• 제목/요약/키워드: intermetallic

검색결과 786건 처리시간 0.023초

Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)

  • Kim, Jeonga;Park, Cheolho;Cho, Kyung-Mox;Hong, Wonsik;Bang, Jung-Hwan;Ko, Yong-Ho;Kang, Namhyun
    • Electronic Materials Letters
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    • 제14권6호
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    • pp.678-688
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    • 2018
  • The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

3차원 칩 적층을 위한 Cu pillar/Sn-3.5Ag 미세범프 접합부의 금속간화합물 성장거동에 따른 전단강도 평가 (Effect of Intermetallic Compounds Growth Characteristics on the Shear Strength of Cu pillar/Sn-3.5Ag Microbump for a 3-D Stacked IC Package)

  • 곽병현;정명혁;박영배
    • 대한금속재료학회지
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    • 제50권10호
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    • pp.775-783
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    • 2012
  • The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.

Thermal Compatibility of High Density U-Mo Powder Fuels Prepared by Centrifugal Atomization

  • Kim, Ki-Hwan;Ahn, Hyun-Suk;Chang, Se-Jung;Ko, Young-Mo;Lee, Don-Bae;Kim, Chang-Kyu;Kuk, Il-Hyun
    • 한국원자력학회:학술대회논문집
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    • 한국원자력학회 1997년도 춘계학술발표회논문집(2)
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    • pp.165-170
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    • 1997
  • Samples of extruded dispersions of 24 vol.% spherical U-2wt%Mo and U-10wt.%Mo powders in an aluminum matrix were annealed for over 2,000 hours at 40$0^{\circ}C$. No significant dimensional changes occurred in the U-1025.%Mo/aluminum dispersions. The U-2wt.%Mo/aluminum dispersion, however, increased in volume by 26% after 2,000 hours at 40$0^{\circ}C$. This large volume change is mainly due to the formation of voids and cracks resulting from nearly complete interdiffusion of U-Mo and aluminum. Interdiffusion between U-10wt.%Mo and aluminum was found to be minimal. The different diffusion behavior is primarily due to the fact that U-2wt.%Mo decomposes from an as-atomized metastable r-phase(bcc) solid solution into the equilibrium r-U and U$_2$Mo two-phase structure during the experiment, whereas U-10wt.%Mo retains the metastable r-phase structure after the 2,000 hours anneal and thereby displays superior thermal compatibility with aluminum compared to U-2wt.%Mo. In addition, the molybdenium supersaturated in U-10wt.%Mo particles inhibits the diffusion of aluminum atoms along the grain boundary into the particle. Also, the dissolution of only a few Mo atoms in UAL$_3$ retards the formation of the intermediate phase, as Mo atoms need to migrate from new intermetallic compounds to unreacted islands.

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Nb-T2 합금의 파쇄분말을 사용한 Nb-Si-B계 합금의 제조 (Fabrication of Nb-Si-B Alloys Using the Pulverized Nb-T2 Alloy Powder)

  • 조민호;김성준;강현지;오승탁;김영도;이성;석명진
    • 한국분말재료학회지
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    • 제26권4호
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    • pp.299-304
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    • 2019
  • Nb-Si-B alloys with Nb-rich compositions are fabricated by spark plasma sintering for high-temperature structural applications. Three compositions are selected: 75 at% Nb (Nb0.7), 82 at% Nb (Nb1.5), and 88 at% Nb (Nb3), the atomic ratio of Si to B being 2. The microstructures of the prepared alloys are composed of Nb and $T_2$ phases. The $T_2$ phase is an intermetallic compound with a stoichiometry of $Nb_5Si_{3-x}B_x$ ($0{\leq}x{\leq}2$). In some previous studies, Nb-Si-B alloys have been prepared by spark plasma sintering (SPS) using Nb and $T_2$ powders (SPS 1). In the present work, the same alloys are prepared by the SPS process (SPS 2) using Nb powders and hypereutectic alloy powders with composition 67at%Nb-22at%Si-11at%B (Nb67). The Nb67 alloy powders comprise $T_2$ and eutectic ($T_2+Nb$) phases. The microstructures and hardness of the samples prepared in the present work have been compared with those previously reported; the samples prepared in this study exhibit finer and more uniform microstructures and higher hardness.

