• Korean Journal of Materials Research
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• v.7 no.5
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• pp.444-450
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• 1997

기계적합금화 한 AI-Ti합금의 상온 및 고온 인장강도는 25at.% Ti을 Ce으로 치환함에 따라 증가하였다. 그러나 25at.% 이상의 Ce첨가는 합금의 인장강도를 감소시켰다. 이는 Ce이 적은 고용도 효과에 의해 금속간화합물의 초대화를 억제하여 합금의 강도를 증가시키지만 다량 첨가시에는 Ti에 비해 무거운 원자량으로 인해 분산상의 부피분율을 감소시켜 합금의 강도가 오히려 저하시킨 것으로 생각된다. Ce의 첨가는 40$0^{\circ}C$와 51$0^{\circ}C$에서 합금의 열저안정성을 향상시키는 것으로 나타났다. 300-51$0^{\circ}C$ 온도범위에서 측정된 AI-8wt.%(Ti+Ce)합금의 변형에 필요한 활성화에너지는 AI의 자기확산에 필요한 에너지 (142kJ/mode)의 1.3-1.9배로 나타났다. 이로부터 AI-Ti-Ce 합금의 고온 변형은 Orowan기구에 의한 것을 생각된다.

• Korean Journal of Materials Research
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• v.7 no.5
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• pp.411-416
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• 1997

수소 및 산소분위기 하에서 2Y-TZP 및 3Y-PZP 세라믹스를 소결하여 각각 제조한 다음, 각 시편의 미세구조 및 25$0^{\circ}C$에서의 등온상전이 거동을 비교하여 고찰하였다. 그 결과 수소분위기에서 소결한 모든 시편의 표면에서는 Zr$_{4+}$ 이온의 환원에 의해 산화분위기에서 소결한 시편에 비하여 색이 검게 변하였으며, 장시간 소결시 시편 표면에 조대 입자의 생성 및 입계 이완이 관찰되었다. 이에따라 수소분위기 하에서 장시간 소결된 시편의 경우 냉각 시 상전이가 일어나 다량의 단사정상이 상온에서 존재하였다. 저온 aging동안 등온상전이 속도는 산소분위기에서 소결한 시편보다 수소분위기에서 소결한 시편에서 낮게 나타났으며, 이러한 경향은 $Y_{2}$O$_{3}$의 고용량이 크고, 입자크기가 적은 시편일수록 증가하였다. 또한 2Y-TZP 시편에서는 입자크기에 상관없이 대부분의 정방정상이 단사정상으로 빨리 등온상전이를 일으켰으나, 3Y-TZP 시편의 경우, 등온상전이는 입자크기가 증가함에 따라 상전이 속도도 증가하였다.

• Transactions on Electrical and Electronic Materials
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• v.3 no.3
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• pp.8-13
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• 2002

Controlled precipitation of quasi-binary semiconductor system is newly proposed as an effective and reliable technique for the formation of well-defined and crystallographically aligned semiconductor nanostructures. Using HgTe-PbTe quasi-binary semiconductor system, self-aligned HgTe nanocrystallites distributed three dimensionally within PbTe matrix were successfully formed by the simple three step heat treatment process routinely found in age hardening process of metallic alloys. Examination of the resulting nano precipitates using conventional transmission electron microscopy (CTEM) and high resolution TEM (HRTEM) reveals that the coherent HgTe precipitates form as thin discs along the (100) habit planes making a crystallographic relation of {100}$\_$HgTe///{100}$\_$PbTe/ and [100]$\_$HgTe///[100]$\_$PbTe/. It is also found that the precipitate undergoes a gradual thickening and a faceting under isothermal aging up to 500 hours without any noticeable coarsening. These results, combined with the extreme dimension of the precipitates (4-5 nm in length and sub-nanometer in thickness) and the simplicity of the formation process, leads to the conclusion that controlled precipitation is an effective method for preparing desirable quantum-dot nanostructures.

