• Journal of Welding and Joining
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• 제20권1호
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• pp.91-96
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• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2014년도 추계학술대회 논문집
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• pp.544-544
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• 2014

Energy harvesting technology, which scavenges electric power from ambient, otherwise wasted, energy sources, has been explored to develop self-powered wireless sensors and possibly eliminate the battery replacement cost for wireless sensors. Among ambient energy sources, vibration energy can be converted into electric power through a piezoelectric energy harvester. For the last decade, although tremendous advances have been made in design methodology to maximize harvestable electric power under a given vibration condition, the research in reliability assessment to ensure durability has been stagnant due to the complicated nature of the multiple failure modes of a piezoelectric energy harvester, such as the interfacial delamination, fatigue failure, and dynamic fracture. Therefore, this study presents the first-ever system reliability analysis for multiple failure modes of a piezoelectric energy harvester using the Generalized Complementary Intersection Method (GCIM), while accounts for the energy conversion performance. The GCIM enables to decompose the probabilities of high-order joint failure events into probabilities of complementary intersection events. The electromechanically-coupled analytical model is implemented based on the Kirchhoff plate theory to analyze its output performances of a piezoelectric energy harvester. Since a durable as well as efficient design of a piezoelectric energy harvester is significantly important in sustainably utilizing self-powered electronics, we believe that technical development on system reliability analysis will have an immediate and major impact on piezoelectric energy harvesting technology.

• 한국안전학회지
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• 제30권1호
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• pp.21-27
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• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.

• Composites Research
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• 제14권4호
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• pp.15-26
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• 2001

Implant용 bioabsorbable 복합재료의 계면물성과 미세파괴분해 메카니즘을 micromechanical 시험법과 음향방출을 이용하여 평가하였다. Poly(ester-amide)와 bioactive 유리섬유의 인장 강도와 탄성률 그리고 연신율은 분해시간에 따라 점차적으로 감소하는 경향을 보인 반면, chitosan 섬유는 분해시간 내에서 거의 변화가 없었다. Dual matrix composite 시험법을 이용하여 측정된 bioactive 유리섬유와 poly(L-lactide) 사이의 계면전단강도는 chitosan이나 poly(ester-amide) 섬유의 경우 보다 큰 값을 보였다. 그리고 계면전단강도 감소는 bioactive 유리섬유 강화 poly(L-lactide) 복합재료에서 가장 빨랐으며, chitosan 섬유의 경우가 상대적으로 가장 느린 경향을 보였다. Poly(ester-amide) 섬유의 분해시간에 따른 음향방출 진폭과 에너지는 점차로 감소하였고, 음향방출 진폭의 분포 역시 점차 좁아짐을 보여주었다. Bioactive 유리섬유에서 인장파단에 의한 음향방출 진폭과 에너지는 압축파단의 경우 보다 크게 나타났으며, 또한, 인장 및 압축시험 모두에서 초기상태가 분해 후 보다 더 큰 값을 보였다. 본 연구에서 평가한 계면물성과 미세파괴분해 메카니즘은 생흡수성 복합재료의 성능을 조절할 수 있는 중요한 요소가 될 것이다.

• 열처리공학회지
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• 제16권5호
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• pp.260-266
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• 2003

In order to study the interfacial reaction between Nb thin sheet and Fe-C-(Si) alloy with different Chemical compositions, they were cast-bonded. The growth of carbide layer formed at the interface after isothermal heat treatment at 1173K, 1223K, 1273K and 1323K for various times was investigated. The carbide formed at the interface was NbC and the thickness of NbC layer was increased linearly in proportional to the heat treating time. Therefore, It was found that the growth of NbC layer was controlled by the interfacial reaction. The growth rate constant of NbC layer was slightly increased with increase of carbon content when the silicon content is similar in the cast irons. However, as silicon content increases with no great difference in carbon content, the growth of NbC layer was greatly retarded. The calculated activation energy for the growth of NbC layer was varied in the range of 447.4~549.3 kJ/moI with the compositions of cast irons.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 춘계학술발표대회 논문집
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• pp.182-185
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• 2004

