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Effects of Fatigue Strength by Solder Ball Composition  

김경수 (광운대학교 전자재료공학과)
김진영 (광운대학교 전자재료공학과)
Publication Information
Journal of the Korean Vacuum Society / v.13, no.3, 2004 , pp. 127-131 More about this Journal
Abstract
Package reliability test was conducted to investigate the effect of solder composition on the ball fatigue strength for BGA (Ball Grid Array) packaging. The test pieces are assembled using eutectic composition 63Sn/37Pb, 62Sn/36Pb/2Ag, and 63Sn/34.4Pb/2Ag/0.5Sb solder after pre-conditioning at MRT Lv 3 (Moisture Resistance Test Level) and then conducted under T/C (Temperature Cycle test). For each case, the ball shear strength was obtained and micro structure photos were taken. SEM (scanning electron microscope) and EDX (Energy Dispersive X-ray) were used to the analyze failure mechanism. The growth rate of Au-Sn intermetallic compound in Sn63Pb34.5Ag2Sb0.5 solder was slow when compared to 63Sn/37Pb solder and 62Sn/36Pb/2Ag solder. The degradation of shear strength of solder balls caused by solder composition was discussed.
Keywords
solder ball; fatigue strength; package reliability; shear strength;
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