• Korean Journal of Materials Research
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• v.6 no.11
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• pp.1136-1145
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• 1996

Ai-8wt.5(Ti+Zr)합금을 기계적합금화와 열간압출로 제조하여 Ti에 대한 Zr 첨가비와 등온열처리가 고온인장강도 및 변형거동에 미치는 영향에 대하여 조사하였다. Ti에 대한 Zr 첨가량의 비가 증가함에 따라 열간압출 시편의 상온 및 고온강도가 증가하였고, 40$0^{\circ}C$ 및 51$0^{\circ}C$에서 등온열처리에 따른 강도의 감소도 작게 나타났다. 이는 Zr 첨가량이 증가함에 따라 AI 기지와 AI3Ti에 비해 작은 격자간불일치도를 갖는 AI3(Ti+Zr)금속간화합물이 생성되고 고온열처리에 따른 조대화가 억제되었기 때문으로 판단되었다. 합금의 연성은 Zr 첨가량과 등온열처리에 관계없이 10% 이하로 낮게 나타났으며 인장 시험 온도가 고온일수록 취성파괴인 입계파괴가 지배적으로 일어났다. AI-Ti-Zr 합금의 변형에 필요한 활성화에너지는 순수한 AI 기지의 자기확산에 필요한 활성화에너지 142KJ/mol에 비해 573-783K 온도범위에서 1.5-1.8배 높은 값을 보였으며, Ti에 대한 Zr의 첨가량의 비가 증가할수록 보다 높은 값을 나타내었다.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.793-798
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• 2000

The age-hardening behavior of unreinforced 6061 Al alloy and SiCp/6061 Al alloy composites reinforced with different size of SiC particle (average diameter ; 0.7$\mu\textrm{m}$ and 7.0$\mu\textrm{m}$) was investigated by hardness measurement, calorimetric technique and transmission electron microscopy. At 17$0^{\circ}C$ isothermal aging treatment, the peak aging time of 0.7$\mu\textrm{m}$SiCp/6061Al alloy composite and 7.0$\mu\textrm{m}$SiCp/6061Al alloy composite is shorter than that of unreinforced 6061Al alloy, and the aging of 7.0$\mu\textrm{m}$SiCp/6061Al alloy composite is accelerated more than that of 0.7$\mu\textrm{m}$SiCp/6061Al alloy composite. This acceleration is due to the increase of dislocation density by the compositeness with SiCp and the SiC particle size. In the peak aged condition, the major strengthening phase of these materials is intermediate $\beta$ phase(Mg$_2$Si), and the activation energy for the formation of $\beta$ phase is considerably decreased by the compositeness with SiCp and the increasing of SiC Particle site.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Society for Nondestructive Testing
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• v.18 no.1
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• pp.10-16
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• 1998

Remaining life of turbine rotors with a crack can be assessed by the fracture toughness of the aged rotors at service temperature. DC potential drop measurement system was constructed in order to evaluate material toughness nondestructively. Test material was 1Cr-1Mo-0.25V steel used widely for turbine rotor material. Seven kinds of specimen with different degradation levels were prepared according to isothermal aging heat treatment at $630^{\circ}C$. Electrical resistivity of test material was measured at room temperature. It was observed that material toughness and electrical resistivity decreased with the increase of degradation. The relationship between fracture toughness and electrical resistivity was investigated. Fracture toughness of a test material may be determined nondestructively by electrical resistivity.

• Journal of Welding and Joining
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• v.24 no.6
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• pp.21-27
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• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• Journal of the Korean Institute of Gas
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• v.2 no.4
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• pp.42-46
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• 1998

Miniaturized specimen technology Permits mechanical behavior to be determined using a minimum volume of material. The technology is useful in case of not collecting a large amount of materials from industrial equipments. Five kinds of accelerated degradation materials were prepared by isothermal aging heat treatment at $630^{\circ}C$. Three kinds of specimens were prepared for impact testing. In order to increase plastic constraint of subsize specimen, side-groove was introduced. Results between subsize and full size impact testing were compared. Size effects correlations were developed for the impact properties of turbine rotor material. These correlations successfully predict the ductile brittle transition temperature (DBTT) of full size Charpy impact specimens based on subsize specimen data.