• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.301-306
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• 2005

Aging characteristics of newly developed Sn-1.8Bi-0.7Cu-0.6In solder was evaluated by shear strength and microstructure. Stencil printing was applied to form solder. The shear strength of Sn-1.8Bi-0.7Cu-0.6In at $150^{\circ}C$ showed the highest values through aging. Intermetallic compounds formed on the interface between solder and Au/Cu/Ni/Al UBM were $(Cu,\;Ni)_6Sn_5$ Furthermore, it was found that Spatting of Intermetallic compounds started before 500h aging at $150^{\circ}C$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Korean Journal of Materials Research
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• v.27 no.5
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• pp.276-280
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• 2017

This study was carried out to evaluate the developed microstructures and mechanical properties of friction welded A6063 alloy. For this work, specimens were prepared at a size of 12 mm ${\O}{\times}80mm$, and friction welding was carried out at a rotation speed of 2,000 RPM, friction pressure of $12kgf/cm^2$ and upset pressure of $25kgf/cm^2$. To perform an analysis of the grain boundary characteristic distributions, such as the grain size, orientation and misorientation angle distributions, the electron back-scattering diffraction method was used. In addition, in order to identify the dispersed intermetallic compounds of the base and welded materials, transmission electron microscopy was used. The experimental results found that the application of friction welding on A6063 led to significant grain refinement of the welded zone relative to that of the base material. Besides this, intermetallic compounds such as AlMnSi and $Al_2Cu$ were found to be dispersed with more refined size relative to that of the base material. This formation retains the mechanical properties of the welds, which results in the fracture aspect at the base material zone. Therefore, based on the developed microstructures and mechanical properties, the application of friction welding on A6063 could be used to obtain a sound weld zone.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.133-133
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• 1998

In the thin film alloy formation of the transition metals ion-beam-mixing technique forms a metastable structure which cannot be found in the arc-melted metal alloys. Sppecifically it is well known that the studies about the electronic structure of ion-beam-mixed alloys pprovide the useful information in understanding the metastable structures in the metal alloy. We studied the electronic change in the ion-beam-mixed ppt-Ct alloys by XppS and XANES. These analysis tools pprovide us information about the charge transfer in the valence band of intermetallic bonding. The multi-layered films were depposited on the SiO2 substrate by the sequential electron beam evapporation at a ppressure of less than 5$\times$10-7 Torr. These compprise of 4 ppairs of ppt and Cu layers where thicknesses of each layer were varied in order to change the alloy compposition. Ion-beam-mixing pprocess was carried out with 80 keV Ae+ ions with a dose of $1.5\times$ 1016 Ar+/cm2 at room tempperature. The core and valence level energy shift in these system were investigated by x-ray pphotoelectron sppectroscoppy(XppS) pphotoelectrons were excited by monochromatized Al K ａ(1486.6 eV) The ppass energy of the hemisppherical analyzer was 23.5 eV. Core-level binding energies were calibrated with the Fermi level edge. ppt L3-edge and Cu K-edge XANES sppectra were measured with the flourescence mode detector at the 3C1 beam line of the ppLS (ppohang light source). By using the change of White line(WL) area of the each metal sites and the core level shift we can obtain the information about the electrons pparticippating in the intermetallic bonding of the ion-beam-mixed alloys.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.1
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• pp.145-153
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• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

• Journal of Powder Materials
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• v.22 no.6
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• pp.426-431
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• 2015

Microstructural examination of the Nb-Si-B alloys at Nb-rich compositions is performed. The Nb-rich corner of the Nb-Si-B system is favorable in that the constituent phases are Nb (ductile and tough phase with high melting temperature) and $T_2$ phase (very hard intermetallic compound with favorable oxidation resistance) which are good combination for high temperature structural materials. The samples containing compositions near Nb-rich corner of the Nb-Si-B ternary system are prepared by spark plasma sintering (SPS) process using $T_2$ and Nb powders. $T_2$ bulk phase is made in arc furnace by melting the Nb slug and the Si-B powder compact. The $T_2$ bulk phase was subsequently ball-milled to powders. SPS is performed at $1300^{\circ}C$ and $1400^{\circ}C$, depending on the composition, under 30 MPa for 600s, to produce disc-shaped specimen with 15 mm in diameter and 3 mm high. Hardness tests (Rockwell A-scale and micro Vickers) are carried out to estimate the mechanical property.

