• Title/Summary/Keyword: interface adhesion

Search Result 887, Processing Time 0.02 seconds

Adhesion and Electrical Performance by Roughness on Semiconductive-Insulation Interface Layer of Silicone Rubber (거칠기에 따른 반도전-절연 계면층에서 접착특성과 절연성능)

  • Lee, Ki-Taek;Hwang, Sun-Mook;Hong, Joo-Il;Huh, Chang-Su
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2004.07a
    • /
    • pp.78-81
    • /
    • 2004

  • In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

  • PDF

Irregular Failures at Metal/polymer Interfaces

  • Lee, Ho-Young
    • Journal of the Korean institute of surface engineering
    • /
    • v.36 no.4
    • /
    • pp.347-355
    • /
    • 2003

  • Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

  • PDF KSCI

Changes in Adhesion Interface between Rubber and Steel Cord with Aging Treatment (열화처리에 따른 고무와 강선코드간 접착계면의 변화)

  • Seo, Gon;Sohn, Bongyoung
    • Applied Chemistry for Engineering
    • /
    • v.5 no.4
    • /
    • pp.630-636
    • /
    • 1994

  • The changes in adhesion interface between rubber compound and brass plated steel cord after various aging treatments were studied by using an Auger electron spectrometer and a scanning electron microscope. After thermal aging, partial oxidation and additional growth of adhesion layer were observed. The adhesion layer and brass were partially removed after humid aging. With dynamic aging the adhesion layer was destroyed and the corrosion of steel core was proceeded. The changes in adhesion interface were discussed in terms of the adhesion properties determined from the stress-strain experiments.

  • PDF