• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.5
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• pp.333-338
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• 1999

Thin film inductors of $10 mm \times 10 mm$ with inner coil type of 14 turns were fabricated by sputtering, photo-masking, and etching processes. Their characteristics of impedances and annealing after were investigated. The properties of impedances of the thin film magnetic core inductors with inner coil type were improved by magnetic field annealing due to the removal of residual stress and the improvement magnetic properties of magnetic films. But the characteristics of frequency of the thin film magnetic core inductors were not improved by magnetic field annealing due to properties of the spiral pattern and inner coil type. The thin film magnetic core inductor annealed by uniaxal field annealing method showed an inductance of 1000 nH and resistance of$ 6 \Omega$ of 1 at 2 MHz.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1301-1302
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• 2006

In this paper, embedded spiral inductors are investigated into the PCB substrate for low cost RF SOP applications. The spiral inductors designed with geometrical variations were simulated, fabricated, measured, and characterized by using 3D EM simulator, 8 layered PCB standard process and HP 8510B network analyzer (or verifying their applicability. The fabricated embedded spiral inductor has inductance of 9.4 nH at 800MHz, maximum quality factor of 64.8 at 1.09GHz and self resonant frequency of 3.93GHz, respectively. As the measured inductances and quality factors are well matched with simulated ones. PCB embedded spiral inductors are promising for advanced electronic systems with various functionality, low cost, small size and volume.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.10
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• pp.17-24
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• 2000

An area efficient and symmetric dual-level spiral inductor structure is proposed and evaluated in comparison with the conventional single-level spiral inductors. Contrary to the dual-level inductor mutual coupling coefficient of the upper-and lower-level inductors of the dual-level inductor increases with the increases in the number of turns. Because of this, for the same silicon area, the inductances of the dual-level incuctors are 2.5-4 times higher than that of the single-level inductor. Furthermore, the dual-level showed better quality factor that the single-level inductors for the same inductance. It is the intention of this paper to demonstrate that the dual-level can be more useful for the RF integrated circuits than the conventional single-level spiral inductors form the aspects of area efficiency and quality factor. The proposed dual-level inductors are designed and confirmed to be perfectly symmetric, and can also be used as a high-frequency choke.

• Journal of IKEEE
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• v.11 no.4
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• pp.145-151
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• 2007

In this work, small-size, high-performance solenoid-type RF chip inductors utilizing a low-loss ${Al_2}{O_3}$ core material were investigated. The size of the chip inductors fabricated in this work were $0.86{\times}0.46{\times}0.45m^3$, $1.5{\times}1.0{\times}0.7m^3$, $2.1{\times}1.5{\times}1.0m^3$, and $2.4{\times}2.0{\times}1.4m^3$ and copper (Cu) wire with $27{\sim}40{\mu}m$ diameter was used as the coils. High frequency characteristics of the inductance, quality factor, and impedance of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). It was observed that the developed inductors with the number of turns of 7 have the inductance of 13 to 100nH and exhibit the self-resonant frequency (SRF) of 6.4 to 1.1GHz. The SRF of inductors decreases with increasing the inductance and the inductors have the quality factor of 50 to 80 in the frequency range of 300MHz to 1.3GHz. In this study, small-size solenoid-type RF chip inductors with high inductance and high quality factor were fabricated successfully.

• Proceedings of the KIPE Conference
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• 2000.07a
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• pp.472-475
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• 2000

An balanced tapped inductors using RPPT (Regulated Peak Power Tracking) system is proposed. In the series/parallel PPT system battery charger and discharger are operating complementary. So they both can be combined into a single hardware block. Battery charger and dis-charger share same magnetic cores thus can be reduced core weights.

