• Journal of the Korean Geosynthetics Society
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• v.9 no.1
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• pp.21-30
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• 2010

To understand the deformation behavior of nonwoven geotextiles(NWGT) reinforced soil wall, analyses of load-elongation properties, soil-reinforcement interface friction, laboratory model tests, and field cases throughout literature reviews are being studied in this paper. According to the analyses results, the stiffness and tensile strength of NWGT is increased in proportion to confinement pressures, and the interface shear strength at soil-NWGT appeared to be stronger than soil-geogrid interface. The deformation at the beginning of loading on NWGT reinforced soil wall is larger than geogrid reinforced soil wall, but the wall deformation with NWGT is smaller than the wall of geogrid after passing some loading point in laboratory model tests. Case analysis results have shown that the facing of NWGT reinforced soil wall should be rigid enough to be used as a permanent wall, and NWGT and in-situ poor soil can be used for reinforcement and backfill respectively if the wall is constructed as pre-reinforced soil body and with post-facing that has a full-height rigid concrete.

• Computers and Concrete
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• v.10 no.1
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• pp.1-18
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• 2012

This paper presents the details of studies conducted on hollow concrete block masonry (HCBM) units and wall panels. This study includes, compressive strength of unit block, ungrouted and grouted HCB prisms, flexural strength evaluation, testing of HCBM panels with and without opening. Non-linear finite element (FE) analysis of HCBM panels with and without opening has been carried out by simulating the actual test conditions. Constant vertical load is applied on the top of the wall panel and then lateral load is applied in incremental manner. The in-plane deformation is recorded under each incremental lateral load. Displacement ductility factors and response reduction factors have been evaluated based on experimental results. From the study, it is observed that fully grouted and partially reinforced HCBM panel without opening performed well compared to other types of wall panels in lateral load resistance and displacement ductility. In all the wall panels, shear cracks originated at loading point and moved towards the compression toe of the wall. The force reduction factor of a wall panel with opening is much less when compared with fully reinforced wall panel with no opening. The displacement values obtained by non-linear FE analysis are found to be in good agreement with the corresponding experimental values. The influence of mortar joint has been included in the stress-strain behaviour as a monolith with HCBM and not considered separately. The derived response reduction factors will be useful for the design of reinforced HCBM wall panels subjected to lateral forces generated due to earthquakes.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.1-6
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• 2014

Flip chip bonded LED packages possess lower thermal resistance than wire bonded LED packages because of short thermal path. In this study, thermal and bonding properties of flip chip bonded high brightness LED were evaluated for Au-Sn thermo-compression bonded LEDs and Sn-Ag-Cu reflow bonded LEDs. For the Au-Sn thermo-compression bonding, bonding pressure and bonding temperature were 50 N and 300oC, respectively. For the SAC solder reflow bonding, peak temperature was $255^{\circ}C$ for 30 sec. The shear strength of the Au-Sn thermo-compression joint was $3508.5gf/mm^2$ and that of the SAC reflow joint was 5798.5 gf/mm. After the shear test, the fracture occurred at the isolation layer in the LED chip for both Au-Sn and SAC joints. Thermal resistance of Au-Sn sample was lower than that of SAC bonded sample due to the void formation in the SAC solder.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.55-62
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• 2001

With a spread of BGA, CSP and fine pitch devices, the need of flatter surface finish in bare board is becoming more critical in solderability. The electroless Ni/Au plating has a solution of these needs and also has being spread to apply to surface finish for bare board in many electronic goods. But, the electroless Ni/Au plating had several issues such as Ni oxidation and phosphorous contents. Before this study, we studied on the effect of BGA solderability in electroless Ni/Au plating and chose some major factors such as the oxidation property of NiP plating and warpage of board. Firstly, we made test board with various plating conditions and improved the plating property through the improvement of NiP oxidation reducing P content. Also, we minimized the warpage of board with the improvement of inner layer structure and the analysis of warpage. For the evaluation of solderability, we analyzed the warpage of board and the plating property after mounting BGA on the board with optimizing conditions. The solder joint of BGA is investigated by SEM(Scanning Electronic Microscope) and OM(Optical Microscope). The composition of joint is used by EDS(Energy Dispersive Spectroscopy). We analyzed the fracture strength and mode by ball shear teser.

