• Journal of Powder Materials
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• v.9 no.6
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• pp.422-432
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• 2002

Mechanically driven decomposition of intermetallics during mechanical milling(MM 1 was investigated. This process for Fe-Ce and Fe-Sn system was studied using conventional XRD, DSC, magnetization and alternative current susceptibility measurements. Mechanical alloying and milling form products of the following composition (in sequence of increasing Gecontent): $\alpha$(${\alpha}_1$) bcc solid solution, $\alpha$+$\beta$-phase ($Fe_{2-x}Ge$), $\beta$-phase, $\beta$+FeGe(B20), FeGE(B20), FeGe(B20)+$FeGe_2$,$FeGe_2$,$FeGe_2$+Ge, Ge. Incongruently melting intermetallics $Fe_6Ge_5$ and $Fe_2Ge_3$ decompose under milling. $Fe_6Ge_5$ produces mixture of $\hat{a}$-phase and FeGe(B20), $Fe_2Ge_3$ produces mixture of FeGe(B20) and $FeGe_2$ phases. These facts are in good agreement with the model that implies local melting as a mechanism of new phase for-mation during medchanical alloying. Stability of FeGe(B20) phase, which is also incongruently melting compound, is explained as a result of highest density of this phase in Fe-Ge system. Under mechanical milling (MM) in planetary ball mill, FeSn intermetallic decomposes with formation $Fe_5Sn_3$ and $FeSn_2$ phases, which have the biggest density among the phases of Fe-Sn system. If decomposition degree of FeSn is relatively small(<60%), milled powder shows superparamagnetic behavior at room temperature. For this case, magnetization curves can be fitted by superposition of two Langevin functions. particle sizes for ferromagnetic $Fe_5Sn_3$ phase determined from fitting parameters are in good agreement with crystalline sizes determined from XRD data and remiain approximately chageless during MM. The decomposition of FeSn is attributed to the effects of local temperature and local pressure produced by ball collisions.

• Journal of Korea Foundry Society
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• v.21 no.6
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• pp.336-342
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• 2001

This study was carried out to examine the effects of adding 0.3at.%Hf in Fe-30at.%Al-5at.%Cr alloy on the variation of microstructures and hot workability. The effect of hot rolling on mechanical properties was estimated by measuring the elongation and tensile strength after rolling at 800 and 1000 respectively. Microstructure of Fe-30at.%Al-5at.%Cr alloy was consisted of large equiaxed grains and it was changed to quasi-equiaxed or columnar structures by adding 0.3at.%Hf to Fe-30at.%Al-5at.%Cr alloy. Every specimens showed a decreased tensile strength after hot rolling compared to that of before rolling. The elongation was increased by hot rolling. Remarkable changes in elongation by hot rollong was observed such as from 1.4% to 4.5% elongation at the specimen of 0.3at.%Hf added to Fe-30at.%Al-5at.%Cr. Fe-30at.%Al-5at.%Cr alloy showed typical cleavage fracture on tensile failure and hot rolling has negligible effects on fracture mode in this alloy. However at the alloy containing Hf fracture mode was changed by hot rolling from intergranular to mixed intergranular and transgranular fracture mode.

• Transactions on Electrical and Electronic Materials
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• v.16 no.5
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• pp.268-273
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• 2015

While analyzing the specimens before and after the thermal shock test, we found that the power drop rate of the bare cell was 5.08%, while the power drop rate of the ribboned cell was 16.49%. In comparative terms, the efficiency was lower at the ribboned cell than at the bare cell. While analyzing through EL (Electroluminescence) shots and cross sections, we tried to decipher the exact cause of the power drop. Although mere color change of the cell was observed at the surface of the bare cell, no abnormality could be found inside the cell. On the surface of the ribboned cell, the short circuit of gridfinger extended from the front part of the front electrode of the ribboned cells. Therefore, cracks occurred on the surface of the cell. Cracks also appeared inside the cell. While analyzing the I-V curve, we determined an increase in the leakage current and an increase of resistances in series in the bare cell. In the ribboned cell, the resistances in parallel reduced remarkably. An increase of resistances in series could also be verified. Conclusively, we deduced that the power drop rate in the bare cell is a life span of the cell itself; aging is the cause of power drop rate in cells. In case of ribboned cell, the power drop rate was directly influenced by internal cracks and an intermetallic compound layer joining the ribbon at the front electrode.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.85-90
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• 2011

