• Title/Summary/Keyword: large injection mold

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Surface modification of the injection mold using large electron beam (대면적 전자빔을 이용한 사출 금형 소재의 표면개질)

  • Lee, Yeong-Min;Lee, Ha-Yong;Kim, Ji-Su;Park, Hyeong-Uk
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.05a
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    • pp.94-94
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    • 2015
  • 사출금형의 표면은 제작되는 제품의 표면에 노출되기 때문에 표면조도 및 품질이 제품의 품질을 결정하는 데에 매우 중요하게 작용한다. 본 연구에서는 대면적 전자빔을 이용한 사출금형의 표면개질을 수행하였다. 대면적 전자빔 표면처리를 통하여 사출금형의 표면조도를 크게 줄일 수 있었으며, 표면 경도를 증가시켜 금형의 수명을 크게 향상시킬 수 있을 것으로 기대되었다.

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Study for Permanent Mold Design Technology and Porosity Defect Prediction Method by Multi-Phase Flow Numerical Simulations (다상유체해석을 통한 기포결함 예측과 금형설계기술)

  • Choi Y. S.;Cho I. S.;Hwang H. Y.;Choi J. K.;Hong J. H.
    • Transactions of Materials Processing
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    • v.14 no.3 s.75
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    • pp.224-232
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    • 2005
  • The high-pressure die-casting is one of the most effective methods to produce a large amount of products in short cycle time. This process, however, has a problem that the gas porosity defect appears easily. The generation of gas porosity is known mainly due to the air entrapment during the injection stage. Most of numerical simulations for the molten metal flow pattern observations have done in the treating of one phase fluid flow but the gas-liquid interface is essentially multi- phase phenomenon. In this paper, the two-phase fluid flow numerical simulation methods have been adapted to predict the gas porosity generations in the molten metal. The accuracy and the usefulness of the new simulation module have been emphasized and verified through some comparison experiments.

A study on the molding of dome shaped plastic parts embedded with electronic circuits (전자회로 일체형 돔 형상의 플라스틱 부품 성형에 관한 연구)

  • Seong, Gyeom-Son;Lee, Ho-Sang
    • Design & Manufacturing
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    • v.14 no.1
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    • pp.15-21
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    • 2020
  • Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.

Micro Metal Powder Injection Molding in the W-Cu System (W-Cu의 마이크로 금속분말사출성형)

  • 김순욱;양주환;박순섭;김영도;문인형
    • Journal of Powder Materials
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    • v.9 no.4
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    • pp.267-272
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    • 2002
  • The production of micro components is one of the leading technologies in the fields of information and communiation, medical and biotechnology, and micro sensor and micro actuator system. Microfabrication (micromachining) techniques such as X-ray lithography, electroforming, micromolding and excimer laser ablation are used for the production of micro components out of silicon, polymer and a limited number of pure metals or binary alloys. However, since the first development of microfabrication technologies there have been demands for the cost-effective replication in large scale series as well as the extended range of available material. One such promising process is micro powder injection molding (PIM), which inherits the advantages of the conventional PIM technology, such as low production cost, shape complexity, applicability to many materials, applicability to many materials, and good tolerance. This paper reports on a fundamental investigation of the application of W-Cu powder to micro metal injection molding (MIM), especially in view of achieving a good filling and a safe removal of a micro mold conducted in the experiment. It is absolutely legitimate and meaningful, at the present state of the technique, to continue developing the micro MIM towards production processes for micro components.

Finite element analysis for the flow characteristics along the thickness direction in injection molding (사출성형시 두께방향으로의 유동특성에 관한 유한요소 해석)

  • 이호상;신효철
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.11 no.6
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    • pp.1026-1035
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    • 1987
  • The injection molding process is used in the fabrication of a large variety of plastic articles. A numerical simulation of the filling stage along the thickness direction is proposed by combining the free surface boundary condition with the relevant governing equations. The mathematical model is based on the equations of continuity, momentum and energy along with inelastic power-law model and relevant boundary conditions. Due to the significant implications for microstructure development in the pro duct, the fountain effect at the advancing free surface is explicitly taken into consideration in the simulation. The model yields data on free surface shape as well as velocity, pressure, temperature and shear stress distributions within the mold cavity. The rearrangement of the velocity and temperature profiles in the vicinity of the melt front is considered in detail.

