• Title/Summary/Keyword: junction depth

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The characterization of crystalline silicon solar cell according to junction depth by using PC1D (PC1D를 이용한 junction depth에 따른 결정질 실리콘 태양전지의 특성 분석)

  • Lim, Jungkyu;Yi, Junsin
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.65.2-65.2
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    • 2011
  • 일반적으로 결정질 실리콘 태양전지에서는 junction depth가 얕아짐으로써 단파장 영역에서의 수집효율이 향상되고 Jsc가 상승하기 때문에 junction depth가 얕은 것이 좋다. 또, 태양전지의 효율을 높이기 위해서는 낮은 재결합 속도가 필요한데 이를 위해서도 얕은 junction depth가 필요하다. 하지만 junction depth가 너무 얕으면 FF와 Voc가 낮아져 효율이 떨어지므로 junction depth를 최적화 할 필요가 있다. 본 논문에서는 PC1D 시뮬레이션을 사용하여 표면 농도를 고정시키고 junction depth를 가변하면서 이에 따른 cell의 parameter변화를 관찰하였다. 그 결과, 면저항 $120{\Omega}/{\square}$에서부터 효율이 saturation되었고, 그에 따른 parameter 값은 FF=76.28%, Jsc=$38.17mA/cm^2$, Voc=596.5V이며 junction depth가 $0.1726{\mu}m$일 때 효율은 17.37%이다.

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The measurement of p-n junction depth by SEM

  • Hur, Chang-Wu;Lee, Kyu-Chung
    • Journal of information and communication convergence engineering
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    • v.5 no.4
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    • pp.324-327
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    • 2007
  • In this paper, the p-n junction depth with nondestructive method by using scanning electron microscopy (SEM) is determined and conformed. By measuring the critical short circuit current on the p-n junction which induced by electron beam and calculating generation range, the diffusion depth can be obtained. It can be seen that values destructively measured by constant angle lapping and nondestructively by this study almost concur. As this result, it is purposed that diffusion depth of p-n junction can be easily measured by nondestruction. This nondestructive method can be recommended highly to the industrial analysis.

Determination of Penetration Depth of Nb Electrodes in $Nb/A1O_x/Nb$ Josephson Junction by Resistive Method ($Nb/A1O_x/Nb$ 조셉슨 접합에서 저항측정을 이용한 Nb 전극의 침투깊이 측정)

  • 김동호;김규태;박종원;황준석;홍현권
    • Progress in Superconductivity and Cryogenics
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    • v.4 no.1
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    • pp.50-54
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    • 2002
  • Penetration depth of Nb electrodes in $Nb/A1O_x/Nb$ Josephson junctions has been measured by resistive method. For a given applied field, the total flux through the junction is temperature dependent because the penetration depth of Nb electrode varies with temperature. If the total flux equals an integral multiple of the flux quantum at certain temperatures, resistive peaks appear at those temperatures. The penetration depth of Nb can be determined by applying the above condition, The temperature dependence of penetration depth was found to be well described by the two-fluid model.

Depth-dependent EBIC microscopy of radial-junction Si micropillar arrays

  • Kaden M. Powell;Heayoung P. Yoon
    • Applied Microscopy
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    • v.50
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    • pp.17.1-17.9
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    • 2020
  • Recent advances in fabrication have enabled radial-junction architectures for cost-effective and high-performance optoelectronic devices. Unlike a planar PN junction, a radial-junction geometry maximizes the optical interaction in the three-dimensional (3D) structures, while effectively extracting the generated carriers via the conformal PN junction. In this paper, we report characterizations of radial PN junctions that consist of p-type Si micropillars created by deep reactive-ion etching (DRIE) and an n-type layer formed by phosphorus gas diffusion. We use electron-beam induced current (EBIC) microscopy to access the 3D junction profile from the sidewall of the pillars. Our EBIC images reveal uniform PN junctions conformally constructed on the 3D pillar array. Based on Monte-Carlo simulations and EBIC modeling, we estimate local carrier separation/collection efficiency that reflects the quality of the PN junction. We find the EBIC efficiency of the pillar array increases with the incident electron beam energy, consistent with the EBIC behaviors observed in a high-quality planar PN junction. The magnitude of the EBIC efficiency of our pillar array is about 70% at 10 kV, slightly lower than that of the planar device (≈ 81%). We suggest that this reduction could be attributed to the unpassivated pillar surface and the unintended recombination centers in the pillar cores introduced during the DRIE processes. Our results support that the depth-dependent EBIC approach is ideally suitable for evaluating PN junctions formed on micro/nanostructured semiconductors with various geometry.

The Regeneration Effect of Platelet-Rich Plasma on the Treatment of Grade II Furcation Involvement Using Synthetic Bone in Human (2급 치근이개부 병변의 합성골 이식 시 혈소판 농축 혈장의 재생에 관한 효과)

