• 제목/요약/키워드: integrated GPU

검색결과 18건 처리시간 0.025초

Low-power Scheduling Framework for Heterogeneous Architecture under Performance Constraint

  • Li, Junke;Guo, Bing;Shen, Yan;Li, Deguang
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • 제14권5호
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    • pp.2003-2021
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    • 2020
  • Today's computer systems are widely integrated with CPU and GPU to achieve considerable performance, but energy consumption of such system directly affects operational cost, maintainability and environmental problem, which has been aroused wide concern by researchers, computer architects, and developers. To cope with energy problem, we propose a task-scheduling framework to reduce energy under performance constraint by rationally allocating the tasks across the CPU and GPU. The framework first collects the estimated energy consumption of programs and performance information. Next, we use above information to formalize the scheduling problem as the 0-1 knapsack problem. Then, we elaborate our experiment on typical platform to verify proposed scheduling framework. The experimental results show that our proposed algorithm saves 14.97% energy compared with that of the time-oriented policy and yields 37.23% performance improvement than that of energy-oriented scheme on average.

글로벌 파운드리 Big3의 첨단 패키징 기술개발 동향 (Development Trends in Advanced Packaging Technology of Global Foundry Big Three)

  • 전황수;최새솔;민대홍
    • 전자통신동향분석
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    • 제39권3호
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    • pp.98-106
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    • 2024
  • Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.

야간도로 시인성에 대한 공간적 평가를 위한 자료관리체계 연구 (A Study on Data Management Systems for Spatial Assessments of Road Visibilities at Night)

  • 우희숙;권광석;김병국;윤천주;김영록
    • 대한공간정보학회지
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    • 제22권4호
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    • pp.107-115
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    • 2014
  • 야간도로 노면 밝기는 운전자가 도로 상 장애물을 인지하고 안전하게 운행하는데 있어 매우 중요한 요소이다. 본 연구에서는 정량적인 야간도로 시인성을 평가에 필요한 야간 도로 노면 영상정보 수집 및 처리용 모바일 체계를 제시하였다. 야간 도로 노면에서 수집되는 영상정보를 효율적으로 변환하고 야간도로 시인성에 대한 공간적인 분포를 파악할 수 있는 선형자료를 구축하였다. 이를 위해 저전력 컴퓨팅기술, 개방형 영상처리 기술, GPU 기반 가속 기술 및 도큐멘트데이터베이스 기술 등을 적용하였고 RGB영상으로부터 YUV색상체계로 변환하고 밝기에 해당하는 요소만 추출하여 공간정보와 통합하였다. 그 결과 고성능 안드로이드 단말기를 이용하여 도로밝기 자료를 취득하고 제안한 프로토타입으로 야간도로 시인성에 대한 공간적인 평가를 위한 자료 구축의 공간적 분포를 파악할 수 있었다.

M&S 지원을 위한 HEMOS-Cloud 서비스의 경제적 효과 (Economic Impact of HEMOS-Cloud Services for M&S Support)

  • 정대용;서동우;황재순;박성욱;김명일
    • 정보처리학회논문지:컴퓨터 및 통신 시스템
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    • 제10권10호
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    • pp.261-268
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    • 2021
  • 클라우드 컴퓨팅은 서비스 사용자 요구에 따라 컴퓨팅 자원을 임대하여 사용하는 컴퓨팅 패러다임이다. 클라우드 컴퓨팅에서 컴퓨팅 자원은 사용자의 서비스 수요에 따라 컴퓨팅 자원을 확장 또는 축소가 가능하여 전체 서비스 비용 절감 효과를 가질 수 있다. 그리고, M&S (Modeling and Simulation) 기술은 컴퓨팅 자원과 CAE 소프트웨어를 통해 엔지니어링 분석 작업 결과를 얻어, 실제 실험 결과가 없이 제품의 상태를 시뮬레이션을 수행하여 분석하는 방법이다. M&S 기술은 FEA(Finite Element Analysis), CFD(Computational Fluid Dynamics), MBD(Multibody Dynamics) 및 최적화 분야에서 활용된다. M&S 통한 작업 절차는 전처리, 해석, 후처리 단계로 구분된다. CAE 소트프웨어를 통한 3D 모델링 작업인 전/후처리는 GPU 연산이 집약적이며, 3D 모델 해석은 CPU 또는 GPU 연산이 요구된다. 일반적인 개인 데스크톱에서 복잡한 3D 모델을 해석하는 시간이 많이 소요된다. 결과적으로, M&S를 원활하게 수행하기 위해서는 고성능 컴퓨팅 자원이 요구된다. 이 문제를 해결하기 위해 우리는 통합 클라우드 및 클러스터 컴퓨팅 환경인 HEMOS-Cloud 서비스를 제안한다. 제안한 클라우드 기반 방식에서는 M&S에 필요한 전/후처리 및 솔버 작업을 원활하게 수행할 수 있도록 구성했다. 이 시스템에서 전/후처리는 VDI(Virtual Desktop Infrastructure)에서 수행되고 해석은 클러스터 환경에서 수행된다. 각 용도에 맞게 서로 다른 환경에서 분리하여 컴퓨팅 자원 간에 간섭을 최소화했다. HEMOS-Cloud 서비스는 기업 또는 학교에서 M&S의 경험이 필요로 하는 사용자에게 CAE 소프트웨어와 컴퓨팅 자원을 제공한다. 본 논문에서는 HEMOS-Cloud 서비스의 경제적 파급효과를 산업연관분석을 활용하여 분석했다. 전문가의 의견을 반영하여 조정된 계수를 통한 분석 결과는 생산유발효과 74억원, 부가가치유발효과 41억원, 취업자유발효과 10억원당 50명으로 분석되었다.