24개월 대기 노출된 Al1050 및 Al7075 알루미늄 합금 산화막에 대한 투과전자현미경 분석 (TEM Analysis on Oxide Films of Al1050 and Al7075 Exposed to 24-month Atmospheric Conditions)

  • 김대건;김가림;최원준;반치범
    • 한국표면공학회지
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    • 제52권2호
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    • pp.62-71
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    • 2019
  • Al1050 and Al7075 alloy specimens were exposed to atmospheric conditions for 24 months and analyzed by Transmission Electron Microscopy to characterize their corrosion behavior and oxide film characteristics, especially focusing on intergranular corrosion or oxidation. In general, the intergranular oxygen penetration depth of Al1050 was deeper than Al7075. Since O and Si signals were overlapped at the oxidized grain boundaries of Al1050 and Mg is not included in Al1050, it is concluded that Si segregated along the grain boundaries directly impacts on the intergranular corrosion of Al1050. Cr-Si or Mg-Si intermetallic particles were not observed along the grain boundaries of Al7050, but Mg-Si particle was barely observed in the matrix. 10-nm size Mg-Zn particles were also found all over the matrix. Mg was mainly observed along the oxidized grain boundary of Al7075, but Si was not detected due to the Mg-Si particle formation in the matrix and relatively low concentration of Si in Al7075. Therefore, it is thought that Mg plays an important role in the intergranular corrosion of Al7075 under atmospheric corrosion conditions.

삽입금속 Cu를 이용한 TiAl 합금과 SCM440의 마찰용접 계면 특성 (Interfacial Properties of Friction-Welded TiAl and SCM440 Alloys with Cu as Insert Metal)

  • 박성현;김기영;박종문;최인철;;오명훈
    • 한국재료학회지
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    • 제29권4호
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    • pp.258-263
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    • 2019
  • Since the directly bonded interface between TiAl alloy and SCM440 includes lots of cracks and generated intermetallic compounds(IMCs) such as TiC, FeTi, and $Fe_2Ti$, the interfacial strength can be significantly reduced. Therefore, in this study, Cu is selected as an insert metal to improve the lower tensile strength of the joint between TiAl alloy and SCM440 during friction welding. As a result, newly formed IMCs, such as $Cu_2TiAl$, CuTiAl, and $TiCu_2$, are found at the interface between TiAl alloy and Cu layer and the thickness of IMCs layers is found to vary with friction time. In addition, to determine the relationship between the thickness of the IMCs and the strength of the welded interfaces, a tensile test was performed using sub-size specimens obtained from the center to the peripheral region of the friction-welded interface. The results are discussed in terms of changes in the IMCs and the underlying deformation mechanism. Finally, it is found that the friction welding process needs to be idealized because IMCs generated between TiAl alloy and Cu act to not only increase the bonding strength but also form an easy path of fracture propagation.

표면개질 기술에 의한 Cu 기반 바이메탈의 인장강도, 스크래치 저항성 및 트라이볼로지 성능 향상 (Improvement in Tensile Strength, Scratch Resistance and Tribological Performance of Cu-based Bimetals by Surface Modification Technology)

  • 카림바예프 루슬란;아마노프 아웨즈한
    • Tribology and Lubricants
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    • 제37권3호
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    • pp.83-90
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    • 2021
  • In this study, an ultrasonic nanocrystal surface modification (UNSM) was used to improve the mechanical properties, scratch resistance and tribological performance of Cu-based bimetals, which are usually used to manufacture sliding bearings and bushings for internal combustion engines (ICEs). Two different Cu-based bimetals, namely CuPb10Sn10 and CuSn10Bi7, were sintered onto a low carbon steel substrate. The mechanical properties and dry tribological performance using a tensile tester and micro-tribo tester were evaluated, respectively. The scratch resistance was assessed using a micro-scratch tester at an incremental load. The tensile test results showed that the yield strength (YS) and ultimate tensile strength (UTS) of both Cu-based bimetals increased after UNSM. Furthermore, the scratch and tribological tests results revealed that the scratch resistance and tribological performance of both Cu-based bimetals were improved by the application of UNSM. These improvements were mainly attributed to the eliminated pores, increased hardness and reduced roughness after UNSM. CuSn10Bi7 demonstrated better mechanical properties, scratch resistance and tribological performance than CuPb10Sn10. It was found that the presence of Bi in CuSn10Bi7 formed a Cu11Bi7 intermetallic phase, which is harder than Cu3Sn. Hence, CuSn10Bi7 demonstrated higher strength and wear resistance than CuPb10Sn10. In addition, a CuSn10Bi7 formed both SnO2 and Bi2O3 that prevented adhesion and improved the tribological performance. It can be expected that under dry tribological conditions, ICEs can utilize UNSM bearings and bushings made of CuSn10Bi7 instead of CuPb10Sn10 under oil-lubricated conditions.

