• Advances in concrete construction
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• v.7 no.4
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• pp.219-229
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• 2019

This paper presents an experimental study on the structural performance of an innovative ultra-high performance fiber reinforced concrete (UHPFRC) deck with coarse aggregate of composite bridge under shear force. Test parameters included curing method and shear span-to-height ratio. Test results indicated that more short fine cracks developed beside the existing cracks due to the randomly dispersed fibers, resulting in re-distributing and homogenizing of the concrete stress beside cracks and allowing for the occurrence of more cracks with small spacing compared to normal strength concrete beams. Curing methods, incorporating steam curing and natural curing, did not have obvious effect on the nominal bending cracking strength and the ultimate strength of the test specimens. Shear reinforcement need not be provided for UHPFRC decks with a fiber volume fraction of 2%. UHPFRC decks showed superior load resistance ability after the appearance of cracks and excellent post-cracking deformability. Lastly, the current shear provisions were evaluated by the test results.

• Food Science of Animal Resources
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• v.43 no.6
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• pp.1087-1110
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• 2023

The growing demand for sustainable food production and the rising consumer preference for fresh, healthy, and safe food products have been driving the need for innovative methods for processing and preserving food. In the meat industry, this demand has led to the development of new interventions aimed at extending the shelf life of meats and its products while maintaining their quality and nutritional value. Cold plasma has recently emerged as a subject of great interest in the meat industry due to its potential to enhance the microbiological safety of meat and its products. This review discusses the latest research on the possible application of cold plasma in the meat processing industry, considering its effects on various quality attributes and its potential for meat preservation and enhancement. In this regard, many studies have reported substantial antimicrobial efficacy of cold plasma technology in beef, pork, lamb and chicken, and their products with negligible changes in their physicochemical attributes. Further, the application of cold plasma in meat processing has shown promising results as a potential novel curing agent for cured meat products. Understanding the mechanisms of action and the interactions between cold plasma and food ingredients is crucial for further exploring the potential of this technology in the meat industry, ultimately leading to the development of safe and high-quality meat products using cold plasma technology.

• Computers and Concrete
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• v.33 no.2
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• pp.205-216
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• 2024

Self-Curing Self Compacting Concrete (SCSCC), is a special concrete in contemporary construction practice aimed at enhancing the performance of structural concrete. Its primary function is to ensure a sufficient moisture supply that facilitates hydration along with flow, particularly in the context of high-rise buildings and tall structures. This innovative concrete addresses the challenges of maintaining adequate curing conditions in large-scale projects, maintaining requisite workability, contributing to the overall durability and longevity of concrete structures. For implementing such a versatile material in construction, it is imperative to understand the stress-strain (S-S) behaviour. The primary aim of this study is to develop the S-S curves for TCSCSCC and compare through experimental results. Finite element (FE) analysis based ATENA-GiD was employed for the numerical simulation and develop the analytical stress-strain curves by introducing parameters viz., grade of concrete, tie diameter, tie spacing and yield strength. The stress ratio and the strain ratios are evaluated and compared with experimental values. The mean error is 1.2% with respect to stresses and 2.2% in case of strain. Finally, the stress block parameters for tie confined SCSCC are evaluated and equations are proposed for the same in terms of confinement index.

• Journal of the Korea Institute of Building Construction
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• v.16 no.6
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• pp.529-534
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• 2016

Calcium silicate inorganic insulating material is a porous material which is made of 90 wt% of cement. Unlike existing inorganic insulation materials, it is produced without high temperature curing process and also it costs much less than existing inorganic insulation materials. It is an innovative insulation material that supplemented disadvantages of conventional inorganic insulation material. Researches and developments about inorganic insulation materials have been actively researched abroad. Calcium silicate insulation has $0.13g/cm^3$ of specific gravity. Its heat conductivity is under 0.050W/mK, which it similar to conventional inorganic insulation. However, it has weak compressive strength compared to other inorganic insulation. The point of this research is to manifest that calcium silicate inorganic insulating material can have certain compressive strength after curing process with high insulating performance and to find out the proper curing methods and period.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.1
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• pp.65-72
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• 2017

