• Proceedings of the KWS Conference
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• 2010.05a
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• pp.82-82
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• 2010

표면실장 공법을 통해 CSP 패키지를 보드에 실장 하는데 있어 무연솔더 접합부의 신뢰성에 영향을 미치는 인자 중 가장 중요한 것은 접합부에 형성되는 IMC (Intermetallic compound, 금속간화합물)인 것으로 알려져 있다. 접합부의 칩 부분에는 솔더와 칩의 UBM (Under bump metalization)이 접합하여 IMC가 형성되나, 보드 부분에는 솔더와 보드의 UBM 뿐만 아니라 그 사이에 솔더 페이스트가 함께 접합되어 IMC가 형성된다. 본 연구에서는 패키지의 신뢰성 연구를 위해 솔더 페이스트의 유무 및 두께에 따른 무연 솔더 접합부의 미세조직의 변화를 분석하였다. 본 실험에서는 Sn-3.0(Wt.%)Ag-0.5Cu 조성과 본 연구진에 의해 개발된 Sn-Ag-Cu-In 조성의 직경 $450{\mu}m$ 솔더 볼을 사용하였으며, 솔더 페이스트는 상용 Sn-3.0Ag-0.5Cu (ALPHA OM-325)를 사용하였다. 칩은 ENIG (Electroless nickel immersion gold) finish pad가 형성된 CSP (Chip scale package)를, 보드는 OSP (Organic solderability preservative)/Cu finish pad가 형성된 것을 사용하였다. 실험 방법은 보드를 솔더 페이스트 없이 플라즈마 처리 한 것, 솔더 페이스트를 $30{\mu}m$ 두께로 인쇄한 것, $120{\mu}m$의 두께로 인쇄한 것, 이렇게 3가지 조건으로 준비한 후, 솔더 볼이 bumping된 칩을 mounting하여, $242^{\circ}C$의 peak 온도 조건의 oven(1809UL, Heller)에서 reflow를 실시하여 패키지를 형성하였다. 이후 시편은 정밀 연마한 후, OM(Optical Microscopic)과 SEM(scanning electron microscope) 및 EDS(energy dispersive spectroscope)를 사용하여 솔더 접합부 IMC의 미세조직을 관찰, 분석하였다.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.2
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• pp.300-308
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• 2004

The formation mechanism of anodic oxide films on Mg alloys when anodized in NaOH solution. was investigated by focusing on the effects of anodizing potential. Al content. and anodizing time. Pure Mg and Mg-Al alloys were anodized for 10 min at various potentials in NaOH solutions. $Mg(OH)_2$ was generated by an active dissolution reaction at the surface. and the product was affected by temperature. The intensity ratio of $Mg(OH)_2$ in the XRD analysis decreased with increasing applied potential. while that of MgO increased. The anti-corrosion properties of anodized specimens at each constant potential were better than those of non-anodized specimens. The specimen anodized at an applied potential of 3 V had the best anti-corrosion property. And the intensity ratio of $Mg_{17}Al_{12}$/Mg increased with aluminum content in Mg-Al alloys. During anodizing. the active dissolution reaction occurred preferentially in ${\beta}\;phase(Mg_{17}Al_{12})$ until about 4 mins. and then the current density increased radually until 7 mins. The dissolution reaction progressed in a phase(Mg) which not formed the intermetallic compound. which had a lower Al content. In the anodic polarization test of $0.017\;mol{\cdot}dm^-3$ NaCl and $0.1\;mol{\cdot}dm^-3\;Na_2SO_4$ at 298 K. the current density of Mg-15 mass% Al alloy anodized for 10 mins increased. since the anodic film that forms on the a phase is a non-compacted film. The anodic film on the phase for 30 mins was a compact film as compared with that for 10 mins.

• Korean Journal of Materials Research
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• v.5 no.7
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• pp.869-879
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• 1995

TiAi intermetallic compound has been extensively studied for possible high temperature structural applications because of its high specific strength at high temperature, high creep resistance, and good oxidation resistance at elevated temperatures. In addition to its good properties, an economic manufacturing routes should be developed for this material to be used more extensively. One of the promising route in manufacturing TiAl intermetallics is the Self-propagating High-temperature Synthesis (SHS) method. Thus in this study, an attempt was made to study the mechanism of the SHS process in TiAl synthesis. The composition of the sample was Ti-(45, 50, 53)at% Al and the microstuctures of the products were analyzed using optical microscope and scanning electron microscope. When the phases formed at the main SHS reaction of whicyh combustion temperature is higher than the melting temperature of aluminum were identified as TiAl and Ti$_3$Al ; Ti$_3$Al cores surrounded by TiAl phase. In order to increase the combustion temperature, carbon was added 5 and 10at.%. When the carbon content was 10at.%, the heat of the reaction was large enough to melt the phase formed and that is consistent with the theoretical calculation results of the adiabatic temperature. The combution temperatue, which was measured by a computer data acquisition system, increased with the carbon content. The phases formed from the reaction involving the carbon added were indentified as TiAl and Ti$_2$AlC using XRD. The vickers hardness of the reaction product increased with the carbon content.

