• Journal of Welding and Joining
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• v.20 no.1
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• pp.91-96
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• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2014.10a
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• pp.544-544
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• 2014

Energy harvesting technology, which scavenges electric power from ambient, otherwise wasted, energy sources, has been explored to develop self-powered wireless sensors and possibly eliminate the battery replacement cost for wireless sensors. Among ambient energy sources, vibration energy can be converted into electric power through a piezoelectric energy harvester. For the last decade, although tremendous advances have been made in design methodology to maximize harvestable electric power under a given vibration condition, the research in reliability assessment to ensure durability has been stagnant due to the complicated nature of the multiple failure modes of a piezoelectric energy harvester, such as the interfacial delamination, fatigue failure, and dynamic fracture. Therefore, this study presents the first-ever system reliability analysis for multiple failure modes of a piezoelectric energy harvester using the Generalized Complementary Intersection Method (GCIM), while accounts for the energy conversion performance. The GCIM enables to decompose the probabilities of high-order joint failure events into probabilities of complementary intersection events. The electromechanically-coupled analytical model is implemented based on the Kirchhoff plate theory to analyze its output performances of a piezoelectric energy harvester. Since a durable as well as efficient design of a piezoelectric energy harvester is significantly important in sustainably utilizing self-powered electronics, we believe that technical development on system reliability analysis will have an immediate and major impact on piezoelectric energy harvesting technology.

• Journal of the Korean Society of Safety
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• v.30 no.1
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• pp.21-27
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• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.

• Composites Research
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• v.14 no.4
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• pp.15-26
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• 2001

Interfacial properties and microfailure degradation mechanisms of the bioabsorbable composites fur implant materials were investigated using micromechanical technique and nondestructive acoustic emission (AE). As hydrolysis time increased, the tensile strength, the modulus and the elongation of poly(ester-amide) (PEA) and bioactive glass fibers decreased, whereas these of chitosan fiber almost did not change. Interfacial shear strength (IFSS) between bioactive glass fiber and poly-L-lactide (PLLA) was much higher than PEA or chitosan fiber/PLLA systems using dual matrix composite (DMC) specimen. The decreasing rate of IFSS was the fastest in bioactive glass fiber/PLLA composites whereas that of chitosan fiber/PLLA composites was the slowest. AE amplitude and AE energy of PEA fiber decreased gradually, and their distributions became narrower than those in the initial state with hydrolysis time. In case of bioactive glass fiber, AE amplitude and AE energy in tensile failure were much higher than in compression. In addition, AE parameters at the initial state were much higher than those after degradation under both tensile and compressive tests. In this work, interfacial properties and microfailure degradation mechanisms can be important factors to control bioabsorbable composite performance.

• Journal of the Korean Society for Heat Treatment
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• v.16 no.5
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• pp.260-266
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• 2003

In order to study the interfacial reaction between Nb thin sheet and Fe-C-(Si) alloy with different Chemical compositions, they were cast-bonded. The growth of carbide layer formed at the interface after isothermal heat treatment at 1173K, 1223K, 1273K and 1323K for various times was investigated. The carbide formed at the interface was NbC and the thickness of NbC layer was increased linearly in proportional to the heat treating time. Therefore, It was found that the growth of NbC layer was controlled by the interfacial reaction. The growth rate constant of NbC layer was slightly increased with increase of carbon content when the silicon content is similar in the cast irons. However, as silicon content increases with no great difference in carbon content, the growth of NbC layer was greatly retarded. The calculated activation energy for the growth of NbC layer was varied in the range of 447.4~549.3 kJ/moI with the compositions of cast irons.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.182-185
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• 2004

In this work, the effect of chemical treatments on surface properties of SiC was investigated in mechanical interfacial properties of carbon fibers-reinforced composites. The surface properties of the SiC were determined by acid/base values and contact angles. The thermal stabilities of carbon fibers-reinforced composites were investigated by thermogravimetric analysis (TGA). Also, the mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical strain energy release rate mode II $(G_{IIC})$ measurements. As a result, tile acidically treated SiC (A-SiC) had higher acid value than that of untreated SiC (V-SiC) or basically treated SiC (B-SiC). According to the contact angle measurements, it was observed that chemical treatments led to an increase of surface free energy of the SiC surfaces, mainly due to the increase of the specific (polar) component. The mechanical interfacial properties of the composites, including ILSS and $(G_{IIC})$, had been improved in the specimens treated by chemical solutions. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between SiC and epoxy resin matrix.

• Korean Journal of Metals and Materials
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• v.47 no.1
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• pp.26-31
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• 2009

The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.

• Journal of Adhesion and Interface
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• v.23 no.3
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• pp.59-69
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• 2022

In composite materials, the adhesion and interfacial properties were the most important factors to obtain high performance of mechanical properties. This review paper had been focused on the micromechanical evaluation methods for the interfacial property historically. The interfacial property of fiber-reinforced composites (FRC) could be evaluated using only a single fiber and matrix via various micromechanical testing methods. Self-sensing due to the fracture behavior of FRC could be determined and discussed more critically and clearly using electro-micromechanical evaluation. In this paper, the research trends for micro-mechanical evaluation of composites was summarized, and their practical applications would be suggested in the future.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.45-50
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• 2014

Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.390.1-390.1
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• 2016

The present work explains the interfacial energetics of all oxide transparent photodiodes. The optical, structural and morphological of copper oxides were systematically analyse by UV-Visible spectrometer, X-Ray diffraction, Raman spectroscopy, Scanning electron microscopy (SEM) and Atomic force microscopy measurements (AFM). The UV-Visible result exhibits optical bandgap of Cu2O and CuO as 2.2 and 2.05 eV respectively. SEM and AFM result shows a uniform grain size distribution in Cu2O and CuO thin films with the average grain size of 45 and 40 nm respectively. The results of Current-Voltage and Kelvin probe force microscope characteristics describe the electrical responses of the Cu2O/ZnO and CuO/ZnO heterojunctions photodiodes. The obtained electrical response depicts the approximately same knee voltages with a measurable difference in the absolute value of net terminal current. More over the present study realizes the all oxide transparent photodiode with zero bias photocurrent. The presented results lay the template for fabricating and analysing the self-bias all oxide transparent photodetector.