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http://dx.doi.org/10.6117/kmeps.2018.25.4.053

Study of Organic-inorganic Hybrid Dielectric for the use of Redistribution Layers in Fan-out Wafer Level Packaging  

Song, Changmin (Graduate school of Nano-IT Design Convergence, Seoul National University of Science and Technology)
Kim, Sarah Eunkyung (Graduate school of Nano-IT Design Convergence, Seoul National University of Science and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.25, no.4, 2018 , pp. 53-58 More about this Journal
Abstract
Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.
Keywords
FOWLP; polysilsesquioxane; Hybrid dielectrics; Redistribution layer; UV curing;
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Times Cited By KSCI : 1  (Citation Analysis)
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