특허 데이터 및 재무 데이터를 활용한 글로벌 기업의 인공지능 하드웨어 연구개발 효율성 분석 (Analysis of Research and Development Efficiency of Artificial Intelligence Hardware of Global Companies using Patent Data and Financial data)

  • 박지민;이봉규
    • 한국멀티미디어학회논문지
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    • 제23권2호
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    • pp.317-327
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    • 2020
  • R&D(Research and Development) efficiency analysis is a very important issue in academia and industry. Although many studies have been conducted to analyze R&D(Research and Development) efficiency since the past, studies that analyzed R&D(Research and Development) efficiency considering both patentability and patent quality efficiency according to the financial performance of a company do not seem to have been actively conducted. In this study, measuring the patent application and patent quality efficiency according to financial performance, patent quality efficiency according to patent application were applied to corporate groups related to artificial intelligence hardware technology defined as GPU(Graphics Processing Unit), FPGA(Field Programmable Gate Array), ASIC(Application Specific Integrated Circuit) and Neuromorphic. We analyze the efficiency empirically and use Data Envelopment Analysis as a measure of efficiency. This study examines which companies group has high R&D(Research and Development) efficiency about artificial intelligence hardware technology.

항만 BIM 플랫폼의 클라우드 서비스를 위한 IaaS+PaaS 통합 환경 개발 (Development of an Integrated IaaS+PaaS Environment for Providing Cloud Computing Service in a BIM Platform for Harbor Facilities)

  • 문현석;현근주;김원식
    • 한국BIM학회 논문집
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    • 제9권4호
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    • pp.62-74
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    • 2019
  • Because the existing BIM platform is based on user services, the focus is on the development of SaaS (Software as a Service), which provides business services online. However, since a harbor is a security facility, the harbor BIM platform is preferably provided in a private form, rather than relying on the infrastructure environment provided by external cloud providers. Therefore, this study analyzes and reviews the main functions to be provided as SaaS services of the harbor BIM platform. The goal is to build a cloud-based harbor BIM platform that can provide this service to users. To this end, we built IaaS (Infrastructure as a Service) environment of the harbor BIM platform based on the open source Open Stack and integrate and develop PaaS environment with Open Shift applied with IaaS. We applied the GPU to the harbor BIM platform to verify the performance of the harbor BIM platform, and found that the rendering and loading times are improved. In particular, it is expected to reduce the cost of introduction and provide it as the basic cloud environment of similar BIM platform for infrastructure facilities.

