• International Journal of Highway Engineering
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• v.19 no.6
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• pp.37-46
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• 2017

PURPOSES : A composite pavement utilizes both an asphalt surface and a concrete base. Typically, a concrete base layer provides structural capacity, while an asphalt surface layer provides smoothness and riding quality. This pavement type can be used in conjunction with rollercompacted concrete (RCC) pavement as a base layer due to its fast construction, economic efficiency, and structural performance. However, the service life and functionality of composite pavement may be reduced due to interfacial bond failure. Therefore, adequate interfacial bonding between the asphalt surface and the concrete base is essential to achieving monolithic behavior. The purpose of this study is to investigate the bond characteristics at the interface between asphalt (HMA; hot-mixed asphalt) and the RCC base. METHODS : This study was performed to determine the optimal type and application rate of tack coat material for RCC-base composite pavement. In addition, the core size effect, temperature condition, and bonding failure shape were analyzed to investigate the bonding characteristics at the interface between the RCC base and HMA surface. To evaluate the bond strength, a pull-off test was performed using different diameters of specimens such as 50 mm and 100 mm. Tack coat materials such as RSC-4 and BD-Coat were applied in amounts of 0.3, 0.5, 0.7, 0.9, and $1.1l/m^2$ to determine the optimal application rate. In order to evaluate the bond strength characteristics with temperature changes, a pull-off test was carried out at -15, 0, 20, and $40^{\circ}C$. In addition, the bond failure shapes were analyzed using an image analysis program after the pull-off tests were completed. RESULTS : The test results indicated that the optimal application rate of RSC-4 and BD-Coat were $0.8l/m^2$, $0.9l/m^2$, respectively. The core size effect was determined to be negligible because the bond strengths were similar in specimens with diameters of 50 mm and 100 mm. The bond strengths of RSC-4 and BD-Coat were found to decrease significantly when the temperature increased. As a result of the bonding failure shape in low-temperature conditions such as -15, 0, and $20^{\circ}C$, it was found that most of the debonding occurred at the interface between the tack coat and RCC surface. On the other hand, the interface between the HMA and tack coat was weaker than that between the tack coat and RCC at a high temperature of $40^{\circ}C$. CONCLUSIONS : This study suggested an optimal application rate of tack coat materials to apply to RCC-base composite pavement. The bond strengths at high temperatures were significantly lower than the required bond (tensile) strength of 0.4 MPa. It was known that the temperature was a critical factor affecting the bond strength at the interface of the RCC-base composite pavement.

• Journal of the Korean Society of Clothing and Textiles
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• v.17 no.4
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• pp.511-517
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• 1993

Changes of the surface and interface tension with temperature for washing liquids and alkanes were measured by FACE surface tensiometer. Using the extended Fowkes' equation, the dispersion and polar force components of the surface tension were estimated. The results were as follows : 1. The surface tensions of washing liquids and alkanes decreased almost linearly with the increase of temperature. 2. The interface tensions of 0.25% DBS/alkane increased slowly with the increase of temperature. In the case of nonionic surfactant solutions, however, the interface tensions with alkanes varied with the number of hydrophilic ethylene oxide(EO) groups. 3. Of the surface tension of water at $20^{\circ}C$, the dispersion force component was 25.3 dyn/cm and the polar force component was 47.8 dyn/cm. As the temperature increased, both the polar and dispersion force components decreased in a similar fashion. 4. The dispersion force component of surface tension of 0.25% DBS solution was 30.0 dyn/cm, and the polar force component was 2.2 dyn/cm at $20^{\circ}C$. The two components decreased with the increase of temperature. 5. As the temperature increased, the dispersion force component of surface tension decreased and the polar force component increased significantly for 0.25% NPPG-7.5EO solution. In the case of 025% NPPG-10EO, both the dispersion and polar force components decreased slowly, but the polar force component is expected to increase from $60^{\circ}C$. However, the polar force component of surface tension decreased with the increase of temperature for 025% NPPG-15EO solution, and at the temperature higher than $60^{\circ}C$ the surface tension is expected to be composed of only dispersion force component.

