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http://dx.doi.org/10.5695/JSSE.2022.55.6.460

Effect of addition of Tl+ and Pd2+ on the texture and hardness of the non-cyanide gold plating layer  

Heo, Wonyoung (Department of Materials Science and Metallurgical Engineering, Kyungpook National University)
Son, Injoon (Department of Materials Science and Metallurgical Engineering, Kyungpook National University)
Publication Information
Journal of the Korean institute of surface engineering / v.55, no.6, 2022 , pp. 460-468 More about this Journal
Abstract
Due to its high electrical conductivity, low contact resistance, good weldability and high corrosion resi-stance, gold is widely used in electronic components such as connectors and printed circuit boards (PCB). Gold ion salts currently used in gold plating are largely cyan-based salts and non-cyanic salts. The cya-nide bath can be used for both high and low hardness, but the non-cyanide bath can be used for low hardness plating. Potassium gold cyanide (KAu(CN)2) as a cyanide type and sodium gold sulfite (Na3[Au(SO)3]2) salt as a non-cyanide type are most widely used. Although the cyan bath has excellent performance in plating, potassium gold cyanide (KAu(CN)2) used in the cyan bath is classified as a poison and a toxic substance and has strong toxicity, which tends to damage the positive photoresist film and make it difficult to form a straight side-wall. There is a need to supplement this. Therefore, it is intended to supplement this with an eco-friendly process using sodium sulfite sodium salt that does not contain cyan. Therefore, the main goal is to form a gold plating layer with a controllable hardness using a non-cyanide gold plating solution. In this study, the composition of a non-cyanide gold plating solution that maintains hardness even after annealing is generated through gold-palladium alloying by adding thallium, a crystal regulator among electrolysis factors affecting the structure and hardness, and changes in plating layer structure and crystallinity before and after annealing the correlation with the hardness.
Keywords
Gold; Electroplating; Gold sulfite; Thallium; Palladium;
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