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http://dx.doi.org/10.5781/KWJS.2011.29.3.283

TSV Interconnection Technology Using Solder Nanoparticles  

Lee, Jong-Hyun (서울과학기술대학교 신소재공학과)
Yoon, Jong-Ho (경일대학교 기계자동차학부)
Hyun, Chang-Yong (서울과학기술대학교 신소재공학과)
Publication Information
Journal of Welding and Joining / v.29, no.3, 2011 , pp. 27-34 More about this Journal
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