In this work, the effect of chemical treatments on surface properties of SiC was investigated in mechanical interfacial properties of carbon fibers-reinforced composites. The surface properties of the SiC were determined by acid/base values and contact angles. The thermal stabilities of carbon fibers-reinforced composites were investigated by thermogravimetric analysis (TGA). Also, the mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical strain energy release rate mode II $(G_{IIC})$ measurements. As a result, tile acidically treated SiC (A-SiC) had higher acid value than that of untreated SiC (V-SiC) or basically treated SiC (B-SiC). According to the contact angle measurements, it was observed that chemical treatments led to an increase of surface free energy of the SiC surfaces, mainly due to the increase of the specific (polar) component. The mechanical interfacial properties of the composites, including ILSS and $(G_{IIC})$, had been improved in the specimens treated by chemical solutions. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between SiC and epoxy resin matrix.

• 대한금속재료학회지
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• 제47권1호
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• pp.26-31
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• 2009

The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.

• 접착 및 계면
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• 제23권3호
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• pp.59-69
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• 2022

섬유강화 복합재료에서 가장 중요한 부분은 섬유와 수지간의 계면 접착특성이다. 본 총설에서는, 섬유강화 복합재료의 계면특성을 평가하기 위해 사용되는 미세역학 시험법에 대해 역사적 초점을 두어 서술하고자 한다. 미세역학 시험법은 섬유 한 가닥과 기지재료 간의 계면 접착특성을 전단력평가로 관측하는 재료자체의 변수만이 고려되는 평가법으로써 계면에 대한 보다 정량적인 접착특성 및 감지능을 고찰할 수 있다. 미세역학시험법을 이용한 이전의 연구와 비교적 최근 연구동향을 본 총설에서 비교 논의하며, 미세역학 실험법에 대한 응용과 앞으로의 발전을 설명하고자 한다.

• 마이크로전자및패키징학회지
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• 제21권1호
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• pp.45-50
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• 2014

반도체 미세구리배선 적용을 위하여 구리배선의 습식 표면처리 및 열 사이클에 따른 구리 박막과 실리콘질화막 도포층 사이의 계면접착에너지를 4점굽힘시험을 통해 정량적으로 평가하였다. 구리배선을 화학적 기계적 연마한 후 습식 표면처리를 통하여 구리 박막과 실리콘질화막의 계면접착에너지는 $10.57J/m^2$에서 $14.87J/m^2$로 증가하였다. $-45{\sim}175^{\circ}C$범위에서 250사이클 후, 표면처리를 하지 않은 시편의 계면접착에너지는 $5.64J/m^2$으로, 표면처리를 한 시편은 $7.34J/m^2$으로 감소하였으며, 모든 시편의 박리계면은 구리 박막과 실리콘질화막 계면으로 확인되었다. X-선 광전자 분광법으로 계면 결합 상태를 분석한 결과, 화학적 기계적 연마 공정 후 구리배선의 표면 산화물이 습식표면처리에 의해 효과적으로 제거된 것을 확인하였다. 또한, 열 사이클 처리동안, 구리 박막과 실리콘질화막의 큰 열 팽창 계수 차이로 인한 열응력으로 인하여 구리 박막과 실리콘질화막 계면이 취약해지고, 계면을 통한 산소유입에 따른 구리 산화층이 증가하여 계면접착에너지가 저하된 것으로 판단된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.390.1-390.1
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• 2016

The present work explains the interfacial energetics of all oxide transparent photodiodes. The optical, structural and morphological of copper oxides were systematically analyse by UV-Visible spectrometer, X-Ray diffraction, Raman spectroscopy, Scanning electron microscopy (SEM) and Atomic force microscopy measurements (AFM). The UV-Visible result exhibits optical bandgap of Cu2O and CuO as 2.2 and 2.05 eV respectively. SEM and AFM result shows a uniform grain size distribution in Cu2O and CuO thin films with the average grain size of 45 and 40 nm respectively. The results of Current-Voltage and Kelvin probe force microscope characteristics describe the electrical responses of the Cu2O/ZnO and CuO/ZnO heterojunctions photodiodes. The obtained electrical response depicts the approximately same knee voltages with a measurable difference in the absolute value of net terminal current. More over the present study realizes the all oxide transparent photodiode with zero bias photocurrent. The presented results lay the template for fabricating and analysing the self-bias all oxide transparent photodetector.