  • Kim, Jun-Hee;Lim, Sung-Bin;Chung, Chin-Hyung
    • Journal of Periodontal and Implant Science
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    • v.31 no.2
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    • pp.477-488
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    • 2001
  • The present study evaluated of regeneration effect of platelet rich plasma on the treatment of grade II furcation involvement, with coralline calcium phosphate bone in humans. 30 teeth with grade II furcation defect were selected and 15 teeth(control) were treated with coralline calcium phosphate bone, the others(test) were treated with coralline calcium phosphate bone and platelet rich plasma. Pocket depth, clinical attachment level, width of keratinized gingiva width were measured at baseline, postoperative 3, 6months. from cementoenamel junction to alveolar crest and fundus were measured at baseline, 6months(re-entry). Both groups were statistically analyzed by Wilcoxon signed Ranks Test & Mann-whitney Test using SPSS program(5% significance level). The results were as follows: 1. Pocket depth, clinical attachment level, keratinized gingva width, cementoenamel junction - alveolar crest, cementoenamel junction - fundus were not differ significantly in both groups at baseline 2. The change of pocket depth, clinical attachment level, keratinized gingva width, cementoenamel junction - alveolar crest, cementoenamel junction - fundus in both groups were decreased significantly at 3, 6months(p<0.05). 3. The change of pocket depth, clinical attachment level in test group decreased significantly than control at 3, 6months(p<0.05). 4. The change of keratinized gingiva width, cementoenamel junctional - alveolar crest, cementoenamel junction - fundus were not differ significantly in both groups at 3, 6months. 5. The pocket depth, clinical attachment level, keratinized gingiva width exhibited marked changes at 3 months in both groups. In conclusion, the results of this study suggest that platelet rich plasma have adjunctive clinical treatment effect to periodontal regeneration in grade II furcation defects.

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Two-Step Diffusion of Boron into silicon by Spin-on source (스핀온 쏘스에 의한 실리콘내의 붕소의 이단계 확산)

  • 정태원
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.17 no.5
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    • pp.22-27
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    • 1980
  • The two-step diffusion process of boron into silicon has been investigated using a new diffusion source coiled "Spin-on Source". A simple method is proposei which can estimate the junction depth after the two -step diffusion for the cases where the junction depth after the predeposition is not negligible compared with the junction depth after the two-step diffusion. The estimated junction depths are, then, compared with the experimental measurements.surements.

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A Study on the Hydraulic Characteristics of River Junctions Using FLDWAV Model (FLDWAV 모형을 이용한 하천합류부에서의 수리학적 특성 연구)

  • Cho, Hyeon-Kyeong
    • Journal of the Korean Society of Industry Convergence
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    • v.10 no.4
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    • pp.275-283
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    • 2007
  • This study aims at the calculation of a variation of flow characteristics of main channel for tributary inflow in river junction. So this study was analyzed the variation of flow depth and velocity in main channel for a change of inflow degree. For this purpose, FLDWAV model are carried out for variations of $30^{\circ}$, $60^{\circ}$ and $90^{\circ}$ tributary inflow at junction. Results show that velocity ratio(V1/V3) increases and flow depth ratio(H1/H3) decreases for discharge ratio(Q1/Q3) of upstream and downstream when degree increases in junction. And FLDWAV model was applied at a real river junctions. Selected area is a junction of Gumho river and Sin stream. Results show that pattern is similar to a virtual channel.

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Diffusion Model of Aluminium for the Formation of a Deep Junction in Silicon (실리콘에서 깊은 접합의 형성을 위한 알루미늄의 확산 모델)

  • Jung, Won-Chae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.4
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    • pp.263-270
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    • 2020
  • In this study, the physical mechanism and diffusion effects in aluminium implanted silicon was investigated. For fabricating power semiconductor devices, an aluminum implantation can be used as an emitter and a long drift region in a power diode, transistor, and thyristor. Thermal treatment with O2 gas exhibited to a remarkably deeper profile than inert gas with N2 in the depth of junction structure. The redistribution of aluminum implanted through via thermal annealing exhibited oxidation-enhanced diffusion in comparison with inert gas atmosphere. To investigate doping distribution for implantation and diffusion experiments, spreading resistance and secondary ion mass spectrometer tools were used for the measurements. For the deep-junction structure of these experiments, aluminum implantation and diffusion exhibited a junction depth around 20 ㎛ for the fabrication of power silicon devices.

Simulation of optimal ion implantation for symmetric threshold voltage determination of 1 ${\mu}m$ CMOS device (1 ${\mu}m$ CMOS 소자의 대칭적인 문턱전압 결정을 위한 최적 이온주입 시뮬레이션)

  • Seo, Yong-Jin;Choi, Hyun-Sik;Lee, Cheol-In;Kim, Tae-Hyung;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the KIEE Conference
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    • 1991.11a
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    • pp.286-289
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    • 1991
  • We simulated ion implantation and annealing condition of 1 ${\mu}m$ CMOS device using process simulator, SUPREM-II. In this simulation, optimal condition of ion implantation for symmetric threshold voltage determination of PMOS and NMOS region, junction depth and sheet resistance of source/drain region, impurity profile of each region are investigated. Ion implantation dose for 3 ${\mu}m$ N-well junction depth and symmetric threshold voltage of $|0.6|{\pm}0.1$ V were $1.9E12Cm^{-2}$(for phosphorus), $1.7E122Cm^{-2}$(for boron) respectively. Also annealing condition for dopant activation are examined about $900^{\circ}C$, 30 minutes. After final process step, N-well junction, P+ S/D junction and N+ S/D junction depth are calculated 3.16 ${\mu}m$, 0.45 ${\mu}m$ and 0.25 ${\mu}m$ respectively.

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The Measurement of Junction Depth by Scanning Electron Microscopy (전자현미경에 의한 확산 깊이 측정)

  • 허창우
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2004.05b
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    • pp.623-626
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    • 2004
  • The purpose of this paper is to determinate and to confirm p-n junction depth with nondestructive method by using electron beam. By measuring the critical short circuit current on the p-n junction which induced by electron beam and calculating generation range, the diffusion depth can be obtained. It ran be seen that values destructively measured by constant angle lapping and nondestructively by this study almost concur. As this result, it is purposed that diffusion depth of p-n junction can be easily measured by non-destruction. And this nondestructive method ran be recommended highly to the industrial analysis.

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