• Journal of Korea Foundry Society
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• v.13 no.3
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• pp.276-284
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• 1993

The interfacial phenomena between intermetallic compounds and Al matrix have been studied at $680^{\circ}C$ for various holding time under argon atmosphere. Model experiments were performed using Fe, Ni and Ti wire to observe the interfacial phenomena. The interfacial phenomena between intermetallic compounds and Al matrix were analysed by optical microscope, SEM and EDX. The results of EDX and XRD showed that the interfacial zones of intermetallic compounds/Al matrix were composed of several intermetallic layers. The reaction layer was varied with holding time and heating temperature. The investigation of interfacial zones in the specimen as a function of heat treatment time at $680^{\circ}C$ indicated that the best heat treatment condition for squeeze casting was $680^{\circ}C$ for 5min.

• Journal of the Korean institute of surface engineering
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• v.31 no.6
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• pp.379-388
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• 1998

The iron-zinc interfacial reaction and corrosin properties in galvanizing bath containning Ni have been intestigated. The substrate steel plates were galvanized in Zn or Zn-0.018Al baths with various Ni contents. The corrosion resistance of galvanized specimens was also evaluated by $60^{\circ}$bending test for galvannealing speaaimens. The corrosion resistance was improved with Ni addition in pure Zn bath, while deteriorated with Ni addition in Zn-0.18Al bath. The anti-powdering property, on thhe otherhand, was improved with Ni addition in Zn-0.18Al bath, while deteriorated with Ni addition in pure Zn. It was found that the anti-powdering property was improved with increasing $\xi$ phase ratio in reaction layer.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.547-554
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• 1999

The interfacial reaction, spangle and coating thickness of galvanized steel in Ni added Zn-0.18Al bath have been investigated. The size of spangle and thickness of reaction layer were observed under an optical microscope, SEM and EDS. Analysing the experimental results concerning spangle size of galvanized steel it was found that Ni addition in Zn-0.18Al bath tended to be minimized spangle size. For Zn-0.18Al bath, addition of 0.1Ni suppressed the formation of Fe-Zn intermetallic compounds but increased with Ni content above 0.1%. The coating thickness of galvanized steel was reduced with Ni addition in Zn-0.18Al bath, especially in Zn-0.18Al-0.05Ni bath. Addition of Al in Ni containing bath resulted in forming the Al-Ni intermetallic compounds such as $Al_3$Ni$_2$ and $Al_2$Ni which consist most of top precipitates.

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.6-9
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• 1996

The Joining of copper rod and zirconia tube was carried out in Ar gas atmosphere. There are two type of the joining. The one is the reaction bond consisting of Cu and zirconia was dominated by surface reaction wi th a undetctable very thin layer. It was found that copper elements were diffused to zirconia side, but that most of Z $r^{4+}$ ions were not diffused to copper side. This result means application of a DC voltage to migrate oxygen to the copper/zirconia interface can oxidize metal at the copper /zirconia interface, and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result means application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cr.

• Journal of Powder Materials
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• v.15 no.2
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• pp.101-106
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• 2008

The objective of the present study is to investigate the increase in the functional characteristics of a substrate by the formation of a thin coating layer. Thin coating layers of $Ti_5Si_3$ have high potential because $Ti_5Si_3$ exhibits high hardness. Shock induced reaction synthesis is an attractive fabrication technique to synthesize uniform coating layer by controlling the shock wave. Ti and Si powders to form $Ti_5Si_3$ using shock induced reaction synthesis, were mixed using high-energy ball mill into small scale. The positive effect of this technique is highly functional coating layer on the substrate due to ultra fine substructure, which improves the bonding strength. These materials are in great demand as heat resisting, structural and corrosion resistant materials. Thin $Ti_5Si_3$ coating layer was successfully recovered and showed high Vickers' hardness (Hv=1183). Characterization studies on microstructure revealed a fairly uniform distribution of powders with good interfacial integrity between the powders and the substrate.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.27-36
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• 2007

In this study, we investigated the interfacial reactions between various Sn-Ag-Cu(SAC) solder alloys and ENIG(Electroless Ni Immersion Gold) and Cu-OSP(Organic Solderability Preservative) pad finish. In the case of the interfacial reaction between Sb added SAC solder and ENlf thinner P-rich Ni layer was formed at the interface. In the case of the interfacial reaction between Ni added SAC solder and Cu-OSP, the uniform $Cu_6Sn_5$, intermetallic compounds(IMCs) were formed and $Cu_6Sn_5$ grain did not grow after multiple reflows. Thinner $Cu_3Sn$ IMCs were farmed at the interface between $Cu_6Sn_5$ and Cu-OSP after $150^{\circ}C$ thermal aging.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.481-486
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• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.

• Journal of Ocean Engineering and Technology
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• v.13 no.4 s.35
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• pp.37-44
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• 1999

Hardness characteristics and microstructures of $Nb/MoSi_2$ laminate composites were evaluated from the variation of fabricating conditions such as preparation temperature, applied pressure and pressure holding time. $Nb/MoSi_2$ laminate composites composed of $MoSi_2$ powder and Nb sheets were fabricated by the hot press. From experimental results, it was found that the lamination from Nb sheet and $MoSi_2$ powder was an excellent strategy to improve hardness characteristics of monolithic $MoSi_2$. However, interfacial reaction products like(Nb, Mo)$SiO_2\;and\;Nb2Si_3$ formed at the interface of $Nb/MoSi_2$ and increased with fabricating temperature.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.25-27
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• 2005

Sn-9Zn solder balls were bonded to Cu and ENIG (Electroless Nickel/Immersion Gold) pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Sn-9Zn/ENIG, the shear strength remained nearly constant in spite of aging for 1000 hours at $150^{\circ}C$. On the other hand, in the case of the Sn-9Zn/Cu, the shear strength significantly decreased after aging at $150^{\circ}C$ for 100hours and then remained constant by further prolonged aging. Therefore, the protective plating layer such as ENIG must be used to ensure the mechanical reliability of the Sn-9Zn/Cu joint.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.