• Journal of the Korean Vacuum Society
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• v.13 no.3
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• pp.127-131
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• 2004

Package reliability test was conducted to investigate the effect of solder composition on the ball fatigue strength for BGA (Ball Grid Array) packaging. The test pieces are assembled using eutectic composition 63Sn/37Pb, 62Sn/36Pb/2Ag, and 63Sn/34.4Pb/2Ag/0.5Sb solder after pre-conditioning at MRT Lv 3 (Moisture Resistance Test Level) and then conducted under T/C (Temperature Cycle test). For each case, the ball shear strength was obtained and micro structure photos were taken. SEM (scanning electron microscope) and EDX (Energy Dispersive X-ray) were used to the analyze failure mechanism. The growth rate of Au-Sn intermetallic compound in Sn63Pb34.5Ag2Sb0.5 solder was slow when compared to 63Sn/37Pb solder and 62Sn/36Pb/2Ag solder. The degradation of shear strength of solder balls caused by solder composition was discussed.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.3
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• pp.155-161
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• 2009

An investigation of the deformation behavior of ${\gamma}'-Ni_3Al$ single crystals containing fine dispersion of disordered ${\gamma}$ particles was performed for several different crystal orientations. Deformation structures were observed by the weak-beam method of transmission electron microscopy (TEM). The critical resolved shear stress (CRSS) for (111) [$\bar{1}$01] slie. increases with increasing temperature in the temperature range where (111) slip operates. The CRSS for (111) [$\bar{1}$01] slip is dependent on crystal orientation in the corresponding temperature range. The temperature where the strenjlth reaches a maximum is dependent on crystal orientation; the higher the ratio of the Schmid factors of (010) [$\bar{1}$01] to that of (111) [$\bar{1}$01], the higher the peak temperature. The peak temperatures were increased by the precipitation of y particles for the samples of all orientations. Electron microscopy of deformation induced dislocation arrangements under peak temperature has revealed that most of dislocations are straight screw dislocations. The mobility of screw dislocations decreases with increasing temperature. Above the peak temperature, dislocations begin to cross slip from the (111) [$\bar{1}$01] slip system to the (010) [$\bar{1}$01] slip system, thus decreasing the strength.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.241-247
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• 2006

Structural studies have been performed on precipitation hardening discovered in $L1_2-ordered\;Ni_3(Al,Cr)$ containing 0.2 to 3.0 mol% of carbon using transmission electron microscopy (TEM). Fine octahedral precipitates of $M_{23}C_6$ appeared in the matrix by aging at temperatures around 973 K after solution treatment at 1423 K. TEM examination revealed that the $M_{23}C_6$ phase and the matrix lattices have a cube-cube orientation relationship and keep partial atomic matching at the {111} interface. After prolonged aging or by aging at higher temperatures, the $M_{23}C_6$ precipitates then adopt a rod-like morphology elongated parallel to the <100> directions. Deformation at temperature below 973 K, typical Orowan loops were observed surrounding the $M_{23}C_6$ particles. At higher deformation temperatures, the Orowan loops disappeared and the morphology of dislocations at the particle-matrix interfaces suggested the existence of attractive interaction between dislocations and particles. The change of the interaction modes between dislocation and particles with increasing deformation temperature can be considered as a result of strain relaxation at the interface between matrix and particles.

• Korean Journal of Materials Research
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• v.13 no.2
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• pp.126-132
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• 2003

In order to evaluate the corrosion resistance at the anode side separator for molten carbonate fuel cell, STS316 and SACC-STS316 (chromium and aluminum were simultaneously deposited by diffusion into STS316 authentic stainless steel substrate by pack-cementation process) were applied as the separator material. In case of STS316, corrosion proceeded via three steps ; a formation step of corrosion product until stable corrosion product, a protection step against corrosion until breakaway occurs, a advance step of corrosion after breakaway. Especially, STS316 would be impossible to use the separator without suitable surface modification because of rapid corrosion rate after formation of corrosion product, occurs the severe problem on stability of cell during long-time operation. Whereas, SACC-STS316 was showed more effective corrosion resistance than the present separator, STS316 due to the intermetallic compound layer such as NiAl, Ni3Al formed on the surface of STS316 specimen. And it is anticipated that, in order to use SACC-STS316 alternative separator at the anode side, coating process, which can lead to dense coating layer, has to be developed, and by suitable pre-treatment before using it, very effective corrosion resistance will be achieved.

• Journal of the Korean Society for Heat Treatment
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• v.21 no.1
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• pp.20-25
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• 2008

Structural studies have been performed on precipitation hardening and microstructural variations found in Ti-Al-Cr ternary $L1_0$- and $L1_2$-phase alloys using transmission electron microscopy. Both the $L1_0$ and $L1_2$ phase alloys harden by aging at 973 K after solution annealing at higher temperatures. The amount of age hardening of the $L1_2$ phase alloy is larger than that of the $L1_0$ phase alloy. The phase separation between $L1_0$ and $L1_2$ phase have not been observed by aging at 973 K. But $Al_2Ti$ was formed in each matrix alloy during aging. The crystal structure of the $Al_2Ti$ phase is a $Ga_2Zr$ type in the $L1_0$ and a $Ga_2Hf$ type in the $L1_2$ phase, respectively. At the beginning of aging the fine coherent cuboidal $Al_2Ti$-phase are formed in the $L1_0$ phase. By further aging, two variants of $Al_2Ti$ precipitates grow along the two {110} habit planes. On the other hand, in the $L1_2$ phase, the $Al_2Ti$ phase forms on the {100} planes of the $L1_2$ matrix lattice. After prolonged aging the precipitates are rearranged along a preferential direction of the matrix lattice and form a domain consisting of only one variant. It is suggested that the precipitation of $Al_2Ti$ in each matrix alloy occurs to form a morphology which efficiently relaxes the elastic strain between precipitate and matrix lattices.