• 제목/요약/키워드: interfacial pressure force

검색결과 13건 처리시간 0.028초

Application of Hyperbolic Two-fluids Equations to Reactor Safety Code

  • Hogon Lim;Lee, Unchul;Kim, Kyungdoo;Lee, Won-Jae
    • Nuclear Engineering and Technology
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    • 제35권1호
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    • pp.45-54
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    • 2003
  • A hyperbolic two-phase, two-fluid equation system developed in the previous work has been implemented in an existing nuclear safety analysis code, MARS. Although the implicit treatment of interfacial pressure force term introduced in momentum equation of the hyperbolic equation system is required to enhance the numerical stability, it is very difficult to implement in the code because it is not possible to maintain the existing numerical solution structure. As an alternative, two-step approach with stabilizer momentum equations has been selected. The results of a linear stability analysis by Von-Neumann method show the equivalent stability improvement with fully-implicit solution method. To illustrate the applicability, the new solution scheme has been implemented into the best-estimate thermal-hydraulic analysis code, MARS. This paper also includes the comparisons of the simulation results for the perturbation propagation and water faucet problems using both two-step method and the original solution scheme.

유한요소법을 이용한 고분자전해질연료전지 기체확산층의 응력분포 연구 (The Stress Distribution Analysis of PEMFC GDL using FEM)

  • 김철현;손영준;박구곤;김민진;이종욱;김창수;최유송;조성백
    • 한국수소및신에너지학회논문집
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    • 제23권5호
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    • pp.468-475
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    • 2012
  • A proper stacking force and assembly are important to the performance of fuel cell. Improper assembly pressure may lead to leakage of fuels and high interfacial contact resistance, excessive assembly pressure may result in damage to the gas diffusion layer and other components. The pressure distribution of gas diffusion layer is important to make interfacial contact resistance less for stack performance. To analyze the influence of design parameter factors for pressure distribution, and to optimize stack design, DOE (Design of Experiment) was used for polymer electrolyte membrane fuel cell stack pressure test. As commonly known, the higher clamping force improves the fuel cell stack performance. However, non-uniformity of stress distribution is also increased. It shows that optimization between clamping force and stress distribution is needed for well designed structure of fuel cell stack. In this study, stack design optimization method is suggested by using FEM (Finite Element Methode) and DOE for light-weighted fuel cell stack.

용탕단조법으로 제조된 $Al_2O_3/AC4C$ 복합재료의 피로균열 전파거동에 관한 연구 (A Study on the Fatigue Crack Propagation Behavior of $Al_2O_3/AC4C$ Composites Made by Squeeze Casting Process)

  • 여인동;이지환
    • 한국주조공학회지
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    • 제15권4호
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    • pp.388-396
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    • 1995
  • This study has been conducted with the purpose of examining the fatigue crack growth characteristics of $Al_2O_3$ short fiber reinforced aluminum matrix composites made by squeeze casting process with different applied pressure and binder amount. Fatigue crack growth experiments have been performed under constant load amplitude method with a fixed load ratio. The rate of crack propagation was decreased with binder amount as well as applied pressure. Also fatigue crack growth path in matrix was changed from flat to rough mode with an increase of applied pressure. In the composites, fatigue crack was propagated to interface between matrix and reinforcement at 10MPa, but it was propagated to reinforcement at 20MPa. The major reason of thee result was considered that interfacial bonding force and microstructure of matrix were improved due to an increase of applied pressure. Localized ductile striation in the composites was observed at low growth rate region and such a phenominon was remarkable with an increase of applied pressure. At high growth rate region, the propensity of fracture appearance was changed from interfacial debonding to reinforcement fracture with an increase of applied pressure.

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Silicon/Pad Pressure Measurements During Chemical Mechanical Polishing

  • Danyluk, Steven;Ng, Gary;Yoon, In-Ho;Higgs, Fred;Zhou, Chun-Hong
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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    • pp.433-434
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    • 2002
  • Chemical mechanical polishing refers to a process by which silicon and partially-processed integrated circuits (IC's) built on silicon substrates are polished to produce planar surfaces for the continued manufacturing of IC's. Chemical mechanical polishing is done by pressing the silicon wafer, face down, onto a rotating platen that is covered by a rough polyurethane pad. During rotation, the pad is flooded with a slurry that contains nanoscale particles. The pad deforms and the roughness of the surface entrains the slurry into the interface. The asperities contact the wafer and the surface is polished in a three-body abrasion process. The contact of the wafer with the 'soft' pad produces a unique elastohydrodynamic situation in which a suction force is imposed at the interface. This added force is non-uniform and can be on the order of the applied pressure on the wafer. We have measured the magnitude and spatial distribution of this suction force. This force will be described within the context of a model of the sliding of hard surfaces on soft substrates.