• International Journal of Air-Conditioning and Refrigeration
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• v.14 no.3
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• pp.94-101
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• 2006

A theoretical investigation to find thermodynamically optimum design conditions of conduction-cooled Peltier current leads is performed. A Peltier current lead (PCL) is composed of a thermoelectric element (TE), a metallic lead and a high temperature superconductor (HTS) lead in the order of decreasing temperature. Mathematical expressions for the minimum heat flow per unit current crossing the TE-metal interface and the minimum heat flow per unit current from the metal lead to the joint of the metal and the HTS leads are obtained. It is shown that the temperature at the TE -metal interface possesses a unique optimal value that minimizes the heat flow to the joint and that this optimal value depends on the material properties of the TE and the metallic lead but not the joint temperature nor electric current. It is also shown that there exists a unique optimal value for the joint temperature between the metal and the HTS leads that minimizes the sum of the power dissipated by ohmic heating in the current leads and the refrigerator power consumed to cool the lead, for a given length of the HTS.

• Journal of the Korean Vacuum Society
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• v.7 no.2
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• pp.135-140
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• 1998

We investigated the initial growth mode of Cu deposited on polyimide at high temperature($350^{\circ}C$) using x-ray photoelectron spectroscopy. We could find that when Cu is sputter-deposited on the polyimide at high temperature, Cu-C-N complex is formed first, Cu-N-O complex and Cu-oxide are mainly formed successively, and then funally metallic Cu grows. In the chemical reaction point of view, the interface of Cu/polyimide at high temperature is than that at room temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.65-65
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• 2009

High temperature silicon carbide Schottky diode was fabricated with Au deposited on poly 3C-SiC thin film grown on p-type Si(100) using atmospheric pressure chemical vapor deposition. The charge transport mechanism of the diode was studied in the temperature range of 300 K to 550 K. The forward and reverse bias currents of the diode increase strongly with temperature and diode shows a non-ideal behavior due to the series resistance and the interface states associated with 3C-SiC. The charge transport mechanism is a temperature activated process, in which, the electrons passes over of the low barriers and in turn, diode has a large ideality factor. The charge transport mechanism of the diode was analyzed by a Gaussian distribution of the Schottky barrier heights due to the Schottky barrier inhomogeneities at the metal-semiconductor interface and the mean barrier height and zero-bias standard deviation values for the diode was found to be 1.82 eV and $s_0$=0.233 V, respectively. The interface state density of the diode was determined using conductance-frequency and it was of order of $9.18{\times}10^{10}eV^{-1}cm^{-2}$.

• Journal of the Korean Vacuum Society
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• v.3 no.3
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• pp.316-321
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• 1994

Rate of mixing of Cu particles to polyimide substrate at interfaces under different thermal treatments was analyzed by Rutherford Backscattering spectroscopy using 2.0 MeV He+ ions. T he mixing rate was a function of annealing temperature and time and was constant at afioxed temperature. The amount of mixing increased linearly with time and the mixing rate increased with temperature. The activation energy for interface mixing between Cu and polyimide was 2.6 kcal/mol. The X-ray studies showed the Cu(111) plane peak changed with annealing time at fixed temperature. The mixing of Cu to polyimide was explained with segmental motion of PI chain and with interaction between functional group of the chain and metal electron donor. The comparisons were made bewteen the mixing induced by ion irradiation and by thermal treatment. The various factors affecting the interface mixing are discussed.

