• 제목/요약/키워드: innovative curing

검색결과 15건 처리시간 0.023초

Shear performance of an innovative UHPFRC deck of composite bridge with coarse aggregate

  • Qi, Jianan;Wanga, Jingquan;Feng, Yu
    • Advances in concrete construction
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    • 제7권4호
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    • pp.219-229
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    • 2019
  • This paper presents an experimental study on the structural performance of an innovative ultra-high performance fiber reinforced concrete (UHPFRC) deck with coarse aggregate of composite bridge under shear force. Test parameters included curing method and shear span-to-height ratio. Test results indicated that more short fine cracks developed beside the existing cracks due to the randomly dispersed fibers, resulting in re-distributing and homogenizing of the concrete stress beside cracks and allowing for the occurrence of more cracks with small spacing compared to normal strength concrete beams. Curing methods, incorporating steam curing and natural curing, did not have obvious effect on the nominal bending cracking strength and the ultimate strength of the test specimens. Shear reinforcement need not be provided for UHPFRC decks with a fiber volume fraction of 2%. UHPFRC decks showed superior load resistance ability after the appearance of cracks and excellent post-cracking deformability. Lastly, the current shear provisions were evaluated by the test results.

Innovative Application of Cold Plasma Technology in Meat and Its Products

  • Dinesh D. Jayasena;Taemin Kang;Kaushalya N. Wijayasekara;Cheorun Jo
    • 한국축산식품학회지
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    • 제43권6호
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    • pp.1087-1110
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    • 2023
  • The growing demand for sustainable food production and the rising consumer preference for fresh, healthy, and safe food products have been driving the need for innovative methods for processing and preserving food. In the meat industry, this demand has led to the development of new interventions aimed at extending the shelf life of meats and its products while maintaining their quality and nutritional value. Cold plasma has recently emerged as a subject of great interest in the meat industry due to its potential to enhance the microbiological safety of meat and its products. This review discusses the latest research on the possible application of cold plasma in the meat processing industry, considering its effects on various quality attributes and its potential for meat preservation and enhancement. In this regard, many studies have reported substantial antimicrobial efficacy of cold plasma technology in beef, pork, lamb and chicken, and their products with negligible changes in their physicochemical attributes. Further, the application of cold plasma in meat processing has shown promising results as a potential novel curing agent for cured meat products. Understanding the mechanisms of action and the interactions between cold plasma and food ingredients is crucial for further exploring the potential of this technology in the meat industry, ultimately leading to the development of safe and high-quality meat products using cold plasma technology.

Numerical approach to predict stress-strain model for tie confined self curing self compacting concrete (TCSCSCC)

  • P Swamy Naga Ratna Giri;Vikram Tati;Rathish Kumar P;Rajesh Kumar G
    • Computers and Concrete
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    • 제33권2호
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    • pp.205-216
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    • 2024
  • Self-Curing Self Compacting Concrete (SCSCC), is a special concrete in contemporary construction practice aimed at enhancing the performance of structural concrete. Its primary function is to ensure a sufficient moisture supply that facilitates hydration along with flow, particularly in the context of high-rise buildings and tall structures. This innovative concrete addresses the challenges of maintaining adequate curing conditions in large-scale projects, maintaining requisite workability, contributing to the overall durability and longevity of concrete structures. For implementing such a versatile material in construction, it is imperative to understand the stress-strain (S-S) behaviour. The primary aim of this study is to develop the S-S curves for TCSCSCC and compare through experimental results. Finite element (FE) analysis based ATENA-GiD was employed for the numerical simulation and develop the analytical stress-strain curves by introducing parameters viz., grade of concrete, tie diameter, tie spacing and yield strength. The stress ratio and the strain ratios are evaluated and compared with experimental values. The mean error is 1.2% with respect to stresses and 2.2% in case of strain. Finally, the stress block parameters for tie confined SCSCC are evaluated and equations are proposed for the same in terms of confinement index.