GPU Based Feature Profile Simulation for Deep Contact Hole Etching in Fluorocarbon Plasma

  • Im, Yeon-Ho;Chang, Won-Seok;Choi, Kwang-Sung;Yu, Dong-Hun;Cho, Deog-Gyun;Yook, Yeong-Geun;Chun, Poo-Reum;Lee, Se-A;Kim, Jin-Tae;Kwon, Deuk-Chul;Yoon, Jung-Sik;Kim3, Dae-Woong;You, Shin-Jae
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.80-81
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    • 2012
  • Recently, one of the critical issues in the etching processes of the nanoscale devices is to achieve ultra-high aspect ratio contact (UHARC) profile without anomalous behaviors such as sidewall bowing, and twisting profile. To achieve this goal, the fluorocarbon plasmas with major advantage of the sidewall passivation have been used commonly with numerous additives to obtain the ideal etch profiles. However, they still suffer from formidable challenges such as tight limits of sidewall bowing and controlling the randomly distorted features in nanoscale etching profile. Furthermore, the absence of the available plasma simulation tools has made it difficult to develop revolutionary technologies to overcome these process limitations, including novel plasma chemistries, and plasma sources. As an effort to address these issues, we performed a fluorocarbon surface kinetic modeling based on the experimental plasma diagnostic data for silicon dioxide etching process under inductively coupled C4F6/Ar/O2 plasmas. For this work, the SiO2 etch rates were investigated with bulk plasma diagnostics tools such as Langmuir probe, cutoff probe and Quadruple Mass Spectrometer (QMS). The surface chemistries of the etched samples were measured by X-ray Photoelectron Spectrometer. To measure plasma parameters, the self-cleaned RF Langmuir probe was used for polymer deposition environment on the probe tip and double-checked by the cutoff probe which was known to be a precise plasma diagnostic tool for the electron density measurement. In addition, neutral and ion fluxes from bulk plasma were monitored with appearance methods using QMS signal. Based on these experimental data, we proposed a phenomenological, and realistic two-layer surface reaction model of SiO2 etch process under the overlying polymer passivation layer, considering material balance of deposition and etching through steady-state fluorocarbon layer. The predicted surface reaction modeling results showed good agreement with the experimental data. With the above studies of plasma surface reaction, we have developed a 3D topography simulator using the multi-layer level set algorithm and new memory saving technique, which is suitable in 3D UHARC etch simulation. Ballistic transports of neutral and ion species inside feature profile was considered by deterministic and Monte Carlo methods, respectively. In case of ultra-high aspect ratio contact hole etching, it is already well-known that the huge computational burden is required for realistic consideration of these ballistic transports. To address this issue, the related computational codes were efficiently parallelized for GPU (Graphic Processing Unit) computing, so that the total computation time could be improved more than few hundred times compared to the serial version. Finally, the 3D topography simulator was integrated with ballistic transport module and etch reaction model. Realistic etch-profile simulations with consideration of the sidewall polymer passivation layer were demonstrated.

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EPAR V2.0: AUTOMATED MONITORING AND VISUALIZATION OF POTENTIAL AREAS FOR BUILDING RETROFIT USING THERMAL CAMERAS AND COMPUTATIONAL FLUID DYNAMICS (CFD) MODELS

  • Youngjib Ham;Mani Golparvar-Fard
    • 국제학술발표논문집
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    • The 5th International Conference on Construction Engineering and Project Management
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    • pp.279-286
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    • 2013
  • This paper introduces a new method for identification of building energy performance problems. The presented method is based on automated analysis and visualization of deviations between actual and expected energy performance of the building using EPAR (Energy Performance Augmented Reality) models. For generating EPAR models, during building inspections, energy auditors collect a large number of digital and thermal imagery using a consumer-level single thermal camera that has a built-in digital lens. Based on a pipeline of image-based 3D reconstruction algorithms built on GPU and multi-core CPU architecture, 3D geometrical and thermal point cloud models of the building under inspection are automatically generated and integrated. Then, the resulting actual 3D spatio-thermal model and the expected energy performance model simulated using computational fluid dynamics (CFD) analysis are superimposed within an augmented reality environment. Based on the resulting EPAR models which jointly visualize the actual and expected energy performance of the building under inspection, two new algorithms are introduced for quick and reliable identification of potential performance problems: 1) 3D thermal mesh modeling using k-d trees and nearest neighbor searching to automate calculation of temperature deviations; and 2) automated visualization of performance deviations using a metaphor based on traffic light colors. The proposed EPAR v2.0 modeling method is validated on several interior locations of a residential building and an instructional facility. Our empirical observations show that the automated energy performance analysis using EPAR models enables performance deviations to be rapidly and accurately identified. The visualization of performance deviations in 3D enables auditors to easily identify potential building performance problems. Rather than manually analyzing thermal imagery, auditors can focus on other important tasks such as evaluating possible remedial alternatives.

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