• Nuclear Engineering and Technology
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• v.44 no.3
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• pp.273-282
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• 2012

A new effective methodology for optimizing the enrichment of low-enriched zones as well as gadolinia fuel ($UO_2/Gd_2O_3$) rod designs in PLUS7 fuel assemblies was developed to minimize the maximum peak power in the core and to maximize the cycle lifetime. An automated link code was developed to integrate the genetic algorithm (GA) and the core design code package of ALPHA/PHOENIX-P/ANC and to generate and evaluate the candidates to be optimized efficiently through the integrated code package. This study introduces an optimization technique for the optimization of gadolinia fuel rod designs in order to effectively reduce the peak powers for a few hot assemblies simultaneously during the cycle. Coupled with the gadolinia optimization, the optimum enrichments were determined using the same automated code package. Applying this technique to the reference core of Ulchin Unit 4 Cycle 11, the gadolinia fuel rods in each hot assembly were optimized to different numbers and positions from their original designs, and the maximum peak power was decreased by 2.5%, while the independent optimization technique showed a decrease of 1.6% for the same fuel assembly. The lower enrichments at the fuel rods adjacent to the corner gap (CG), guide tube (GT), and instrumentation tube (IT) were optimized from the current 4.1, 4.1, 4.1 w/o to 4.65, 4.2, 4.2 w/o. The increase in the cycle lifetime achieved through this methodology was 5 effective full-power days (EFPD) on an ideal equilibrium cycle basis while keeping the peak power as low as 2.3% compared with the original design.

• Magazine of the Korean Society of Agricultural Engineers
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• v.37 no.E
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• pp.31-39
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• 1995

Weight minimization for the steel bridge girders using an approximation based optimization technique is presented. To accomplish this, an optimization oriented finite element program is used to achieve continuous weight reduction until the optimum is reached. To reduce computational cost, approximation techniques are adopted during the optimization process. Constraint deletion as well as intermediate design variables and responses are also used for higher qualitv of approximations and for a better convergence rate. Both the reliability and the effectiveness of the underlying optimization method are reviewed.

• Nuclear Engineering and Technology
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• v.49 no.1
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• pp.43-53
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• 2017

Increasing the operation cycle length can be an important goal in the fuel reload design of a nuclear reactor core. In this research paper, a new optimization approach, electromagnetism mechanism (EM), is applied to the fuel arrangement design of the Bushehr WWER-1000 core. For this purpose, a neutronic solver has been developed for calculating the required parameters during the reload cycle of the reactor. In this package, two modules have been linked, including PARCS v2.7 and WIMS-5B codes, integrated in a solver for using in the fuel arrangement optimization operation. The first results of the prepared package, along with the cycle for the original pattern of Bushehr WWER-1000, are compared and verified according to the Final Safety Analysis Report and then the results of exploited EM linked with Purdue Advanced Reactor Core Simulator (PARCS) and Winfrith Improved Multigroup Scheme (WIMS) codes are reported for the loading pattern optimization. Totally, the numerical results of our loading pattern optimization indicate the power of the EM for this problem and also show the effective improvement of desired parameters for the gained semi-optimized core pattern in comparison to the designer scheme.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.43-51
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• 2014

In 3-dimensional (3D) integrated package, thermal management is one of the critical issues due to the high heat flux generated by stacked multi-functional chips in miniature packages. In this study, we used numerical simulation method to analyze the thermal behaviors, and investigated the thermal issues of 3D package using TSV (through-silicon-via) technology for mobile application. The 3D integrated package consists of up to 8 TSV memory chips and one logic chip with a interposer which has regularly embedded TSVs. Thermal performances and characteristics of glass and silicon interposers were compared. Thermal characteristics of logic and memory chips are also investigated. The effects of numbers of the stacked chip, size of the interposer and TSV via on the thermal behavior of 3D package were investigated. Numerical analysis of the junction temperature, thermal resistance, and heat flux for 3D TSV package was performed under normal operating and high performance operation conditions, respectively. Based on the simulation results, we proposed an effective integration scheme of the memory and logic chips to minimize the temperature rise of the package. The results will be useful of design optimization and provide a thermal design guideline for reliable and high performance 3D TSV package.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.139-142
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• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.344-348
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• 2002

As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• 한국신재생에너지학회:학술대회논문집
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• 2005.11a
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• pp.541-544
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• 2005

This study presents the integrated modeling approach to simulate the proton exchange membrane (PEM) fuel cell system for vehicle application. The fuel cell system consisting of stack and balance of plant (BOP) was simulated with MATLAB/Simulink environment to estimate the maximum system power and investigate the effect of BOP component sizing on system performance and efficiency. The PEM fuel cell stack model was established by using a semi-empirical modeling. To maximize the net efficiency of fuel cel1 system, multi-variable optimization code was adopted. Using this method the optimized operating values were obtained according to various system net power levels. The fuel cell model established was co-linked to AVL CRUISE, a vehicle simulation package. Through the vehicle simulation software, the fuel economy of fuel cell powered electric vehicle for two types of driving cycles was presented and compared. It is expected that this study tan be effectively employed in the basic BOP component sizing and in establishing system operation map with respect to net power level of fuel cell system.

• New & Renewable Energy
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• v.1 no.4 s.4
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• pp.43-48
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• 2005

This study presents the integrated modeling approach to simulate the proton exchange membrane [PEM] fuel cell system for vehicle application. The fuel cell system consisting of stack and balance of plant (BOP) was simulated with MATLAB/Simulink environment to estimate the maximum system power and investigate the effect of BOP component sizing on system performance and efficiency. The PEM fuel cell stack model was established by using a semi-empirical modeling. To maximize the net efficiency of fuel cell system, multi-variable optimization code was adopted. Using this method, the optimized operating values were obtained according to various system net power levels. The fuel cell model established was co-linked to AVL CRUISE, a vehicle simulation package. Through the vehicle simulation software, the fuel economy of fuel cell powered electric vehicle for two types of driving cycles was presented and compared. It is expected that this study can be effectively employed in the basic BOP component sizing and in establishing system operation map with respect to net power level of fuel cell system.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.