칼슘실리케이트 무기 단열소재의 양생기간에 따른 물리 특성 (Physical Properties of Calcium Silicate Inorganic Insulation Depending on Curing Time)

  • 박재완;추용식;정재현
    • 한국건축시공학회지
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    • 제16권6호
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    • pp.529-534
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    • 2016
  • 칼슘실리케이트계 무기단열소재는 주원료로 시멘트를 90%를 사용하는 다공성 무기단열소재이다. 기존 무기단열소재와 달리 고온의 수화반응 처리가 없기 때문에 가격이 저렴하며, 불연소재의 원료를 사용하여 화제의 위험성도 적다. 칼슘실리케이트 단열소재는 $0.13g/cm^3$의 밀도와 0.050W/mK이하의 우수한 열전도도를 갖는 단열소재이다. 칼슘실리케이트 단열소재는 경량화 될수록 내부 기포를 다량 함유해야 하며 기포를 다량 함유함에 따라 단열성 또한 우수해진다. 본 연구에서는 다량의 기포를 함유하며 일정강도발현을 목표로, 칼슘실리케이트계 무기단열소재의 주성분인 시멘트가 수화반응에 따라 초기 및 장기강도발현하는 특성을 이용하여 칼슘실리케이트계 무기단열소재에 적용하여 물리적 특성을 알아보고자 하였다.

UV 광경화 공정에서 평면 외 적층 경사각에 따른 제품 특성 변화에 관한 기초 연구 (Preliminary Study on the Effects of Out-of-Plane Deposition Angle on Product Characteristics of a UV Photo-Curing Process)

  • 장용훈;안동규;송재국;김동인;신보성
    • 한국정밀공학회지
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    • 제34권1호
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    • pp.65-72
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    • 2017
  • The goal of this paper is to investigate the effects of out-of-plane deposition angle on product characteristics of a UV photo-curing process. Specimens are manufactured from a commercialized UV photo-curing machine, the NOBEL V1.0. The influence of the out-of-plane deposition angle of the specimen on surface characteristics, including morphology of the sloped surface, pick-to-pick distance of convex region, and roughness of the sloped surface, is examined via the observation of the sloped surface. In addition, the influence of the radius of curvature of the specimen on the surface roughness of the sloped surface is evaluated. The effects of the out-of-plane deposition angle on impact strength of specimens are investigated via Izod impact experiments. Finally, we discuss the influence of the out-of-plane deposition angle on failure characteristics of specimens for impact loads.

Factors affecting waterproof efficiency of grouting in single rock fracture

  • Lee, Hang Bok;Oh, Tae-Min;Park, Eui-Seob;Lee, Jong-Won;Kim, Hyung-Mok
    • Geomechanics and Engineering
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    • 제12권5호
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    • pp.771-783
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    • 2017
  • Using a transparent fracture replica with aperture size and water-cement ratio (w/c), the factors affecting the penetration behavior of rock grouting were investigated through laboratory experiments. In addition, the waterproof efficiency was estimated by the reduction of water outflow through the fractures after the grout curing process. Penetration behavior shows that grout penetration patterns present similarly radial forms in all experimental cases; however, velocity of grout penetration showed clear differences according to the aperture sizes and water-cement ratio. It can be seen that the waterproof efficiency increased as the aperture size and w/c decreased. During grout injection or curing processes, air bubbles formed and bleeding occurred, both of which affected the waterproof ability of the grouting. These two phenomena can significantly prevent the successful performance of rock grouting in field-scale underground spaces, especially at deep depth conditions. Our research can provide a foundation for improving and optimizing the innovative techniques of rock grouting.

Anisotropic Conductive Film (ACF) Prepared from Epoxy/Rubber Resins and Its Fabrication and Reliability for LCD

  • Kim, Jin-Yeol;Kim, Eung-Ryul;Ihm, Dae-Woo
    • Journal of Information Display
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    • 제4권1호
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    • pp.17-23
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    • 2003
  • A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

Strength Modeling of Mechanical Strength of Polyolefin Fiber Reinforced Cementitious Composites

