• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.68-71
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• 2003

The reaction of ultra-small eutectic 58Bl-42Sn solder bump with Au/Ni/Ti and Au/Cu/Ti UBMs during reflow was studied. The eutectic Bi-Sn solder bumps of $46{\mu}m$ diameter were fabricated by using the evaporation method and were reflowed using the rapid thermal annealing system. The intermetallic compound was characterized using a SEM, an EDS, and an XRD. The $(Cu_xAu_{1-x})_6Sn_5$ compounds formed at the interface between Bi-Sn solder and Au/Cu/Ti UBM. On the other hand, in the Bi-Sn solder bump on Au/Ni/Ti UBM, the faceted and rectangular intermetallic compounds were observed on the solder bump surface and inside the solder bump as well as at the UBM interface. These intermetallic compounds were Identified as $(Au_{l-x-y}Bi_xNi_y)Sn_2$ phase.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1295-1300
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• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

• 한국전기전자재료학회논문지
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• 제16권6호
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• 한국분말재료학회지
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• 제1권1호
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• pp.66-71
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• 1994

Optical microstructures and mechanical properties of Na gas atomized Al-20Si-5Fe alloying powder and its hot extrudates were studied on 3 different types of powder size distribution. This powder showed the size distribution of 10~210 $\mu\textrm{m}$. Also the microstructures of $\alpha$-Al, primary and eutectic Si and needle shaped intermetallic compounds were observed by optical microscope. These needle shaped intermetallic compounds were identified as ${\delta}Al_4FeSi_2$- by XRD and EDX analysis. The ultimate tensile strength(UTS) of these alloy extrudates was increased from 324 to 390 MPa with decreasing powder size range from 120~210 $\mu\textrm{m}$ to 10~64 $\mu\textrm{m}$. A value of Micro-vic-kers hardness was simillar to the result of UTS. These extrudates showed better wear resistance than those of Al-20Si-2X(X : Ni, Cr, Zr), although they are insensitive to the size distribution. These results indicate that the presentation of ${\delta}Al_4FeSi_2$ intermetallic compounds contributed to the wear resistance improvement.

• Tribology and Lubricants
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• 제27권1호
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• pp.1-6
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• 2011

The possibility of Cu-Al-Ni intermetallic coating on the mild steel through the combustion synthesis has been investigated. In particular, the effect of the ball milling energy on the microstructure of the coating layer was examined to obtain the best coating condition. Experimental results show that Cu-Al-Ni powder compact was explosively synthesized and successfully coated with the steel matrix. It was revealed that the formation of $Cu_9Al_4$ intermetallic decreased with increase in the ball milling energy. This result supports that the high energy ball milling would be effective for obtaining the most suitable microstructure for Cu-Al-Ni coating layer. However, the excessive ball milling energy seems to decrease the bonding strength between the coating layer and the matrix.

• 한국재료학회지
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• 제13권9호
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• pp.561-566
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• 2003

Mechanical alloying(MA) process using elemental powders followed by hot pressing has been applied to some intermetallic alloy system containing ferromagnetic elements, such as NiAl and $FeSi_2$. A modified thermogravimetric analysis (TGA) technique was used to investigate the degree of alloying in milled powders and hot consolidated specimens as well as heat-treated bulk specimens. It is shown that the measurement of Curie temperatures in MA intermetallic powders and consolidated specimens containing ferromagnetic components, when determined as a function of milling and heat treatment parameters, can give some insight into the progress and mechanism of alloying.

• 한국표면공학회지
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• 제22권1호
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• pp.3-9
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• 1989

The intermetallic compount formation, growth rections, and growth kinetices as functions of the aging temperaturess, time, and the condition of substarte have invedtigted in the Sn/Cu and Sn/Ni bimetal couples. The η'-phase (Cu6Sn5) and $\delta$-phase (Ni3Sn4) were only found to grow at 20 and $70^{\circ}C$in the Sn/Cu and Sn/Ni bimetallic coples repectively. Above that temperatures, all other compounds were formed in sequence of high Sn content plase and the metastable Cu41Sn11 was formed at agend $200^{\circ}C$. The ectivation energy for the growth of intermetallic compounds was 14.7Kxal/mole in the Sn/Cu interface and 26.7Kcal/mole in the Sn/Ni interface.

• Corrosion Science and Technology
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• 제7권3호
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• pp.158-161
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• 2008

It is well known that iron is one of the most common impurity elements found in aluminum and its alloys. Iron in the aluminum forms an intermetallic compounds such as $FeAl_3$. The $FeAl_3$ particles on the aluminum surface are one of the most detrimental phases to the corrosion process and anodizing procedure for aluminum and its alloys. Trial and error surface treatment will be carried out to find the preferential and effective removal of $FeAl_3$ particles on the surfaces without dissolution of aluminum matrix around the particles. One of the preferable surface treatments for the aim of getting $FeAl_3$ free surface was an electrochemical treatment such as cathodic current density of $-2kAm^{-2}$ in a 20-30 mass% $HNO_3$ solution for the period of 300s. The corrosion characteristics of aluminum surface with $FeAl_3$ free particles are examined in a $0.1kmol/m^3$ NaCl solution. It is found that aluminum with free $FeAl_3$ particles shows higher corrosion resistance than aluminum with $FeAl_3$ particles.

• Journal of Welding and Joining
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• 제20권5호
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• pp.72-77
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of Welding and Joining
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• 제14권4호
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• pp.62-70
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• 1996

Al or Al-alloy have been known to be able to be claded on various materials by using explosive welding process, however, the intermetallic layer frequently formed along the interface have made this process very complicated. In this study, it was focussed to select the process variables, which can get rid of interfacial layer in the Al-claded steel plate. As a result, it was demonstrated that there was a certain range of explosive thickness which did not form the intermetallic phase as well as the non-bonded area. On the other hand, ultasonic tests performed for identifying the presence of interfacial layer nondestructively showed that it could be applied for the intended purpose but its result was weakly related with the microstructural quality of interface.