1 |
B. Haskell and C. Lee, in Proc. Nepcon West Conf. (1992), p. 1601
|
2 |
I. Tukagoshi, A. Nakajima, Y. Mikami, S. Mutoh, and Z. Ikezoe, Japan kokai Pat. (open system), S61-78069, (1986)
|
3 |
Y. Yamaguchi and M. Kato, in proc. Nepcon West '91 Proc. Technol. Prog., (1991), p. 220
|
4 |
M.J. Yim and K.W. Paik, IEEE Transactions on Advanced Packaging, 22 (1999)
|
5 |
J. Liu and R. Rogren, J. Electron Manufact., 3, 205 (1993)
DOI
ScienceOn
|
6 |
J. Liu, K. Boustedt, and Z. Lai, in Proc. Tech. Prog., SMI, (1995), p. 102-109
|
7 |
J.J. Crea and P.B. Hogerton, in Proc. Nepcon West '91 Proc. Technol. Prog., (1991), p. 251
|
8 |
I. Tukagoshi, A. Nakajima, Y. Mikami, S. Mutoh, and Z. Ikezoe, Japan kokai Pat. (open system), S62-188184, (1987)
|
9 |
Y. Yamaguchi, I. Tsukagoshi, and A. Nakajima, Jpn. Circuit Technol., 4(7), 362 (1987)
|
10 |
N.R. Basavanhally, D.D. Chang, and B.H. Cranston, in Proc. Electronic Component and Technology Conf., (1992), p.487
|
11 |
D.D. Chang, J.A. Fulton, A.M. Lyons, and J.R. Nis, in Proc. NEPCON West Conf., (1992), p. 1381
|