Al-Ni 전구체의 연소합성 발포에 의한 Al3Ni 폼과 할로우 파이프의 복합구조체 제작 및 폼의 충진성과 기공상태 조사 (Combustion of Al-Ni Precursor Al3Ni Foam Manufacture of Composite Structure with Hollow Pipe and Filling of Foam and Investigation of Pore Condition)

  • 한창석;진성윤;권혁구
    • 한국재료학회지
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    • 제29권10호
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    • pp.617-622
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    • 2019
  • In order to develop a process for manufacturing a composite structure of an intermetallic compound foam and a hollow material, the firing and pore form of the Al-Ni precursor in a steel pipe are investigated. When the Al-Ni precursor is foamed in a hollow pipe, if the temperature distribution inside the precursor is uneven, the pore shape distribution becomes uneven. In free foaming, no anisotropy is observed in the foaming direction and the pore shape is isotropic. However, in the hollow pipe, the pipe expands in the pipe axis direction and fills the pipe. The interfacial adhesion between $Al_3Ni$ foam and steel pipe is excellent, and interfacial pore and reaction layer are not observed by SEM. In free foaming, the porosity is 90 %, but it decreases to about 80 % in the foam in the pipe. In the pipe foaming, most of the pore shape appears elongated in the pipe direction in the vicinity of the pipe, and this tendency is more remarkable when the inside pipe diameter is small. It can be seen that the pore size of the foam sample in the pipe is larger than that of free foam, because coarse pores remain after solidification of the foam because the shape of the foam is supported by the pipe. The vertical/horizontal length ratio expands along the pipe axis direction by foaming in the pipe, and therefore circularity is reduced.

용융Al-Si도금 강재에 형성한 Cr 막의 고온 환경 중 내식특성 (Corrosion resistance at high temperature condition of Cr Films Formed on hot-dip Al-Si plated steel sheet)

  • 강민주;이승효;이명훈
    • 한국표면공학회지
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    • 제55권6호
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    • pp.448-459
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    • 2022
  • Generally, steel is the most commonly used in the industry because of good strength, processability and cost-effectiveness. Steel can be surface-treated such as coating or used as an alloy by adding elements such as Cr, Ni, Zr, and Al to increase corrosion resistance. However, even if steel is used in same environment corrosion resistance is sharply lowered when it is exposed to a high temperature for a fixed or extended period of time due to an overload or other factors. In particular, the use of hot-dip aluminized plated steel, which is used in high-temperature atmospheres, is increasing due to the surface Al2O3 oxide film. This steel necessitates an urgent solution as issues of corrosion resistance limitations often appear. It is an important issue that not only cause analysis but also the research for the surface treatment method that can be solved. Thus, in this study, Cr in which it is expected to be effective in corrosion resistance and heat resistance attempted to deposit on hot dip aluminized plated steel with PVD sputtering. And it was possible to present the surface treatment application of various types of industrial equipment exposed to high temperature and basic design guidelines for use by confirming the corrosion resistance of hot dip Al-Si plated steel with Cr film deposited at high temperature.

Ti/Al/STS 클래드재의 접합특성에 미치는 예비 열처리의 영향 (Effect of Pre-Heat Treatment on Bonding Properties in Ti/Al/STS Clad Materials)

  • 배동현;정수정;조영래;정원섭;정호신;강창룡;배동수
    • 대한금속재료학회지
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    • 제47권9호
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    • pp.573-579
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    • 2009
  • Titanium/aluminum/stainless steel(Ti/Al/STS) clad materials have received much attention due to their high specific strength and corrosion-resisting properties. However, it is difficult to fabricate these materials, because titanium oxide is easily formed on the titanium surface during heat treatment. The aim of the present study is to derive optimized cladding conditions and thereupon obtain the stable quality of Ti/Al/STS clad materials. Ti sheets were prepared with and without pre-heat treatment and Ti/Al/STS clad materials were then fabricated by cold rolling and a post-heat treatment process. Microstructure of the Ti/Al and STS/Al interfaces was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersed X-ray Analyser(EDX) in order to investigate the effects of Ti pre-heat treatment on the bond properties of Ti/Al/STS clad materials. Diffusion bonding was observed at both the Ti/Al and STS/Al interfaces. The bonding force of the clad material with non-heat treated Ti was higher than that with pre-heat treated Ti before the cladding process. The bonding force decreased rapidly beyond $400^{\circ}C$, because the formed Ti oxide inhibited the joining process between Ti and Al. Bonding forces of STS/Al were lower than those of Ti/Al, because brittle $Fe_3Al$, $Al_3Fe$ intermetallic compounds were formed at the interface of STS/Al during the cladding process. In addition, delamination of the clad material with pre-heat treated Ti was observed at the Ti/Al interface after a cupping test.