The goal of this paper is to investigate the effects of out-of-plane deposition angle on product characteristics of a UV photo-curing process. Specimens are manufactured from a commercialized UV photo-curing machine, the NOBEL V1.0. The influence of the out-of-plane deposition angle of the specimen on surface characteristics, including morphology of the sloped surface, pick-to-pick distance of convex region, and roughness of the sloped surface, is examined via the observation of the sloped surface. In addition, the influence of the radius of curvature of the specimen on the surface roughness of the sloped surface is evaluated. The effects of the out-of-plane deposition angle on impact strength of specimens are investigated via Izod impact experiments. Finally, we discuss the influence of the out-of-plane deposition angle on failure characteristics of specimens for impact loads.

• Geomechanics and Engineering
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• v.12 no.5
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• pp.771-783
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• 2017

Using a transparent fracture replica with aperture size and water-cement ratio (w/c), the factors affecting the penetration behavior of rock grouting were investigated through laboratory experiments. In addition, the waterproof efficiency was estimated by the reduction of water outflow through the fractures after the grout curing process. Penetration behavior shows that grout penetration patterns present similarly radial forms in all experimental cases; however, velocity of grout penetration showed clear differences according to the aperture sizes and water-cement ratio. It can be seen that the waterproof efficiency increased as the aperture size and w/c decreased. During grout injection or curing processes, air bubbles formed and bleeding occurred, both of which affected the waterproof ability of the grouting. These two phenomena can significantly prevent the successful performance of rock grouting in field-scale underground spaces, especially at deep depth conditions. Our research can provide a foundation for improving and optimizing the innovative techniques of rock grouting.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Journal of Construction Engineering and Project Management
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• v.4 no.2
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• pp.41-46
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• 2014

RCC consumes large quantities of natural resources like gravel stone and steel, and there is a need to investigate on an innovative material that utilizes limited quantities of natural resources but should have good mechanical strength. This study deals with the experimental investigation of strength evaluation of cementitious composites reinforced with polyolefin fibers from 0% to 2.5% (with interval of 0.5%), namely Polyolefin Fiber Reinforced Cementitious Composites (PL-FRCC) and developing statistical regression models for compressive strength, splitting-tensile strength, flexural strength and impact strength of PL-FRCC. Paired t-tests (for each PL fiber percentage 0 to 2.5%) bring out that there is significant difference in compressive and splitting-tensile strength when curing periods (3, 7, 28 days) are varied. Also, a strong relationship exists between the compressive and flexural strength of PL-FRCC. The proposed mathematical models developed in this study will be helpful to ascertain the mechanical strength of FRCC, especially, when the fiber reinforcing index is varied.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.53-58
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• 2018

Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.28-31
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• 2006

Due to the miniaturization of MEMS and microelectronics the joining techniques also have to be adjusted. The dosing technology with viscous adhesives does not permit reproducible adhesive volumes, which are clearly under a nano-liter. A nano-liter means however a diameter of bonding area within the range of several 100 micrometers. Additional, viscous adhesives need a certain time, until they are cross linked or cured. The problem especially in the MEMS is the initial strength, since it gives the time, which is needed for joining an individual adhesive joint. The time up to the initial strength is with viscous, also with fast curing systems, within the range of seconds until minutes. Until the reach of the initial strength, the micro part must be fixed/held. Without sufficient adjustment/clamping it can come to a shift of the micro parts. Also existing micro adhesive bonding processes are not batch able, i.e. the individual adhesive joints of a micro system must be processed successively. In the context of the WCARP III 2006 now an innovative method is to be presented, how it is possible to solve the existing problems with micro bonding. i.e. a method is presented, which is batch able, possess a minimum joining geometry with some micrometers and is so fast that no problems with the initial strength arise. It is a method, which could revolutionize the sticking technology in the micro system engineering.