• Journal of the Korea Concrete Institute
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• v.14 no.5
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• pp.734-741
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• 2002

An experimental study was carried out for beam-column joints composed of RC column and RS beams. The purpose of this study is to examine the inelastic seismic behavior for the RC-RS connection. Two interior and one exterior beam-column assemblies with variable moment ratios were tested. Experimental results showed that strength and deformability except stiffness were satisfactory. It is considered that the lack of stiffness was due to the slipping of steel beam from RS beam. The behavioral characteristics of the RC-RS connection were evaluated according to the quideline suggested by Hawkins et al. Nominal strength at 5 ％ joint distortion was not satisfactory, but all the other requirements, such as strength preserving capability, energy dissipation, and initial stiffness and strength ratios after peak load were satisfactory compared with the guideline. Thus it was concluded that the RC-RS connections can maintain ductility with excellent energy-dissipating capacity if being provided with appropriate reinforced structural system such as RC core wall for the initial lateral stiffness.

• Composites Research
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• v.13 no.4
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• pp.42-53
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• 2000

A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.11
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• pp.1265-1272
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• 2014

This study performed the progressive failure analysis of adhesive joints of a composite pressure vessel with a separated dome by using a cohesive zone model. In order to determine the input parameters of a cohesive element for numerical analysis, the interlaminar fracture toughness values in modes I and II and in the mixed mode for the adhesive joints of the composite pressure vessel were obtained by a material test. All specimens were manufactured by the filament winding method. A mechanical test was performed on adhesively bonded double-lap joints to determine the shear strength of the adhesive joints and verify the reliability of the cohesive zone model for progressive failure analysis. The test results showed that the shear strength of the adhesive joints was 32MPa; the experiment and analysis results had an error of about 4.4%, indicating their relatively good agreement. The progressive failure analysis of a composite pressure vessel with an adhesively bonded dome performed using the cohesive zone model showed that only 5.8% of the total adhesive length was debonded and this debonded length did not affect the structural integrity of the vessel.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of the Korean Wood Science and Technology
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• v.43 no.6
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• pp.868-875
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• 2015

In order to replace existing slit type steel plate on the wooden structure joint, the FRP-reinforced laminated plates were produced. Four types of FRP-reinforced laminated plates were produced according to the type of reinforcement and adhesive, and before applying to the joint, the adhesion performance test according to KSF 3021 and KSF 2160 and the Compact Tension (CT) type fracture toughness test specified in ASTM D5045-99 were carried out. As a result of adhesion performance test, all GFRP textile, GFRP sheet, and GFRP Textile-Sheet type FRP-reinforced laminated plates satisfied the requirement of soaking delamination percentage with smaller than 5% based on KS standard. However, aramid type specimen satisfied the standard as the soaking delamination percentage of 4.8% but it did not satisfied the standard as the water proof soaking delamination percentage of 70%. As a result of fracture toughness test, the volume ratio of reinforcement to timber became 23% so that the strength of FRP-reinforced laminated plates increased by two to four times in comparison to the control specimen. It was confirmed that the GFRP Textile-Sheet type specimen was most resistant to the fracture most since the ratio of stress intensity factor compared with that of the control increased to 61% owing to the parallel arrangement of glass fiber to the load. As a result of tensile shear strength test using FRP-reinforced laminated plates and nonmetal dowels, it is about 12% lower than metal connectors.

• The Journal of Engineering Geology
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• v.34 no.2
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• pp.249-262
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• 2024

Retaining walls are widely used in the construction of underground structures. This study reviews the stability of the high-strength joint buried pile method at a site in Korea. [Consider giving details of the location.] The method is assessed by considering the amount of ground settlement, as calculated by finite element analysis and measured at the site. Comparison of the measured and numerical results confirmed the method's stability and field applicability. Settlement of 13.42~13.65 mm was calculated for seven cross-sections [The Abstract should be comprehensible without reference to the main text. The labels A-A' to G-G' should not be introduced here without explanation.] using numerical analysis, and the measured settlement reached a maximum of 2.00 mm. The observed differences and variations [Please state what differed/varied.] did not exceed the design expectations in any section. Instruments installed at the back of the excavation area were used to assess the conditions. An underground gradient meter recorded a cumulative horizontal displacement of between -0.40 and 0.60 mm, and an underground water meter recorded slight displacements of between -0.21 and 0.28 m compared with the initial measurements. A surface settlement meter observed very little movement, with a maximum of -2.00 mm compared with the initial measurement, thereby confirming the establishment of a stable state within the management criteria.