• Proceedings of the Korean Vacuum Society Conference
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• 2005.08a
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• pp.191-191
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• 2005

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.83-84
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• 2000

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.81-81
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• 1998

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.82-83
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• 1998

• Journal of the Korean institute of surface engineering
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• v.55 no.6
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• pp.460-468
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• 2022

Due to its high electrical conductivity, low contact resistance, good weldability and high corrosion resi-stance, gold is widely used in electronic components such as connectors and printed circuit boards (PCB). Gold ion salts currently used in gold plating are largely cyan-based salts and non-cyanic salts. The cya-nide bath can be used for both high and low hardness, but the non-cyanide bath can be used for low hardness plating. Potassium gold cyanide (KAu(CN)₂) as a cyanide type and sodium gold sulfite (Na₃[Au(SO)₃]₂) salt as a non-cyanide type are most widely used. Although the cyan bath has excellent performance in plating, potassium gold cyanide (KAu(CN)₂) used in the cyan bath is classified as a poison and a toxic substance and has strong toxicity, which tends to damage the positive photoresist film and make it difficult to form a straight side-wall. There is a need to supplement this. Therefore, it is intended to supplement this with an eco-friendly process using sodium sulfite sodium salt that does not contain cyan. Therefore, the main goal is to form a gold plating layer with a controllable hardness using a non-cyanide gold plating solution. In this study, the composition of a non-cyanide gold plating solution that maintains hardness even after annealing is generated through gold-palladium alloying by adding thallium, a crystal regulator among electrolysis factors affecting the structure and hardness, and changes in plating layer structure and crystallinity before and after annealing the correlation with the hardness.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.625-627
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• 2002

MgO thin films were deposited on glass and (100) Si substrates by an Arc Ion Plating (AIP) equipment using a magnesium metal target at various oxygen gas flow. In this work, we investigated the relationship between the structural properties and the discharge characteristics of MgO coating layers. X-ray diffraction and AFM have been used to study behaviors of the structure and surface morphology. The optical transmittance and the ion induced secondary electron emission coefficient of the MgO films have been also measured. The resistivity of the deposited MgO films was gradually increased from 0.17 G ohm/${\square}$ to 0.35 G ohm/${\square}$ with the oxygen gas flow. The growth rate of the MgO coating layer was decreased with increasing the oxygen gas flow, while the optical transmittance was improved.

• Journal of Electrochemical Science and Technology
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• v.11 no.1
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• pp.92-98
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• 2020

SnO₂-based high-capacity anode materials are attractive candidate for the next-generation high-performance lithium-ion batteries since the theoretical capacity of SnO₂ can be ideally extended from 781 to 1494 mAh g^-1. Here 3D etched Cu foam is applied as a current collector for electron path and simultaneously a substrate for the SnO₂ coating, for developing an integrated electrode structure. We fabricate the 3D etched Cu foam through an auto-catalytic electroless plating method, and then coat the SnO₂ onto the self-supporting substrate through a simple sol-gel method. The catalytic dissolution of Cu metal makes secondary pores of both several micrometers and several tens of micrometers at the surface of Cu foam strut, besides main channel-like interconnected pores. Especially, the additional surface pores on etched Cu foam are intended for penetrating the individual strut of Cu foam, and thereby increasing the surface area for SnO₂ coating by using even the internal of Cu foam. The increased areal capacity with high structural integrity upon cycling is demonstrated in the SnO₂-coated 3D etched Cu foam. This study not only prepares the etched Cu foam using the spontaneous chemical reactions but also demonstrates the potential for electroless plating method about surface modification on various metal substrates.

• Journal of the Korean Ceramic Society
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• v.54 no.6
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• pp.511-517
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• 2017

With different working pressures and substrate biases, Cr-Al-N coatings were deposited by hybrid physical vapor deposition (PVD) method, consisting of unbalanced magnetron (UBM) sputtering and arc ion plating (AIP) processes. Cr and Al targets were used for the arc ion plating and the sputtering process, respectively. Phase analysis, and composition, binding energy, and microstructural analyses were performed using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and field emission scanning electron microscopy (FESEM), respectively. Surface droplet size of Cr-Al-N coatings was found to decrease with increasing substrate bias. A decrease of the deposition rate of Cr-Al-N films was expected due to the increase of substrate bias. The coatings were grown with textured CrN phase and (111), (200), and (220) planes. X-ray diffraction data show that all Cr-Al-N coatings shifted to lower diffraction angles due to the addition of Al. The XPS results were used to determine the $Cr_2N$, CrN, and (Cr,Al)N binding energies. The compositions of the Cr-Al-N films were measured by XPS to be Cr 23.2~36.9 at%, Al 30.1~40.3 at%, and N 31.3~38.6 at%.

• Resources Recycling
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• v.13 no.2
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• pp.9-15
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• 2004

A large tons of spent iron oxide catalyst come from the Styrene Monomer(SM) production company. It is caused to pollute the land and underground water due to the high alkali contents in the catalyst by burying them in the landfill. In order to recycle the spent catalyst, a basic study on the recovery of chromium ion from metal plating wastewater with the spent catalyst was carried out. The iron oxide catalyst adsorbed physically $Cr^{+6}$ in the lower pH 3.0, that is the isoelectric point of the spent catalyst. It was found that the iron oxide catalyst reduced the $Cr^{+6}$ into Cr+3 by the oxidation of ferrous ion into ferric ion on the surface of catalyst, and precipitated as $Cr(OH)_3$ in the higher than pH 3.0. The $Cr^{+6}$ was recovered 2.0∼2.3g/L catalyst in the range of pH 0.5∼2.0, but it was recovered 1.5 g/L catalyst at pH 3.0 of wastewater. The recovery of Cr was increased as the higher concentration in the continuous process, but the flowrates were nearly affected on the Cr recovery.

• Polymer(Korea)
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• v.26 no.1
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• pp.105-112
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• 2002

The low actuation voltage and quick bending response of IPMC(ion-exchange polymer metal composite) are considered attractive for the construction of various types of actuators. In this study, in order to develop a new type actuators by using the IPMC platinum electrode of IPMC are fabricated by using electroless impregnation-reduction method plating. As the platinum-plating times are increased, IPMC performance was improved in terms of bending displacement and force due to the enhanced surface conductivity. In addition, we investigated the basic actuation characteristics of resonance frequency and actuator length as well as the effect of water uptake and ion mobility. Using the classical laminate theory(CLT), a modeling methodology was developed to predict the deformation, bending moment, and residual stress distribution of anisotropic IPMC thin plates. In this modeling methodology, the internal stress evolved by the unsymmetric distribution of water inside IPMC was quantitatively calculated and subsequently the bending moment and the curvature were estimated for various geometry of IPMC actuator.