• The Journal of Korean Institute of Communications and Information Sciences
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• v.12 no.4
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• pp.357-364
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• 1987

In this paper we consider the performance Analysis of multistage interconnection network, which is major parts of multi-processor system. We review the Hardware configuration of STAR network system using base-line interconnection network and obtain the probability of clustering basing on analytical model. In addition, Instead of Baseline interconnection system, mentioned above, STAR network system using delta network is considered and TWO probability mentioned above is obtained, finally the comparative result is shown in the figure.

• Proceedings of the KIEE Conference
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• 2002.11b
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• pp.277-279
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• 2002

Recently, power requirement has been increasing. But the large generation unit is hardly installed because of economic and environment problem. Therefore, the concern for DG(distributed generation) is growing. Present, allowable interconnection capacity of DG for composite distributed generation is studied. In this paper, it is studied that the new interconnection capacity of DG for composite distribution system interconnected DG. We study new allowable interconnection capacity by power factor and placement. We study SERV(sending end reference voltage) variation and allowable interconnection capacity interconnected new DG.

• Proceedings of the KIEE Conference
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• 2001.07a
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• pp.527-529
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• 2001

Interfaces are the point of interconnection between distributed generation and the energy infrastructure. These interfaces are generally physical but can include a market dimension as well. While there are issues surrounding various interfaces, the most important issues in the short term are on the electrical interface. Much of the discussion and debate surrounding distributed generation interconnection has centered on technical issues. However, there are two elements of Interconnection that merit equal consideration-process and contractual issues. The solution of distributed generation Interconnection issues depends on whether existing requirements can be modified to make them more efficient, transparent, and standardized while maintaining the grid's reliability and safety. In this paper, two main courses, standardization and third party participation, are suggested for the resolution of these issues.

• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.31-35
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• 2004

A blue light emitting diode with 8 periods InGaN/GaN multi-quantum well structure grown by metal-organic chemical vapor deposition was fabricated with the inclusion of the metal-interconnection process in order to integrate the chips for light lamp. The quantum well structure provides the blue light photoluminescence peaked at 479.2 nm at room temperature. As decreasing the temperature to 20 K, the main peak was shifted to 469.7 nm and a minor peak at 441.9 nm appeared indicating the quantum dot formation in quantum wells. The current-voltage measurement for the fabricated LED chips shows that the metal-interconnection provides good current path with ohmic resistance of 41 $\Omega$.

• Journal of Information Technology Services
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• v.7 no.1
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• pp.131-149
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• 2008

Bandwidth Trading(BT) represents a potential market with over 1 trillion USD across the world and high growth potential. BT is also likely to accelerate globalization of the telecommunications industry and massive restructuring driven by unbundling rush. However, systematic researches on BT remain at an infant stage. This study starts with structure analysis of the Internet industry, and discusses significance of Internet interconnection with respect to BT Issues. We also describe the bandwidth commoditization trends and review technical requirements for effective Internet interconnection with BT capability. Taking a step further, this study explores the possibility of improving efficiency of network providers and increasing user convenience by developing an architectural prototype of Hub-&-Spoke interconnection model required to facilitate BT. The BT market provides an Innovative base to ease rigidity of two-party contract and Increase service efficiency. However, as fair, efficient operation by third party is required, this research finally proposes an exchanging hub named NIBX(New Internet Business eXchange).

• Journal of information and communication convergence engineering
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• v.20 no.3
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• pp.160-165
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• 2022

This paper proposes an efficient method of reconstructing interconnections when the terminals of each plane change in real-time situations where randomly divided planes are interconnected. To connect all terminals when the terminals of each plane are changed, we usually reconstruct the interconnections between all terminals. This ensures a minimum connection length, but it takes considerable time to reconstruct the interconnection for the entire terminal. This paper proposes a solution to obtain an optimal tree close to the minimum spanning tree (MST) in a short time. The construction of interconnections has been used in various design-related areas, from networks to architecture. One of these areas is an ad hoc network that only consists of mobile hosts and communicates with each other without a fixed wired network. Each host of an ad hoc network may appear or disappear frequently. Therefore, the heuristic proposed in this paper may expect various cost savings through faster interconnection reconstruction using the given information in situations where the connection target is changing.

• Journal of Welding and Joining
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• v.29 no.3
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• pp.27-34
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• 2011

• Proceedings of the Korean Vacuum Society Conference
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• 1993.07a
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• pp.58-59
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• 1993

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.21 no.3
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• pp.107-116
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• 2007

The introduction of new renewable energy is going on increase with the second plan of the Korean Government "Technology Development, Utilization and Popularization of New Renewable Energy". In general, it is connected to the power system due to the nature of it's source characteristics but it's interconnection operation impacts on the power system planning and operation. The operation schemes of the existing power distribution system are based on the unidirectional power flow, but unidirectional power flow changes to bidirectional power flow due to the interconnection operation of new renewable energy. It degrade the existing protection coordination system and power quality of the power distribution system. Thus, the technical evaluation process of the interconnection of new renewable energy are necessary. In this paper, the characteristics of the existing automatic recloser and sectionalizer are reviewed and interconnection capacity evaluation method of the DR(distributed resources) in the existing automatic recloser-sectionalizer protective coordination system are proposed.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.