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http://dx.doi.org/10.6117/kmeps.2011.18.4.085

Failure Mechanism and Test Method for Reliability Standardization of Solder Joints  

Kim, Kang-Dong (Samsung Electro-Mechanics)
Huh, Seok-Hwan (Samsung Electro-Mechanics)
Jang, Joong-Soon (Division of Industrial & Information Systems Engineering, Ajou University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.4, 2011 , pp. 85-90 More about this Journal
Abstract
With regard to reliability of solder joint, the significant failures include open defects that occurs from alignment problem, Head in Pillow by PCB's warpage, the crack of solder by CTE mismatch, and the crack of IMC layer by mechanical impact. Especially as PCB down-sizing and surface finish is under progress, brittle failure of IMC layer between solder bump and PCB pad becomes a big issue. Therefore, it requires enhancing the level of difficulty in the existing assessment method and improving the measurement through the study on the mechanism of IMC formation, growth and brittle failure. Under this circumstance, this study is intended to suggest the direction of research for improving the reliability on the crack such as improvement of IMC brittle fracture.
Keywords
Solder Bump; Intermetallic compound; Brittle fracture; Solder joint; Reliability;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
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