related with the microstructural quality of interface.

• 대한전기학회논문지
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• 제35권8호
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• pp.316-322
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• 1986

In this paper, the photodoping effect on the interface of Ag-amorphous As2S3 thin film has been investigated by measuring the resistance change of the Ag layer, the absorption coefficient of the As2S3, the optical density of As2S3 layer and the short-circuit photocurrents under light irradiation. As the experimental results, the photodissolution rate and the photodiffusion rate depends on the magnitude of photon energy absorbed in the As2S3. The sensitivity limit of the photodissolution rate at Ag layer was about 630[nm] and the sensitivity limit of the photodiffusion rate at the Ag-As2S3 interface was about 680[nm]. Also, it was found that the depth of photodiffusion was proportional to the square root of exposing time.

• 전기전자학회논문지
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• 제14권4호
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• pp.297-304
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• 2010

This paper presents a link layer design of DisplayPort interface with a state machine based on packet processing. The DisplayPort link layer provides isochronous video/audio transport service, link service, and device service. The merged video, audio main link, and AUX channel controller are implemented with 7,648 LUTs(Loop Up Tables), 6020 register, and 821,760 of block memory bits synthesized using a FPGA board and it operates at 203.32MHz.

• Journal of Mechanical Science and Technology
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• 제17권11호
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• pp.1638-1649
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• 2003

A study is made on the characterization of damage tolerance by spherical indentation in hardly coated layer structure with modest elastic modulus mismatch. A hard silicon nitride is prepared for the coating material and silicon nitride with 5wt% of boron nitride composites for underlayer. Hot pressing to eliminate the effect of interface delamination during the fracture makes strong interfacial bonding. The elastic modulus mismatch between the layers is not only large enough to suppress the surface crack initiation from the coating layer but sufficiently small to prevent the initiation of radial crack from the interface. The strength degradation of the layer structure after sphere contact indentation does not significantly occur, while the degradation of silicon nitride-boron nitride composite is critical at a high load and high number of contacts.