Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Effect of addition of Tl+ and Pd2+ on the texture and hardness of the non-cyanide gold plating layer

논시안 금도금층의 조직과 경도에 미치는 Tl+ 과 Pd2+ 이온첨가의 영향

  • Heo, Wonyoung (Department of Materials Science and Metallurgical Engineering, Kyungpook National University) ;
  • Son, Injoon (Department of Materials Science and Metallurgical Engineering, Kyungpook National University)
  • 허원영 (경북대학교 신소재공학부 금속신소재공학전공) ;
  • 손인준 (경북대학교 신소재공학부 금속신소재공학전공)
  • Received : 2022.12.16
  • Accepted : 2022.12.27
  • Published : 2022.12.31
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Abstract

Due to its high electrical conductivity, low contact resistance, good weldability and high corrosion resi-stance, gold is widely used in electronic components such as connectors and printed circuit boards (PCB). Gold ion salts currently used in gold plating are largely cyan-based salts and non-cyanic salts. The cya-nide bath can be used for both high and low hardness, but the non-cyanide bath can be used for low hardness plating. Potassium gold cyanide (KAu(CN)2) as a cyanide type and sodium gold sulfite (Na3[Au(SO)3]2) salt as a non-cyanide type are most widely used. Although the cyan bath has excellent performance in plating, potassium gold cyanide (KAu(CN)2) used in the cyan bath is classified as a poison and a toxic substance and has strong toxicity, which tends to damage the positive photoresist film and make it difficult to form a straight side-wall. There is a need to supplement this. Therefore, it is intended to supplement this with an eco-friendly process using sodium sulfite sodium salt that does not contain cyan. Therefore, the main goal is to form a gold plating layer with a controllable hardness using a non-cyanide gold plating solution. In this study, the composition of a non-cyanide gold plating solution that maintains hardness even after annealing is generated through gold-palladium alloying by adding thallium, a crystal regulator among electrolysis factors affecting the structure and hardness, and changes in plating layer structure and crystallinity before and after annealing the correlation with the hardness.

Keywords

Acknowledgement

본 연구는 산업통상자원부의 재원으로 한국산업기술평가관리원 소재부품기술개발사업(20017189, 반도체소자 접합공정용 무시안 금 범프 소재 및 도금공정기술 개발)의 지원과 한국연구재단의 중견연구사업(2020R1A2C1014604, LCD구동 드라이버IC의 전극 형성용 친환경 금도금에 관한 연구)의 지원을 받아 수행된 연구로 연구비 지원에 감사드립니다.

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