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Optimal pressure and temperature for Cu-Cu direct bonding in three-dimensional packaging of stacked integrated circuits

  • Seunghyun Yum;June Won Hyun
    • 한국표면공학회지
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    • 제56권3호
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    • pp.180-184
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    • 2023
  • Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm2. Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

2-유체 모델의 고유치에 근거한 기포류에서의 계면압력도약항 (Mechanistic Pressure Jump Terms based on the System Eigenvalues of Two-Fluid Model for Bubbly Flow)

  • 정문선;이원재;이성재;송철화;하귀석
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집E
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    • pp.81-86
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    • 2001
  • Interfacial pressure jump terms based on the physics of phasic interface and bubble dynamics are introduced into the momentum equations of the two-fluid model for bubbly flow. The pressure discontinuity across the phasic interface due to the surface tension force is expressed as the function of fluid bulk moduli and bubble radius. The consequence is that we obtain from the system of equations the real eigenvalues representing the void-fraction propagation speed and the pressure wave speed in terms of the bubble diameter. Inversely, we obtain an analytic closure relation for the radius of bubbles in the bubbly flow by using the kinematic wave speed given empirically in the literature. It is remarkable to see that the present mechanistic model using this practical bubble radius can indeed represent both the mathematical well-posedness and the physical wave speeds in the bubbly flow.

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축대칭 튜브 하이드로포밍 공정의 유한요소 시뮬레이션 (Finite Element Simulation of Axisymmeric Tube Hydroforming Processes)

  • 김용석;금영탁
    • 소성∙가공
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    • 제11권1호
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    • pp.75-83
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    • 2002
  • Recently, the hydroforming process is widely applied to the automotive industry and rapidly spreaded to other industries. In this paper, An implicit finite element formulation for simulating axisymmetric tube hydroforming processes is performed. In order to describe normal anisotropy of the tube, Hill's non-quadratic yield function is employed. The frictional contact between die and tube and the frictionless contact between tube and fluid are considered using the mesh-normal vectors computed from the finite element mesh of the tube. The complete set of the governing relations comprising equilibrium and interfacial equations is linearized for Newton-Raphson procedure. In order to verify the validity of the developed finite element formulation, the axisymmetric tube bulge test is simulated and the simulation results are compared with experimental measurements. In a simulation of stepped circular tube hydroforming processes, an optimal hydraulic pressure curve is pursued by considering simultaneously internal pressures and axial forces.

Effect of Columnar Structures on Exchange Anisotropy Field in Magnetoresistive NiO/NiFe Bilayers

  • Jai-Young Kim;Gyeong-Su Park;Jae-Chul Ro;Su-Jeong Suh
    • Journal of Magnetics
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    • 제4권3호
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    • pp.88-91
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    • 1999
  • A series of NiO/NiFe bilayer films are deposited with the variation of Ar sputtering pressure for the NiO layers only. As the pressure for the NiO layers increases, the exchange anisotropy field (HEX) decreases gradually and becomes extinct at 2.5 mTorr, at which the maximum coercive force (HC) in the NiO/NiFe films is obtained. Randomly oriented columnar structures with HEX a few tens of Oe and oriented columnar structures with zero HEX are observed in the NiP layers by highvoltage hihg-resolution transmission electron microscopy. The vanishing of the HEX in the oriented structures is attributed to the lack of exchange anisotropy energy (EEX) between NiO and NiFe layers, which results in little contribution of interfacial unidirectional pinning anisotropy to the interface of NiO/NiFe bilayer.

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임플란트용 실링 어버트먼트의 개발 및 구조해석을 통한 성능분석 (Development of a Sealing-Type Abutment for Implant and the Performance Evaluation via Structural Analysis)

  • 김정민;홍대선
    • 한국정밀공학회지
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    • 제33권9호
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    • pp.769-775
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    • 2016
  • Currently, dental implants are widely used as artificial teeth due to their good chewing performance and long life cycle. Generally, a dental implant consists of an abutment as the upper part and a fixture as the lower part. When chewing forces are repeatedly applied to a dental implant, a gap is often generated at the interfacial surface between the abutment and the fixture, and it results in some deterioration such as loosening of the fastening screw, dental retraction and fixture fracture. To enhance the sealing performance for coping with such problems, this study proposes a new sealing-type abutment having a number of grooves along the conical surface circumference, and it carries out finite element analysis in consideration of the external chewing force and pretension between the abutment and the fixture. The result shows that the proposed sealing-type abutment shows an enhanced sealing performance in terms of the contact pressure in comparison with a conventional abutment.