• Journal of Electrical Engineering and Technology
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• v.12 no.6
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• pp.2247-2255
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• 2017

Because the on-board charger (OBC) is installed in electric vehicles (EVs), high power density is regarded as a key technology. Among components of the OBC, inductors occupy more than 30% of the total volume. Thus, it is important to reduce the volume and the weight of inductors while maintaining thermal stability. Discontinuous conduction mode (DCM) can satisfy these requirements; however, only a few studies have adopted the DCM operation for OBCs because of the large inductor current ripple. In this paper, a design process is proposed for application of the DCM operation to OBCs. In order to analyze the inductor losses accurately, a numerical formula for the inductor current ripple is deduced based on a detailed analysis. Two inductors are fabricated using several ferrite cores and powder cores taking into consideration the inductor size, inductor losses, and temperature rise. In order to verify the analysis and design process, experimental results are presented that show that the designed inductors satisfy the requirements of the OBCs.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.1
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• pp.74-83
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• 2001

In this study, the optimum structure of a magnetic thin film inductor was designed for application of DC-DC converters. The Ni$\sub$81/Fe$\sub$19/ (at%) alloy was selected as a high-frequency($\geq$MHz) magnetic thin film magnetron sputtering system. As-deposited NiFe thin films show similar magnetic properties compared to bulk NiFe alloys, indicating that they have a good film quality. The optimum design of dolenoid-type magnetic thin film inductors was performed utilizing a Maxwell computer simulator (Ansoftt HFSS V7.0 for PC) and parameters obtained from the magnetic properties of magnetic core materials selected. The high-frequency characteristics of the inductance(L) and quality factor(Q) obtained for the designed inductors through simulation agreed well with those obtained by theoretical calculations, confirming that the simulated result is realistic. The optimum structure of high-performance (Q$\geq$60, L = 1${\mu}$H, efficiency $\geq$90%), high-frequency ($\geq$5MHz), and solenoid-type magnetic thin film inductors was designed successfully.

• Journal of international Conference on Electrical Machines and Systems
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• v.2 no.1
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• pp.57-64
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• 2013

The functional characteristic of LISN circuit, which is used for measurements of conductive noise in mains power line, is basically related to frequency characteristics of passive elements like inductors used in the circuit as well as the frequency response of inductors is highly related to the resins used in the varnishing process. The significant problem in determination of an inductor's frequency characteristic is the intrinsic resistance, inductance and parasitic capacitance. In this triplet, the parasitic capacitance is the major limiting factor of inductor's frequency range. This capacitance depends on inductor design parameters and materials filling the spaces of coil like resin and its coherency after curing process. In this paper, two similar inductors were designed and built. The first inductor was not varnished while the second one was varnished with VPI technology. VPI, or Vacuum, Pressure, Impregnation technology is one of the most reliable methods performing good insulating conditions for electrical circuits and windings based on resins. The measured results show that implying varnishing technology does not significantly affect the frequency response. However, due to mechanical solidity aspects and improved environmental protection, it is better to varnish the inductors.

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.203-207
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• 1999

In this paper we report new integration technology developed for three-dimensional metallic microstructures in an arbitrary shape. We have developed the two fabrication methods: Multi-Exposure and Single-Development (MESD) and Sacrificial Metallic Mold(SMM) techniques. Three-dimensional photoresist mold can be formed by the MESD method while unlimited number of structural levels can be realized by the SMM technique. Using these two techniques we have fabricated solenoid inductors and levitated spiral inductors for RF applications. We have achieved peak Q- factors over 40 in the 2-10㎓ range, the highest number among the inductors reported to date. Finally, we propose "On-Chip Passives" as a post IC process for monolithic integration of inductors, tunable capacitors, microwave switches, transmission lines, and mixers and filters toward future single-chip transceiver integration.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.19 no.7
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• pp.1296-1303
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• 1994

In this paper, a design of active inductors and their application in a frequency converter are proposed. In MMIC design, passive spiral inductor takes larger area than any other passive and active elements. A conventional spiral inductor generates undesired crosstalk, and its performance cannot have certainty and reproducibility. Meanwhile the active inductor eliminates these drawbacks, and operates for much wider bandwidth. Furthermore, its size is smaller and nearly independent of inductance. the performance of MMIC frequency converter with active inductors is directly compared with that of the frequency converters with spiral inductors. The size is 28.6% smaller with better performance in MMIC frequency converter.