  • Sakthievel, P.B.;Ravichandran, A.;Alagumurthi, N.
    • Journal of Construction Engineering and Project Management
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    • 제4권2호
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    • pp.41-46
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    • 2014
  • RCC consumes large quantities of natural resources like gravel stone and steel, and there is a need to investigate on an innovative material that utilizes limited quantities of natural resources but should have good mechanical strength. This study deals with the experimental investigation of strength evaluation of cementitious composites reinforced with polyolefin fibers from 0% to 2.5% (with interval of 0.5%), namely Polyolefin Fiber Reinforced Cementitious Composites (PL-FRCC) and developing statistical regression models for compressive strength, splitting-tensile strength, flexural strength and impact strength of PL-FRCC. Paired t-tests (for each PL fiber percentage 0 to 2.5%) bring out that there is significant difference in compressive and splitting-tensile strength when curing periods (3, 7, 28 days) are varied. Also, a strong relationship exists between the compressive and flexural strength of PL-FRCC. The proposed mathematical models developed in this study will be helpful to ascertain the mechanical strength of FRCC, especially, when the fiber reinforcing index is varied.

팬 아웃 웨이퍼 레벨 패키징 재배선 적용을 위한 유무기 하이브리드 유전체 연구 (Study of Organic-inorganic Hybrid Dielectric for the use of Redistribution Layers in Fan-out Wafer Level Packaging)

  • 송창민;김사라은경
    • 마이크로전자및패키징학회지
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    • 제25권4호
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    • pp.53-58
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    • 2018
  • 집적회로 소자의 축소가 물리적 한계에 도달 한 이후 3D 패키징, 임베디드 패키징 및 팬 아웃 웨이퍼 레벨 패키징(FOWLP, fan-out wafer level packaging)과 같은 혁신적인 패키징 기술들이 활발히 연구되고 있다. 본 연구에서는 FOWLP의 다층 재배선(redistribution layer)에 사용하기 위한 유무기 하이브리드 유전체 소재의 공정을 평가하였다. 폴리이미드(PI) 또는 폴리파라페닐렌벤조비스옥사졸(PBO)과 같은 현 유기 유전체와 비교하여 폴리실세스키옥산(polysilsesquioxane, PSSQ)라고 불리는 유무기 하이브리드 유전체는 기계적, 열적 및 전기적 안정성을 향상시킬 수 있고, UV 노광을 통하여 경화 공정과 패턴 공정을 동시에 할 수 있는 장점이 있다. 폴리실세스키옥산 용액을 6 인치 Si 웨이퍼에 스핀 코팅한 후 pre-baking과 UV 노광 공정을 이용하여 패턴 및 경화를 진행하였다. 10분의 UV 노광 시간으로 경화와 $2{\mu}m$ 라인 패턴 형성이 동시에 진행됨을 확인하였고, 경화된 폴리실세스키옥산 유전체의 유전상수는 2.0에서 2.4 로 측정되었다. 폴리실세스키옥산 소재를 이용하여 고온 경화 공정없이 UV 노광 공정만으로 경화와 패턴을 할 수 있는 공정 가능성을 보였다.

Micro Bonding Using Hot Melt Adhesives

  • Bohm, Stefan;Hemken, Gregor;Stammen, Elisabeth;Dilger, Klaus
    • 접착 및 계면
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    • 제7권4호
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    • pp.28-31
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    • 2006
  • Due to the miniaturization of MEMS and microelectronics the joining techniques also have to be adjusted. The dosing technology with viscous adhesives does not permit reproducible adhesive volumes, which are clearly under a nano-liter. A nano-liter means however a diameter of bonding area within the range of several 100 micrometers. Additional, viscous adhesives need a certain time, until they are cross linked or cured. The problem especially in the MEMS is the initial strength, since it gives the time, which is needed for joining an individual adhesive joint. The time up to the initial strength is with viscous, also with fast curing systems, within the range of seconds until minutes. Until the reach of the initial strength, the micro part must be fixed/held. Without sufficient adjustment/clamping it can come to a shift of the micro parts. Also existing micro adhesive bonding processes are not batch able, i.e. the individual adhesive joints of a micro system must be processed successively. In the context of the WCARP III 2006 now an innovative method is to be presented, how it is possible to solve the existing problems with micro bonding. i.e. a method is presented, which is batch able, possess a minimum joining geometry with some micrometers and is so fast that no problems with the initial strength arise. It is a method, which could revolutionize the sticking technology in the micro system engineering.

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