• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.11 no.3
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• pp.199-206
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• 2013

Electrowinning process in pyroprocessing recovers U (uranium) and TRU (Trans Uranium) elements simultaneously from spent fuels using a liquid cadmium cathode (LCC). When the solubility limit of U deposits over 2.35wt% in Cd, U dendrites were formed on the LCC surface during the electrodeposition at $500^{\circ}C$. Due to the high surface area of dendritic U, the deposits were not submerged into the liquid cadmium pool but grow out of the LCC crucible. Since the U dendrites act as a solid cathode, it prevents the co-deposition of U and TRUs. In this study, the electrodeposition of U onto a LCC was carried out at 440 and $500^{\circ}C$ to compare the morphology and component of U deposits. The U deposits at $440^{\circ}C$ have a specific shape and were stacked regularly at the center of the LCC pool, while the U dendrites (i.e., ${\alpha}$-phase) at $500^{\circ}C$ were grow out of the LCC crucible. Through the microscopic observation and XRD analysis, the electrodeposits at $440^{\circ}C$, which have a round shape, were identified as an intermetallic compound such as $UCd_{11}$. It can be concluded that the LCC electrowinning operation at $440^{\circ}C$ achieves the co-recovery of U and TRU without the formation of U dendrites.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Korean Journal of Metals and Materials
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• v.50 no.4
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• pp.316-323
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• 2012

The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having $({\epsilon}+{\zeta})+({\zeta}+{\beta}-Ti)$ intermetallic compounds at $700^{\circ}C$ and an $({\zeta}+{\beta}-Ti)$ intermetallic compound at $800^{\circ}C$, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of $500{\sim}600^{\circ}C$ and showed a uniform value until $800^{\circ}C$ and then increased rapidly up to $900^{\circ}C$. The micro Knoop hardness value of the diffusion layer increased up to $700^{\circ}C$ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to $800^{\circ}C$ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were $500{\sim}600^{\circ}C$ to obtain the proper formability for an additional plastic deformation process.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Journal of Powder Materials
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• v.2 no.2
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• pp.142-148
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• 1995

2219 aluminum alloy bonded diamond wheels containing intermetallic compounds were fabricated by powder metallurgy method. Nickel and titanium were added in aluminum matrix piece. The hot pressing condition was $600^{\circ}C$ and 20 Mpa in the furnace of the electric resistance type. The mechanical properties and grinding tests were carried out to confirm the wheel performance. Aluminum oxide ceramics were chosen for use in the grinding tests. The test proved that the heat resistance 2219 aluminum bonded diamond wheel containing 15 wt% nickel and 15 wt% titanium respectively showed the best performance.

• Journal of Welding and Joining
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• v.14 no.3
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• pp.93-104
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• 1996

This study evaluated relative hot cracking susceptibility of commercial aluminum alloy welds, and then suggested possible mechanisms operated in the weld fusion zone and in the heat affected zone based on the observed cracking morphologies, fractography and microstructural features. The fusion zone solidification cracking was found to be mainly due to a microsegregation of Cu, Si, and Mg in grain boundaries, while liquation cracking in the HAZ was by the incipient melting of the segregated grain boundaries and the consitutional liquation of large aging precipitates and intermetallic compounds in the partially melted zone adjacent to the fusion line which experienced a rapid thermal excursion during welding.

• 한국초전도학회:학술대회논문집
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• v.12
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• pp.15-15
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• 2002

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.285-287
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• 2002

This study is investigated in variations of micro-structures and mechanical properties of Ti/SUS321L joint with bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed the thickness of their reaction layer increased. In tensile test, it was examined that the tensile strength had maximum value at the bonding time of 5min and decreased after bonding time over 5min because of increasing their oxides and intermetallic compounds.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.231-231
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• 2015

무전해 Ni의 Metal turnover (MTO)가 증가함에 따라, Ni과 Sn-Ag-Cu솔더간 계면 금속간화합물층의 두꺼워지고, Ni-Sn-P층에 형성된 Nano void의 수가 많아지게 되어 취성파괴가 증가한다.