통합 검색 | Korea Science

이기택;황선묵;홍주일;허창수
- 한국전기전자재료학회:학술대회논문집
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- 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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- pp.78-81
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- 2004
In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.
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Lee, Ho-Young
- 한국표면공학회지
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- 제36권4호
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- pp.347-355
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- 2003
Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.
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서곤;손봉영
- 공업화학
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- 제5권4호
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- pp.630-636
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- 1994
열화처리 후 고무와 황동이 피복된 강선코드의 접박계면 변화를 오제 광전자 분광기와 주사 전자현미경으로 조사하였다. 열열화 후에는 접착층의 부분 산화와 추가 성장이, 습윤열화 후에는 접착층과 황동의 부분 소실이, 동적열화 후에는 접착층의 파괴와 철심의 부식이 관찰되었다. 이러한 접착계면의 변화를 인장시험에서 측정된 접착 성질과 관련지어 고찰하였다.
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