With regard to reliability of solder joint, the significant failures include open defects that occurs from alignment problem, Head in Pillow by PCB's warpage, the crack of solder by CTE mismatch, and the crack of IMC layer by mechanical impact. Especially as PCB down-sizing and surface finish is under progress, brittle failure of IMC layer between solder bump and PCB pad becomes a big issue. Therefore, it requires enhancing the level of difficulty in the existing assessment method and improving the measurement through the study on the mechanism of IMC formation, growth and brittle failure. Under this circumstance, this study is intended to suggest the direction of research for improving the reliability on the crack such as improvement of IMC brittle fracture.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.37-42
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• 2003

In soldering of electronic packaging, the research on substituting lead-free solder materials for Pb-Sn alloys has become active due to environmental and health concerns over the use of lead. The reliability of the solder joint is very important in the development of solder materials and it is known that it is related to wettability of the solder over the substrate and microstructural evolution during soldering. It is also highly affected by type and extent of the interfacial reaction between solder and substrate and therefore, it is necessary to understand the interfacial reaction between solder and substrate completely. In order to predict the intermetallic compound (IMC) phase which forms first at the substrate/solder interface during the soldering process, a thermodynamic methodology has been suggested. The activation energy for the nucleation of each IMC phases is represented by a function of the interfacial energy and the driving force for phase formation. From this, it is predicted that the IMC phase with the smallest activation energy forms first. The grain morphology of the IMC at the solder joint is also explained by the calculations which use the energy. The Jackson parameter of the IMC grain with a rough surface is smaller than 2 but it is larger than 2 in the case of faceted grains.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.2
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• pp.96-103
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• 2010

$Ni_3Al$ is known as a good high temperature structural material because of high yield strength at ambient temperature. However, it is too brittle to use as a structural material because of their weak grain boundary. In this work, orientation measurement and related mechanical properties of directionally solidified NiAl/$Ni_3Al$ two-phase alloys with various compositions (Ni-23~27 at.%Al) were investigated for developing multi-phase DS-processed alloys with the growth rates of 10, 50 and 100 ${\mu}m/s$ in a modified Bridgeman type furnace. It was found that the multi-phase microstructures such as the $\gamma$ dendrite +${\gamma}'$ matrix duplex microstructure was formed in the hypoeutectic composition of 23 at.%Al, $\beta$ dendrite +${\gamma}'$ matrix duplex microstructure in the hypereutectic composition of 26 and 27 at.%Al. And ${\gamma}'$ single phase was formed in the composition of 24.5 and 25 at.%Al. The hypoeutectic alloy including $\gamma$ dendrites with ${\gamma}'$ matrix showed a large elongation of over 70% at room temperature. However, the room-temperature tensile elongation decreased with increasing Al contents because the volume fraction of brittle $\beta$ dendrites in the ductile ${\gamma}'$ matrix increased.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.11a
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• pp.43-49
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• 2002

A7003 alloy has characteristics of their excellent weldability, high corrosion resistance and superior plastic working however the broadening of application for the alloy has been hampered by the lower extrudability associated by Mg content. For improvement of extrudability and enhanced recovery efficiency during Al scrap recyeling, it has been generally practiced to reduce Mg content in A7003 alloy. Therefore, it is necessary to investigate the influence of Mg content on mechanical strength and extrudability of A7003 alloy. For efficient material processing which has small amounts, life cycle assessment in material processing(MLCA) is evaluated. The quantitative analysis of energy requirements and $CO_2$ emission for production of A7003 extruded bar are estimated with different Mg content and billet pre-heating process (heating source by light oil or LPG). In particular, the estimation of energy requirements was performed within shipping and gating range (except the mining and extraction stages)to investigate the influence of the variables on energy requirements and $CO_2$ emission in detail. As Mg content increased, the flow stress and the extrusion pressure for A7003 alloy increased. It has been thought that an increment in extrusion pressure with increasing Mg content is caused by the solid solution hardening of Mg atoms in the matrix and increment in volume fraction of intermetallic compound, $Mg_2Si$. The extrudability and the tensile strength are equal to, or above that of conventional A 7003 alloy even the content of Mg varied from $1.1wt.\%\;to\;0.5wt.\%$ alloy. This means that minimizing the content of Mg in A7003 alloy can enhance recovery efficiency during Al scrap recycling. It can be quoted that rather than Mg content energy source for billet heating is a prime factor to determine the atmospheric $CO_2$ emission.

• Journal of Welding and Joining
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• v.23 no.3
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.