• Korean Journal of Materials Research
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• v.22 no.11
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• pp.591-597
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• 2012

For heat exchanger applications, 2-ply clad materials were fabricated by rolling of aluminum (Al) and mild steel sheets. Effects of annealing temperature on interface properties, especially on inter-layer formation and softening of strain hardened mild-steel, for Al/mild steel clad materials, were investigated. To obtain optimum annealing conditions for the Al/mild steel clad materials, annealing temperature was varied from room temperature to $600^{\circ}C$. At the annealing temperature about $450^{\circ}C$, an inter-layer was formed in an island-shape at the interface of the Al/mild steel clad materials; this island expanded along the interface at higher temperature. By analyzing the X-ray diffraction (XRD) peaks and the energy dispersive X-ray spectroscopy (EDX) results, it was determined that the exact chemical stoichiometry for the inter-layer was that of $Fe_2Al_5$. In some samples, an X-layer was formed between the Al and the inter-layer of $Fe_2Al_5$ at high annealing temperature of around $550^{\circ}C$. The existence of an X-layer enhanced the growth of the inter-layer, which resulted in the delamination of the Al/mild-steel clad materials. Hardness tests were also performed to examine the influence of the annealing temperature on the cold deformability, which is a very important property for the deep drawing process of clad materials. The hardness value of mild steel gradually decreased with increasing annealing temperature. Especially, the value of hardness sharply decreased in the temperature range between $525^{\circ}C$ and $550^{\circ}C$. From these results, we can conclude that the optimum annealing temperature is around $550^{\circ}C$ under condition of there being no X-layer creation.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.4
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• pp.155-159
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• 2004

Numerical analysis which is based on finite element techniques, implicit Euler method and frontal solving algorithm was performed to study the effects of the crucible shape on the temperature of sapphire crystal and the shape of the melt/crystal interface in heat exchanger method. The computer simulation described here and effective to solving the heat transport phenomena with the transition of the interface shape from hemispherical to planar. In the work, various crucibles with differently shaped corners at their bottom are considered to improve the deflection of the melt/crystal interface. The shape of the crucible should be considered as one of the variables for the process optimization.

• Journal of Mechanical Science and Technology
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• v.20 no.12
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• pp.2230-2241
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• 2006

This paper presents a sole application of boundary element method to the conjugate heat transfer problem of thermally developing laminar flow in a thick walled pipe when the fluid velocities are fully developed. Due to the coupled mechanism of heat conduction in the solid region and heat convection in the fluid region, two separate solutions in the solid and fluid regions are sought to match the solid-fluid interface continuity condition. In this method, the dual reciprocity boundary element method (DRBEM) with the axial direction marching scheme is used to solve the heat convection problem and the conventional boundary element method (BEM) of axisymmetric model is applied to solve the heat conduction problem. An iterative and numerically stable BEM solution algorithm is presented, which uses the coupled interface conditions explicitly instead of uncoupled conditions. Both the local convective heat transfer coefficient at solid-fluid interface and the local mean fluid temperature are initially guessed and updated as the unknown interface thermal conditions in the iterative solution procedure. Two examples imposing uniform temperature and heat flux boundary conditions are tested in thermally developing region and compared with analytic solutions where available. The benchmark test results are shown to be in good agreement with the analytic solutions for both examples with different boundary conditions.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.339-339
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• 2013

We study on the optical and electrical properties of indium-free ZTO(ZnSnO)/Ag/ZTO (ZAZ) multilayer electrodes for the low-cost transparent electrode. In the first step, each single layer was deposited using rf magnetron in-line sputter with various working pressure based on $O_2$/$Ar+O_2$ ratio (0~3%) and power at room temperature. Secondly, we studied the optical and electrical properties by analyzing the refractive index, extinction coefficient, transmittance and resistivity of each layer. Finally, we optimized the thickness of each layer using macleod simulation program based on the analyzed optical properties and fabricated the multilayer electrode. As a result, We achieved a low sheet resistance of $11{\Omega}$/sq and anaverage transmittance of 80% in the visible region of light (380~780 nm). This indicates that indium-free ZAZ multilayer electrode is a promising low-cost and low-temperature processing electrode scheme.