• 한국재료학회지
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• 제30권3호
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• pp.111-116
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• 2020

Two different casting speeds of 60 and 80mm/min are adopted to determine the effect of casting speed on the microstructure and mechanical properties of Al-Mg-Si/Al hybrid material prepared by duo-casting. The obtained hybrid material has a uniform and straight macro-interface between the pure Al side and the Al-Mg-Si alloy side at both casting speeds. When the casting speed is increased to 80mm/min, the size of primary α phases in Al-Mg-Si alloy decreases, without change of shape. Although the Al-Mg-Si alloy produced at higher casting speed of 80mm/min shows much higher ultimate tensile strength (UTS) and 0.2 % proof stress and lower elongation, along with higher bending strength compared to the case of the 60mm/min in casting speed, the tensile properties and bending strength of the hybrid material, which are similar to those of pure Al, are the same regardless of the increase of casting speed. Despite the different casting speeds, deformation and fracturing in hybrid materials are observed only on the pure Al side. This indicates that the macro-interface is well-bonded, allowing it to endure tensile and bending deformation in all hybrid materials.

• 한국세라믹학회지
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• 제40권8호
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• pp.784-790
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• 2003

본 논문은 세라믹재료가 강화재로써 보강된 복합재료가 횡방향의 단축인장하중을 받는 경우, 복합재료의 변형, 재료내 발생되는 손상의 특징, 및 응력-변형률 특성에 관한 컴퓨터 해석결과이다. 해석은 SiC/Ti 시스템을 대상으로 하였으며, 특성은 강화재의 배열형태, 강화재/기지 계면에서의 결합유무, 강화재의 부피분율변화에 대하여 각기 해석되었다. 계면에서 강한 결합이 있는 복합재와는 달리, 약한 결합의 복합재는 인장하중에 의하여 세라믹/기지 계면에서 분리가 발생되었다. 이 분리는 전체 복합재의 강성을 감소시키며, 세라믹 강화재의 부피분율이 증가할수록 탄성계수 및 횡방향 평균응력의 최종크기를 나타내는 한계응력의 크기감소로 나타났다. 계면결합이 강한 경우는 세라믹 부피분율이 증가할수록 사각형 배열보다는 육각형배열의 복합재에서 다소 큰 증가율로 나타났다. 그러나, 계면결합이 약한 경우는 세라믹 부피분율이 증가할수록 사각형 배열보다는 육각형배열의 복합재에서 상대적으로 큰 감소율로 해석되었다. 본 연구의 해석결과는 알려진 문헌의 결과와 잘 일치하였다.

• 한국주조공학회지
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• 제22권2호
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.

• 한국세라믹학회지
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• 제27권1호
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• pp.91-101
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• 1990

The green microstructure and sintering behavior of ZrO2 were analyzed in terms of kinetic stability (measured by the stability ratio ; W) and interfacial characteristics of colloidal suspension. Green density and the most frequent pore radius(MFPR) of green body were directly correlated with the stability ratio. These observations were explained using a concept of the critical stability ratio(Wc) and the potential energy of two interacting particles in colloidal suspension. Analysis of the data also indicates that the potential energy barrier between two interacting colloid particles should be higher than its critical value for a fabrication of ZrO2 green body with dense and uniform microstructure. Besides, we have successfully applied a concept of the donoracceptor interaction to increase the kinetic stability of ZrO2 slip and density of green body.

• 한국세라믹학회지
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• 제31권7호
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• pp.731-738
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• 1994

TiN films were deposited on high speed steels by plasma assisted chemical vapor deposition (PACVD), cathode arc ion plating (CAIP) and reactive magnetron sputtering (RMS). The properties of the films deposited by the three different methods were compared. The preferred oriented plane of PACVD-TiN is (200) and those of CAIP-TiN and RMS-TiN are (111). PACVD-TiN shows a dome surface and a microstructure having small grains. CAIP-TiN shows the highest microhardness and the best adhesion strength of the three because it has a dense microstructure and an ill-defined interface. But is shows the greatest surface roughness due to the Ti droplet created by the arc. RMS-TiN shows a microstructure having large voids so that its properties in microhardness and adhesion are the worst of the three.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1452-1454
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• 2002

Large turbine generator(rated 22kV) has failed in the stator winding area during normal operation. The capacitance and tan${\delta}$ were measured by Schering bridge in the zone 1, 2 and zone 3-6 stator windings. The capacitance and tan${\delta}$ in the zone 1, 2 of stator winding were higher than those of zone 3-6 in the stator winding. Experiments on microstructure property were conducted in the zone 1, 2 and zone 3-6 insulations, which were drawn out from stator windings of the large turbine generator. Microstructure analysis was characterized using scanning electron microscope(SEM). SEM results indicated that several isolated delaminations occurred at the interface of mica/epoxy insulations. Both thermal and mechanical aging cause the delamination.

• 한국표면공학회지
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• 제32권6호
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• pp.703-708
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• 1999

Silicides have been used extensively in ULSI logic device fabrication as contact materials for the active areas as well as the poly- Si gates. NiSi is a promising candidate for submicron device application due to less volume expansion, low formation temperature, little silicon consumption, and large stable processing temperature window. In this report, the microstructure of nickel silicides fabricated with a thermal evaporator has been investigated. We observed systematic transformation of Ni silicides of $Ni_2$Si, NiSi, $NiSi_2$, as annealing temperature increases. All the silicides have been identified by a X-ray diffractometer (XRD). The cross-sectional microstructure of silicides was examined by a transmission electron microscope (TEM) equipped with a energy dispersive spectrometer(EDS). The surface roughness of silicides was measured by scanning probe microscope(SPM). Although we observed thin oxide layer existed at the $Ni/NiSi_{x}$ interface, we fabricated successfully $550\AA$-thick planar Ni-monosilicide at the temperature range of$ 400~700^{\circ}C$.

• 한국주조공학회지
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• 제9권1호
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• pp.73-79
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• 1989

Microstructural characteristics of Al-3.63wt.%Pb hyper-monotectic alloy rapidly-solidified by melt spinning were examined. Possibility of forming a planar liquid -solid interface during rapid solidification of this alloy was also considered with a morphological stability theory, and a mechanism of forming banded structure observed at the bottom parts of melt-spinned specimens was considered as well. Application of the absolute stability criterion predicts the liquid-solid interface of the primary aluminium phase to be able to maintain a planar interface during the early stage of rapid solidification. Formation of banded structure was supposed to be resulted from the release of latent heat during solidification, which affect the stability of a planar liquid-solid interface.

• Journal of Welding and Joining
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• 제17권4호
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• pp.46-52
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• 1999

Some of the pressurized reactor pressure vessels used in many chemical plants are made of low alloy carbon steel plates internally clad with an austenitic stainless steel for improved anti-corrosion properties. In this study, metallurgic structure of the weld interface of A 387 Grade12Class1 low alloy carbon steel claded with A182-F321 austenitic stainless steel after thermal exposure simulation heat treatment was investigated to display a characteristic behavior of dissimilar metal weld interface with thermal exposure during service at high temperature and pressure. EPMA, STEM, vickers-hardness test were performed and the results were correlated with the microstructure. To estimate the depth of the carburized/decarburized bands quantitatively, a model for carbon diffusion was proposed. The validity of the proposed theoretical relationships was confirmed by the directly measured data from the welded parts failed during service.

• Journal of Welding and Joining
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• 제29권5호
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.