• 한국정밀공학회지
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• 제11권1호
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• pp.150-156
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• 1994

To meet the process requirement of semiconductor device manufacturing, it is necessary to improve the alignment accuracy in exposure equipments. We developed the excimer laser stepper and will describe the methodology for alignment measurement and experimental results. Our wafer alignment system consists of off-axis optics, TTL(Through The Lens) optics and high precision stage. Off-axis alignment utilizes the image processing and /or diffraction from thealign marks of off-centered chip area. On the other hand, TTL alignment can be used for the die-by-die alignment using dual beam interferometry. When only off-axis alignment was used, the experimental alignment error(lml+3 .sigma. ) was 0.26-0.29 .mu. m, and will be reduced down to 0.15 .mu. m by adding TTL alignment.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.649-650
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• 2008

• 한국재료학회지
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• 제14권3호
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• pp.186-190
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• 2004

An electron beam microcolumn composed of an electron emitter, micro lenses, scan deflector, and focus lenses have been fabricated and tested in the STEM mode. In this paper, we report a technique of precisely aligning the electron lenses by the laser diffraction patterns instead of the conventional alignment method based on aligner and STM. STEM images of a standard Cu-grid were observed using a fabricated microcolumn under both the retarding and accelerating modes.

• 제어로봇시스템학회논문지
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• 제17권11호
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• pp.1159-1167
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• 2011

A novel 3D tube scanning technique is proposed. The proposed tube scanning technique is developed for a special tube inspection module which consists of four line-lasers and one camera. Using the scanning module, we can reconstruct the 360 degree shapes of the inner surfaces of a cylindrical tube. From an image frame captured by the camera, we reconstruct a partial tube model based on four laser triangulations. Then by aligning such partial models with respect to a reference tube axis, a complete 3D shape of the tube is reconstructed. The tube axis in each reconstructed frame is aligned with a 3D Euclidean transformation to the reference axis. Several experiments show that the proposed method can align multiple tube axes very accurately and reconstruct 3D shapes of a tube with very low shape distortion.

• 한국기계가공학회지
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• 제18권7호
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• pp.56-62
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• 2019

The high-precision laser scriber carries out scribing alumina ceramic substrates for manufacturing ultra-small chip resistors. The ceramic substrates are loaded, aligned, scribed, transferred, and unloaded. The entire process is fully automated, thereby minimizing the scribing cycle time of the ceramic substrates and improving the throughput. The scriber consists of the laser optical system, pick-up module of ceramic substrates, pre-alignment module, TH axis drive work table, automation module for substrate loading / unloading, and high-speed scribing control S/W. The loader / unloader unit, which has the greatest influence on the scribing cycle time of the substrates, carries the substrates to the work table that carries out the cutting line work by driving the X and Y axes as well as by adsorbing the ceramic substrates. The loader / unloader unit consists of the magazine up / down part, X-axis drive part for conveying the substrates to the left and right direction, and the vision part for detecting the edge of the substrate for the primary pre-alignment of the substrates. In this paper, the laser scribing machining simulation is performed by applying the instrument mechanism of each component module. Through this study, the scribing machining process is first verified by analyzing the process operation and work area of each module in advance. In addition, the scribing machining process is optimized by comparing and analyzing the scribing cycle time of one ceramic substrate according to the alignment stage module speed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1993년도 추계학술대회 논문집
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• pp.243-248
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• 1993

New methodology for fiducial alignment is proposed to improve the alignment accuracy in wafer steppers. The positioning error is detected by PSD(Position Sensitive Detector)when 2-dimensional vernier patterns on a reticle on a reticle are projected on the fiducial marks of wafer stage. The width and period of vernier patterns are deter mined to get the highest S/N ratio for the exposure wavelength 248.4nm of KrF excimer laser. This new method has an advantage of higher accuracy and faster alignment over the conventional one.

• 소음진동
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• 제8권5호
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• pp.922-928
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• 1998

This paper presents the automatic alignment measuring system for improving the accuracy and working time of alignment of large vertical hydraulic pump turbine. It is general practice that rotating shaft should run within acceptable vibration limit. In order to obtain better run-out data of multi-stage rotor, careful and accurate alignment approach must be established. Generally, present alignment procedure are required several iterative works and so many manpower. Therefore, the new system has been developed using a vector calculation algorithm, laser sensor and data acquisition devices. As a result of appling to actual machines, it is confirmed that manpower is saved up to an average 90%.

• Journal of Information Display
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• 제12권2호
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• pp.101-107
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• 2011

To come up with a bistable liquid crystal (LC) device using unpolarized UV light, single-step laser patterning on a photoalignment layer using a photomask was proposed to achieve an equilibrium configuration of LC molecules in contact with a periodically patterned substrate. The patterns were formed by stripes of alternating random planar and homeotropic anchoring on a submicrometer scale in the order of $0.5{\mu}m$. Two possible configurations of bistable LC cells that can be obtained by combining a micropatterned surface formed with alternating random-planar- and homeotropic-alignment with planar- or homeotropic-alignment surfaces were proposed. The alignment properties of the two proposed models were investigated, along with the microscopic switching behavior of micropatterned nematic LC cells.

• 한국광학회지
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• 제17권4호
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• pp.354-358
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• 2006

적층으로 구성되는 초소형 전자렌즈의 실리콘 렌즈와 절연체인 파이렉스는 접합과 정렬을 동시에 수행하여야 한다. 이를 위한 방법으로 회절을 이용한 정렬과 레이저 접합을 이용하였으며, source 렌즈와 Einzel 렌즈의 정렬오차는 가장 큰 개구를 기준으로 최대 $\pm$4% 이내에서 이루어졌다. 정렬 조건과 레이저 접합 조건을 제시하였으며, 접합을 견고히 하기 위한 양극 접합 방식을 기술하였다. 전류영상화를 통해 선폭이 9 $\mu$m인 Cu grid를 시험한 결과 완성된 전자렌즈는 감속모드보다 가속모드에서 분해능이 좋았으며, 작은 개구를 가진 렌즈의 정밀한 정렬과 조합으로 높은 분해능을 믿을 수 있었다.

• 대한방사선치료학회:학술대회논문집
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• 대한방사선치료학회 1998년도 18차학술대회 초록집
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• pp.17-17
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• 1998