Experimental & Numerical Result of the filling of Micro Structures in Injection Molding (미세 구조물의 충전에 관한 실험 및 수치해석)

  • Lee J.G.;Lee B.K;Kwon T.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.111-114
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    • 2005
  • Experimental and numerical studies were carried out in order to investigate the processability and the transcriptability of the injection molding of micro structures. For this purpose, we designed a mold insert having micro rib patterns on a relatively thick base part. Mold insert has a base of 2mm thickness, and has nine micro ribs on that base plate. Width and height of the rib are $300{\mu}m\;and\;1200{\mu}m$, respectively. We found a phenomenon similar to 'race tracking', due to 'hesitation' in the micro ribs. As the melt flows, it starts to cool down and melt front located in the ribs near the gate cannot penetrate further because the flow resistance is large in that almost frozen portion. When the base is totally filled, the melt front away from the gate is not frozen yet. Therefore, it flows back to the gate direction through the ribs. Consequently, transcriptability of the rib far from the gate is better. We also verified this phenomenon via numerical simulation. We further investigated the effects of processing conditions, such as flow rate, packing time, packing pressure, wall temperature and melt temperature, on the transcriptability. The most dominant factor that affects the flow pattern and the transcriptability of the micro rib is flow rate. High flow rate and high melt temperature enhance the transcriptability of micro rib structure. High packing time and high packing pressure result in insignificant dimensional variations of the rib. Numerical simulation also confirms that low flow rate causes a short shot of micro ribs and high wall temperature helps the filling of the micro ribs.

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Large core polymeric single mode waveguide for passive fiber alignment (광섬유 수동정렬을 위한 단일 모드 대형 코어 폴리머 광도파로)

  • Cho, Su-Hong;Beak, Yu-Jin;Oh, Min-Choel
    • Korean Journal of Optics and Photonics
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    • v.16 no.1
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    • pp.79-84
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    • 2005
  • To increase the tolerance for passive fiber alignment, a single mode polymer waveguide with a large core structure is demonstrated. The large core waveguide is designed to have a mode profile comparable to that of a thermally expanded core (TEC) fiber, and it can be connected to a high-contrast waveguide through an adiabatic transition taper structure. From a waveguide with a rectangular core of 25 ${\times}$ 25 ${\mu}{\textrm}{m}$$^2$, a single mode propagation is observed when the index contrast is as low as 0.0005. A UV-cured injection molding method is used to fabricate the thick core structure. Due to the large mode size, the insertion loss of the device is below 0.5 dB until the lateral displacement of the TEC fiber is 4.5 ${\mu}{\textrm}{m}$. The low insertion loss is important for reproducible passive alignment.

Development of the automatic packaging system for blow molding products (블로우 성형품 자동 패키징 시스템 개발)

  • Kim, Gun-Hee;Jung, Woo-Chul;Heo, Young-Moo;Yoon, Gil-Sang;Chang, Sung-Ho;Shin, Gwang-Ho
    • Design & Manufacturing
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    • v.2 no.2
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    • pp.15-19
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    • 2008
  • In this paper, the automatic assembly and packaging system was developed for PET blow molding products. The PET blow molding products mainly are used in groceries case and are in great demand. Generally, the molding process is compose of 4 processes such as plastic resin injection, molding, ejecting and packaging. In case of packaging process, although amount of work per hour is very large, all processes are still performed by the manual work. For this reason, the automatic packaging system was developed with the function of automatic hand-grip part assembly. For the development of system, the existing processes and the shape of molding product were analyzed and specifications were deducted. Finally, the automatic assembly and packaging system was developed and applied to the manufacturing field.

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Development of the DNA Sequencing Chip with Nano Pillar Array using Injection Molding (Nano Pillar Array 사출성형을 이용한 DNA 분리 칩 개발)

  • Kim S.K.;Choi D.S.;Yoo Y.E.;Je T.J.;Kim T.H.;Whang K.Y.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1206-1209
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    • 2005
  • In recent, injection molding process for features in sub-micron scale is under active development as patterning nano-scale features, which can provide the master or stamp for molding, and becomes available around the world. Injection molding has been one of the most efficient processes for mass production of the plastic product, and this process is already applied to nano-technology products successfully such as optical storage media like DVD or BD which is a large area plastic thin substrate with nano-scale features on its surface. Bio chip for like DNA sequencing may be another application of this plastic substrate. The DNA can be sequenced using order of 100 nm pore structure when making the DNA flow through the pore structure. Agarose gel and silicon based chip have been used to sequence the DNA, but injection molded plastic chip may have benefit in terms of cost. This plastic DNA sequencing chip has plenty of pillars in order of 100 nm in diameter on the substrate. When the usual features in case of DVD or BD have very low aspect ratio, even less than 0.5, but the DNA chip will have relatively high aspect ratio of about 2. It is not easy to injection mold the large area thin substrate with sub-micron features on its surface due to the characteristics of the molding process and it becomes much more difficult when the aspect ratio of the features becomes high. We investigated the effect of the molding parameters for injection molding with high aspect ratio nano-scale features and injection molded some plastic DNA sequencing chips. We also fabricated PR masters and Ni stamps of the DNA chip to be used for molding

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