• Journal of the Korean Society for Heat Treatment
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• v.17 no.1
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• pp.17-22
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• 2004

In the present study, newly developed spark plasma sintering(SPS) technique was introduced to refine the grain size of ${\gamma}$-based TiAl intermetallic compounds. Ti-46Al-1.5Mo and Ti-46Al-1.5Mo-0.2C(at%) prealloyed powders were produced by mechanical milling(MM) in high-energy attritor. The mechanically milled powders were characterized by XRD and SEM for the microstructural evolution as a function of milling time. And then, the MMed powders were sintered by both spark plasma sintering and hot pressing in vacuum (HP). After the sintering process, MM-SPSed specimens were heat-treated in a vacuum furnace (SPS-VHT) and in the SPS equipment(MM-SPS) for microstructural control. It was found from microstrutural observation that the microstructure consisting of equiaxed ${\gamma}$-TiAl with a few hundred nanometer in average size and ${\alpha}_2-Ti_3Al$ particles were formed after both sintering processes. It was also revealed from hardness test and three-point bending test that the effect of grain refinement on the hardness and bending strength is much higher than that of carbon addition. The fully lamellar microstructures, which is less than $80{\mu}m$ in average grain size was obtained by SPS-VHT process, and the fully lamellar microstructure which is less than $100{\mu}m$ in average grain size was obtained by MM-SPS for a relatively shorter heat-treatment time.

• Journal of the Korean Society for Heat Treatment
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• v.27 no.6
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• pp.281-287
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• 2014

Microstructural and mechanical characteristics of Al-6Si-2Cu alloy for engine mount bracket prepared by gravity casting (as-cast) and die-casting (as-diecast) process have been investigated. For the microstructural characterization, the inductively coupled plasma mass spectrometry (ICP-MS), optical microscope (OM), scanning electron microscope (SEM) and electron probe microanalysis (EPMA) analyses are conducted. For the intermetallic phases, the X-ray diffraction (XRD) and energy dispersive spectroscopy (EDS) are also conducted with quantitative and qualitative analysis. Micro Vickers hardness and static tensile test are achieved in order to measure mechanical properties of alloys. Secondary dendrite arm spacing (SDAS) of as-cast and as-diecast show 37um and 18um, respectively. A large amount of coarsen eutectic Si, $Al_2Cu$ intermetallic phase and Fe-rich phases are identified in the Al-6Si-2Cu alloy. Mechanical properties of gravity casting alloy are much higher than those of die-casting alloy. Especially, yield strength and elongation of gravity casting alloy show 2 times higher than die-casting alloy. After shot peening, shot peening refined the surface grains and Si particles of the alloys by plastic deformation. The surface hardness value shows that shot peening alloy has higher value than unpeening alloy.

• Journal of Korea Foundry Society
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• v.36 no.2
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• pp.53-59
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• 2016

The effects of ultrasonic melt treatment on the microstructures of aluminum piston were examined at five observation parts having different cooling rates. The microstructure of aluminum piston consisted of primary Si, eutectic Si, and various types of intermetallic compounds. Regardless of cooling rate, the ultrasonic melt treatment transformed dendritic eutectic cells to equiaxed eutectic cells and it decreased the sizes of eutectic Si and intermetallic compounds that exist at eutectic cell boundaries. In the absence of ultrasonic treatment, coarse primary Si particles were severely segregated and its size was increased with decreasing the cooling rate. The ultrasonic treatment decreased the size of primary Si particles from $25.5{\sim}31.0{\mu}m$ to $17.6{\sim}23.1{\mu}m$, depending on the cooling rate. In the presence of ultrasonic treatment, relatively fine primary Si particles were homogeneously distributed throughout the piston. In addition, the ultrasonic treatment increased the population density and area fraction of fine primary Si particles.