1 |
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[
J. H. Westbrook
] /
Intermetallic compounds
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2 |
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[
E. Zamborsky
] /
Fundamentals of BGA Rework
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3 |
Brittle Interfacial Fracture of PBGA Packages Soldered on Electroless Ni/Immersion Au
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[
Z. Mei;A. Eslambolchi;P. Johnson
] /
Electronic Components and Technology Conference, 48th IEEE
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4 |
Manufacturing Concerns When Soldering with Au Plated Component Leads or Circuit Board Pads
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[
M. E. Ferguson;C. D. Fieselman;M. A. Elkins
] /
IEEE Transactions on Components, Packaging, and Manufacturing Technology
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5 |
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[
K. Banerji;R. F. Darveaux
] /
Microstructures and Mechanical Properties of Aging Materials
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